MSC8156HAG1000B vs MSC8256SVT1000B Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MSC8156HAG1000B disebabkan oleh NXP Semiconductors dan MSC8256SVT1000B disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP
MSC8256SVT1000B ObsoletePengandingan Spesifikasi
| Parametr | MSC8156HAG1000B | MSC8256SVT1000B |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Product Type | Multi-core Digital Signal Processor (DSP) | — |
| DSP Cores | 6 x StarCore SC3850 | — |
| Core Clock Frequency | 1 GHz per core | — |
| On-chip RAM | 576 KB (L1/L2 SRAM) | — |
| On-chip ROM | 96 KB | — |
| Hardware Accelerator | MAPLE-B (turbo/Viterbi FEC) | — |
| External Memory Interface | DDR2/DDR3 with ECC | — |
| High-speed Serial Fabric | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 | — |
| Ethernet | 2 x Gigabit Ethernet (SGMII/RGMII) | — |
| Queuing Engine | Yes (QE for packet/traffic management) | — |
| Peripheral Interfaces | SPI, I2C, UART, PCI | I2C, SPI, UART, GPIO |
| Process Technology | CMOS | — |
| Kemasan | 783-ball FCBGA (FCP-BGA), 29 x 29 mm | 783-FCBGA (29x29 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | 0C to +105C | -40C to +105C (industrial) |
| Peak Reflow Temperature | 245C (JEDEC J-STD-020) | — |
| Terminal Finish | Tin Silver Copper (e1 per JESD-609) | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Status RoHS | Compliant (per distributor datasheet listing) | [DATA_NEEDED: RoHS status] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | StarCore MSC8256 |
| Type | — | SC3850 Six-Core Digital Signal Processor |
| Core Architecture | — | StarCore SC3850 (VLE, 4-issue) |
| Number of Cores | — | 6 |
| Core Clock Speed | — | 1 GHz |
| Aggregate Throughput | — | 1000 MIPS per core (6000 MIPS total) |
| Data Width | — | 32-bit / 64-bit |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Unified L2 Cache (per core) | — | 512 KB (configurable to M2 memory in 64 KB increments) |
| On-Chip RAM (total) | — | 576 KB |
| Non-Volatile Memory (ROM) | — | 96 KB |
| MMU | — | Yes (hardware memory management unit) |
| EPIC (Interrupt Controller) | — | Yes (Extended Programmable Interrupt Controller) |
| Timers (per core) | — | 2 x 32-bit general-purpose |
| DDR Memory Controller | — | DDR2/DDR3 with ECC |
| High-Speed Interfaces | — | Serial RapidIO, PCI Express, SGMII, RGMII |
| Security Engine | — | SEC (cryptographic acceleration) |