OSD3358-512M-BAS vs OSD3358-512M-BAS-XB Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci OSD3358-512M-BAS disebabkan oleh Octavo Systems dan OSD3358-512M-BAS-XB disebabkan oleh Octavo Systems. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Octavo Systems
OSD3358-512M-BAS-XB OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB ✓ Aktif

Pengandingan Spesifikasi

Parametr OSD3358-512M-BAS OSD3358-512M-BAS-XB
Merek Octavo Systems Octavo Systems
Kategori DSP Microcontrollers
Status Lingkungan Hidup Aktif Aktif
Processor Core Texas Instruments AM3358 ARM Cortex-A8 —
Maximum CPU Clock 1 GHz 1 GHz
SIMD Engine NEON SIMD —
Graphics Accelerator SGX530 SGX530
On-package DRAM 512 MB DDR3 —
On-package PMIC TPS65217C integrated —
Package Type 400-ball BGA —
Package Size 20 mm x 20 mm (BGA), 1 mm pitch —
Pin Compatibility Superset of TI AM3358 ZCZ 18x18 BGA —
Ethernet 2x 10/100/1000 MAC (external PHY required) 10/100/1000 Mbps (Gigabit)
USB Ports 2x USB 2.0 (host), 1x USB 2.0 (client/OTG) —
Industrial Communication 2x PRU-ICSS —
Suhu Operasi -40C to +85C (industrial) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Aras MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant Compliant
Device Type — System-In-Package (SiP)
Integrated Processor — TI Sitara AM3358 ARM Cortex-A8
Onboard DDR3 SDRAM — 512 MB
Power Management IC — TPS65217C (integrated)
Gambaran Suhu Operasi — -40 C to +85 C (industrial)
Kemasan — 400-ball BGA
PRU-ICSS Subsystems — 2 (industrial-grade)
USB — USB 2.0 High-Speed PHY
CAN — 2x CAN 2.0B
SPI — 2x SPI
I2C — 3x I2C

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