MPC8270CVRMIBA vs MPC8272CZQMIBA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8270CVRMIBA disebabkan oleh NXP Semiconductors dan MPC8272CZQMIBA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ Akhir HayatNXP Semiconductors
MPC8272CZQMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8272CZQMIBA ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC8270CVRMIBA | MPC8272CZQMIBA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | — |
| Lebar Bus Data | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | — |
| Series | PowerQUICC II (MPC82xx) | — |
| Suhu Operasi | -40 C to +105 C | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| Aras MSL | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Status RoHS | Lead-Free / Compliant (per package marking) | [DATA_NEEDED: RoHS status] |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Core Architecture | — | PowerPC G2_LE |
| Core Family | — | PowerQUICC II (MPC82xx) |
| Core Frequency | — | 266 MHz |
| Instruction Set | — | Power Architecture (PowerPC) |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Internal Core Voltage | — | 1.5 V to 1.8 V |
| Kemasan | — | 516-PBGA (TEPBGA, 27x27 mm) |
| Gambaran Suhu Operasi | — | -40 °C to +105 °C (industrial) |
| On-chip Connectivity | — | PCI 2.2, USB 1.1, UTOPIA-II, dual Fast Ethernet MACs (via CPM) |
| Communications Processor Module | — | Yes (CPM) |
| Hardware Security Engine (SEC) | — | Yes |
| External Bus | — | 60x bus + 32-bit local bus with SDRAM controller |
| Process Technology | — | 0.13 µm CMOS |
| Tray Standard Pack Quantity | — | [DATA_NEEDED: tray qty] |