MC9S12GC32MFAE vs MC9S12GC96MFUE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12GC32MFAE disebabkan oleh NXP Semiconductors dan MC9S12GC96MFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12GC32MFAE MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE Nrnd
NXP Semiconductors
MC9S12GC96MFUE MC9S12GC96MFUE - 16-Bit HCS12 MCU, 96KB Flash, 80-QFP | NXP

MC9S12GC96MFUE - 16-Bit HCS12 MCU, 96KB Flash, 80-QFP | NXP

MC9S12GC96MFUE ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12GC32MFAE MC9S12GC96MFUE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core HCS12 (16-bit) —
CPU Family S12GC —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 2 KB —
EEPROM 1 KB —
Maximum Bus Clock 25 MHz (50 MHz core via PLL) —
Tegangan Pemberi Arus 2.97 V to 5.5 V 2.35 V to 2.75 V
Internal Voltage Regulator On-chip bandgap Vreg (2.5 V core) —
ADC 10-bit 10-bit, 8-channel (per family datasheet)
PWM / Timer Channels 8 channels —
SCI (UART) Up to 2 —
SPI 1 —
GPIO Up to 60 —
Debug Interface BDM (single-wire background debug) —
Kemasan 48-LQFP (7x7 mm) —
Suhu Operasi [DATA_NEEDED: operating temperature grade] -40 C to +125 C (M suffix)
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Jenis Pemasangan Surface Mount Surface Mount
Core Architecture — HCS12 (16-bit CISC)
Program Memory Type — Flash
Program Memory Size — 96 KB (96K x 8)
Bus Clock Speed — 25 MHz
Core Clock Speed — 50 MHz (max)
Lebar Bus Data — 16-bit
I/O Ports — 60
Package Type — QFP-80 (14x14 mm), plastic
On-chip Debug — BDM (single-wire)
Lead Free — Yes

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