MPC860TVR50D4 vs MPC860TVR80D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860TVR50D4 disebabkan oleh NXP Semiconductors dan MPC860TVR80D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC860TVR50D4 | MPC860TVR80D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Akhir Hidup |
| Core Architecture | PowerPC 32-bit | PowerPC + CPM (RISC communications processor) |
| Core Count | 1 | — |
| Frekuensi Klock Maksimum | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Kemasan / Case | 357-PBGA (25x25 mm) | 357-BGA (PBGA 25x25 mm) |
| Process Technology | 0.32 µm CMOS | 0.32 micrometer CMOS |
| Instruction Cache | 4 Kbyte | 4 KB |
| Data Cache | 4 Kbyte | 4 KB |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | DRAM, SRAM, Flash, EDO support |
| Gambaran Suhu Operasi | -40°C to +95°C | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | MPC8xx PowerQUICC | — |
| Status RoHS | [DATA_NEEDED: rohs compliance] | RoHS Compliant |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit RISC |
| Core Frequency | — | 80 MHz |
| Operating Voltage | — | 3.3 V |
| Communication Controllers | — | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| Number of Cores | — | 1 |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |