MSC8157ESVT1000A vs MSC8156ESAG1000B Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MSC8157ESVT1000A disebabkan oleh NXP Semiconductors dan MSC8156ESAG1000B disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoleteNXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ Akhir HayatPengandingan Spesifikasi
| Parametr | MSC8157ESVT1000A | MSC8156ESAG1000B |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Obsolete | Akhir Hidup |
| Product Type | Multi-core Digital Signal Processor (DSP) | — |
| DSP Core Architecture | StarCore SC3850 (Six cores) | — |
| Core Clock Speed | 1 GHz | — |
| Performance | 1000 MIPS per core / 6000 MIPS aggregate | — |
| Lebar Bus Data | 32-Bit / 64-Bit | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Package Type | FCBGA-783 (Flip-Chip BGA, 29x29 mm) | — |
| Pin/Ball Count | 783 | — |
| Tegangan Pemberi Arus | 1.0 V core (typical) | [DATA_NEEDED: core and I/O rail voltages] |
| Suhu Operasi | 0C to +105C | 0C to +105C |
| Process Technology | CMOS | 45 nm CMOS |
| Jenis Pemasangan | Surface Mount (FCBGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free) | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| High-Speed Interfaces | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART | — |
| Memory Controller | Multi-channel DDR SDRAM controller | 64-bit DDR2/DDR3, up to 800 MT/s |
| Status Lingkungan Hidup | Obsolete (stock available from authorized distributors) | End of Life (per NXP PCN) |
| DSP Cores | — | 6x SC3850 StarCore cores |
| Core Clock Frequency | — | 1 GHz per core |
| Aggregate Performance | — | [DATA_NEEDED: aggregate MMACS rating] |
| Hardware Accelerator | — | MAPLE-B baseband accelerator (turbo decode) |
| SerDes Lanes | — | 2 lanes, SRIO or PCIe (selectable) |
| Ethernet | — | 1x Gigabit Ethernet MAC |
| Packet Engine | — | QUICC Engine subsystem |
| Security Engine | — | SEC 4.0 (Cryptographic accelerator) |
| Kemasan | — | 783-ball FCBGA (29x29 mm) |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance] |