MSC8156HAG1000B vs MSC8256SVT1000B Karşılaştırma

Ayrıntılı yan yana karşılaştırma MSC8156HAG1000B tarafından NXP Semiconductors ve MSC8256SVT1000B tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MSC8156HAG1000B MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP

MSC8156HAG1000B ✓ Aktif
NXP Semiconductors
MSC8256SVT1000B MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B - SC3850 6-Core DSP, 1GHz, 783-FCBGA | NXP

MSC8256SVT1000B Obsolete

Özellik Karşılaştırması

Parametre MSC8156HAG1000B MSC8256SVT1000B
Marka NXP Semiconductors NXP Semiconductors
Kategori DSP DSP
Yaşam Döngüsü Durumu Aktif Obsolete
Product Type Multi-core Digital Signal Processor (DSP) —
DSP Cores 6 x StarCore SC3850 —
Core Clock Frequency 1 GHz per core —
On-chip RAM 576 KB (L1/L2 SRAM) —
On-chip ROM 96 KB —
Hardware Accelerator MAPLE-B (turbo/Viterbi FEC) —
External Memory Interface DDR2/DDR3 with ECC —
High-speed Serial Fabric 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 —
Ethernet 2 x Gigabit Ethernet (SGMII/RGMII) —
Queuing Engine Yes (QE for packet/traffic management) —
Peripheral Interfaces SPI, I2C, UART, PCI I2C, SPI, UART, GPIO
Process Technology CMOS —
Paket 783-ball FCBGA (FCP-BGA), 29 x 29 mm 783-FCBGA (29x29 mm)
Montaj Türü Surface Mount Surface Mount (BGA)
İşletim Sıcaklığı 0C to +105C -40C to +105C (industrial)
Peak Reflow Temperature 245C (JEDEC J-STD-020) —
Terminal Finish Tin Silver Copper (e1 per JESD-609) —
MSL Seviyesi [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
RoHS Durumu Compliant (per distributor datasheet listing) [DATA_NEEDED: RoHS status]
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — StarCore MSC8256
Type — SC3850 Six-Core Digital Signal Processor
Core Architecture — StarCore SC3850 (VLE, 4-issue)
Number of Cores — 6
Core Clock Speed — 1 GHz
Aggregate Throughput — 1000 MIPS per core (6000 MIPS total)
Data Width — 32-bit / 64-bit
L1 Instruction Cache (per core) — 32 KB
L1 Data Cache (per core) — 32 KB
Unified L2 Cache (per core) — 512 KB (configurable to M2 memory in 64 KB increments)
On-Chip RAM (total) — 576 KB
Non-Volatile Memory (ROM) — 96 KB
MMU — Yes (hardware memory management unit)
EPIC (Interrupt Controller) — Yes (Extended Programmable Interrupt Controller)
Timers (per core) — 2 x 32-bit general-purpose
DDR Memory Controller — DDR2/DDR3 with ECC
High-Speed Interfaces — Serial RapidIO, PCI Express, SGMII, RGMII
Security Engine — SEC (cryptographic acceleration)

Dökümanlar & Kaynaklar

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