MPC855TCZQ50D4 vs MPC860TCZQ50D4 比較
詳細並排比較 MPC855TCZQ50D4 由 NXP Semiconductors 與 MPC860TCZQ50D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC855TCZQ50D4 | MPC860TCZQ50D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 停產終止 |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | NXP Semiconductors (formerly Freescale) |
| Product Type | Microprocessor (MPU) | — |
| Processor Family | PowerQUICC MPC8xx / PowerPC | — |
| Core Architecture | 32-bit PowerPC with integrated CPM (Communications Processor Module) | PowerPC |
| Core Clock Speed | 50 MHz | 50 MHz |
| Number of Cores | 1 | — |
| 資料匯流排寬度 | 32-bit | — |
| 供應電壓 | 3.3 V | — |
| 工作溫度 | -40C to +95C | -40C to +95C (industrial) |
| 封裝 / 外殼 | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Integrated Peripherals | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI | — |
| On-chip Memory Controller | Yes (SDRAM, DRAM, SRAM, Flash support) | — |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead | — |
| RoHS 狀態 | Non-Compliant (legacy BGA contains lead) | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS (per FindIC description) |
| Part Number | — | MPC860TCZQ50D4 |
| Family | — | PowerQUICC / MPC8xx |
| Core | — | MPC8xx - 1 core, 32-bit |
| Instruction / Data Cache | — | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| 工作電源電壓 | — | 2 V to 3.6 V (per FindIC comparison page) |
| 封裝 | — | 357-PBGA (25x25 mm), ZQ suffix |
| Lead-Free | — | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | — | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | — | 4 |
| Memory Controller | — | Up to 256 MB DRAM with page mode support |
| 生命週期狀態 | — | End of Life (NXP Last Time Buy window passed) |