MPC855TCZQ50D4 vs MPC860TCZQ50D4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC855TCZQ50D4 disebabkan oleh NXP Semiconductors dan MPC860TCZQ50D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC855TCZQ50D4 MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC855TCZQ50D4 ✗ Akhir Hayat
NXP Semiconductors
MPC860TCZQ50D4 MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP

MPC860TCZQ50D4 ✗ Akhir Hayat

Pengandingan Spesifikasi

Parametr MPC855TCZQ50D4 MPC860TCZQ50D4
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Akhir Hidup
Manufacturer NXP Semiconductors (formerly Freescale / Motorola) NXP Semiconductors (formerly Freescale)
Product Type Microprocessor (MPU) —
Processor Family PowerQUICC MPC8xx / PowerPC —
Core Architecture 32-bit PowerPC with integrated CPM (Communications Processor Module) PowerPC
Core Clock Speed 50 MHz 50 MHz
Number of Cores 1 —
Lebar Bus Data 32-bit —
Tegangan Pemberi Arus 3.3 V —
Suhu Operasi -40C to +95C -40C to +95C (industrial)
Kemasan / Case 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm —
Jenis Pemasangan Surface Mount Surface Mount
Integrated Peripherals Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI —
On-chip Memory Controller Yes (SDRAM, DRAM, SRAM, Flash support) —
Packaging Tray —
Lead Free Status Contains Lead —
Status RoHS Non-Compliant (legacy BGA contains lead) Non-Compliant (per NXP product page / DigiChip datasheet)
Process Technology 0.32 um CMOS 0.32 um CMOS (per FindIC description)
Part Number — MPC860TCZQ50D4
Family — PowerQUICC / MPC8xx
Core — MPC8xx - 1 core, 32-bit
Instruction / Data Cache — 4 KB / 4 KB (unified 8KB figure variant-dependent)
Tegangan Pemberi Arus Operasi — 2 V to 3.6 V (per FindIC comparison page)
Kemasan — 357-PBGA (25x25 mm), ZQ suffix
Lead-Free — Contains lead (ZQ denotes tin-lead ball finish)
CPM (Communications Processor Module) — Integrated - HDLC, UART, Ethernet 10 Mbps support
DMA Channels — 4
Memory Controller — Up to 256 MB DRAM with page mode support
Status Lingkungan Hidup — End of Life (NXP Last Time Buy window passed)

Laporan Datasheet & Sumber

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