OSD3358-512M-BAS vs OSD3358-512M-BAS-XB 比較

詳細並排比較 OSD3358-512M-BAS 由 Octavo Systems 與 OSD3358-512M-BAS-XB 由 Octavo Systems. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Octavo Systems
OSD3358-512M-BAS OSD3358-512M-BAS - AM3358 SiP 1GHz Cortex-A8 512MB DDR3 | Octavo Systems

OSD3358-512M-BAS - AM3358 SiP 1GHz Cortex-A8 512MB DDR3 | Octavo Systems

OSD3358-512M-BAS ✓ 啟用中
Octavo Systems
OSD3358-512M-BAS-XB OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems

OSD3358-512M-BAS-XB ✓ 啟用中

規格比較

參數 OSD3358-512M-BAS OSD3358-512M-BAS-XB
品牌 Octavo Systems Octavo Systems
類別 DSP Microcontrollers
生命週期狀態 啟用中 啟用中
Processor Core Texas Instruments AM3358 ARM Cortex-A8 —
Maximum CPU Clock 1 GHz 1 GHz
SIMD Engine NEON SIMD —
Graphics Accelerator SGX530 SGX530
On-package DRAM 512 MB DDR3 —
On-package PMIC TPS65217C integrated —
Package Type 400-ball BGA —
Package Size 20 mm x 20 mm (BGA), 1 mm pitch —
Pin Compatibility Superset of TI AM3358 ZCZ 18x18 BGA —
Ethernet 2x 10/100/1000 MAC (external PHY required) 10/100/1000 Mbps (Gigabit)
USB Ports 2x USB 2.0 (host), 1x USB 2.0 (client/OTG) —
Industrial Communication 2x PRU-ICSS —
工作溫度 -40C to +85C (industrial) —
安裝類型 Surface Mount (BGA) Surface Mount
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 Compliant Compliant
Device Type — System-In-Package (SiP)
Integrated Processor — TI Sitara AM3358 ARM Cortex-A8
Onboard DDR3 SDRAM — 512 MB
Power Management IC — TPS65217C (integrated)
工作溫度範圍 — -40 C to +85 C (industrial)
封裝 — 400-ball BGA
PRU-ICSS Subsystems — 2 (industrial-grade)
USB — USB 2.0 High-Speed PHY
CAN — 2x CAN 2.0B
SPI — 2x SPI
I2C — 3x I2C

資料表與資源

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