MC9S12XDT512MAL vs MC9S12XDP512VAL Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12XDT512MAL disebabkan oleh NXP Semiconductors dan MC9S12XDP512VAL disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12XDP512VAL MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12XDT512MAL MC9S12XDP512VAL
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core Processor HCS12X HCS12X
Core Size 16-bit —
Core Architecture CISC 16-bit CISC
Maximum CPU Speed 80 MHz —
Program Memory 512 KB Flash —
RAM 20 KB —
Tegangan Pemberi Arus 2.5 V / 5 V 2.35 V to 2.75 V
Connectivity CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI —
Peripherals LVD, POR, PWM, WDT —
Number of I/O [DATA_NEEDED: number of I/O pins] —
ADC 8/10-bit (channels [DATA_NEEDED]) 8/10-bit ATD (S12ATD10B8CV3)
Package Type 112-LQFP (20x20 mm) 112-pin LQFP (20 x 20 mm)
Jenis Pemasangan Surface Mount Surface Mount
Suhu Operasi -40C to +125C [DATA_NEEDED: automotive -40C to +105C or -40C to +125C grade]
Series MC9S12 / S12XD —
Process Technology TSMC3 (automotive qualified) —
Boundary-Scan Debug BDM + JTAG/Nexus —
Status RoHS [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS compliance]
Lifecycle NRND (Not Recommended for New Designs) —
Maximum CPU Frequency — 80 MHz
Program Memory Size — 512 KB (512K x 8) Flash
RAM Size — [DATA_NEEDED: RAM size in KB]
EEPROM Size — [DATA_NEEDED: EEPROM emulation size]
I/O Pins — 119
CAN Modules — Multiple MSCAN (CAN 2.0A/B)
Co-processor — XGATE
Instruction Set Compatibility — Upward-compatible with HCS12
ROM Type — Flash
Status Lingkungan Hidup — Active

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