MPC860ENCVR50D4 vs MPC860PCZQ50D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860ENCVR50D4 disebabkan oleh NXP Semiconductors dan MPC860PCZQ50D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC860ENCVR50D4 | MPC860PCZQ50D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Processor Type | MPU PowerQUICC MPC8xx | MPC8xx PowerQUICC 32-Bit MPU |
| Core Architecture | 32-Bit PowerPC | PowerPC 603 (32-bit, no FPU) |
| Core Count | 1 | — |
| Frekuensi Klock Maksimum | 50 MHz | — |
| Tegangan Pemberi Arus Operasi | 3.3 V | — |
| Process Technology | 0.32 um CMOS | 0.32 micron CMOS |
| Kemasan / Case | 357-BBGA (PBGA, 25 x 25 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Instruction Cache | 4 KB | 4 Kbyte |
| Data Cache | 4 KB | 4 Kbyte |
| On-chip Peripherals | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC | — |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | Non-Compliant (contains lead) |
| Series | MPC8xx PowerQUICC | — |
| Gambaran Suhu Operasi | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial, 'PC' suffix) |
| Core Frequency | — | 50 MHz |
| Number of Cores | — | 1 (CPU + CPM RISC engine) |
| Operating Voltage - I/O | — | 3.3 V |
| Internal Core Voltage | — | 2.2 V or 1.8 V (selection required) |
| MMU | — | Yes (32-bit virtual addressing) |
| On-chip Ethernet MAC | — | 2x 10/100 Mbps (MII interface) |
| Kemasan | — | 357-PBGA (25x25 mm) |
| Lead Status | — | Contains Lead |
| Status Lingkungan Hidup | — | End of Life |