MPC860SRVR66D4 vs MPC855TVR66D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860SRVR66D4 disebabkan oleh NXP Semiconductors dan MPC855TVR66D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Bahagian terakhir untuk beliNXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MPC860SRVR66D4 | MPC855TVR66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Akhir Hidup |
| Processor Type | MPC8xx PowerQUICC | — |
| Core Architecture | PowerPC 32-bit | — |
| Number of Cores | 1 | — |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | — |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes | — |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Suhu Operasi | -40C to +95C | 0 °C to +95 °C |
| Kemasan / Case | 357-PBGA (25 mm x 25 mm) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (single core) |
| Lebar Bus Data | — | 32 bit |
| Frekuensi Klock Maksimum | — | 66 MHz |
| Process Technology | — | 0.32 µm |
| Kemasan | — | 357-PBGA (25x25 mm) |
| Ethernet Support | — | Fast Ethernet (100 Mbps) |
| Communication Interfaces | — | ENET, ATM, HDLC, PCMCIA |
| Communication Processor Module | — | Yes (CPM, dedicated RISC engine) |
| Kategori | — | Microprocessors (MPU) |
| Tray Packaging | — | Tray |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |