S9S08QD4J1VSC vs S9S08QD4J2MSCR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08QD4J1VSC disebabkan oleh NXP Semiconductors dan S9S08QD4J2MSCR disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | S9S08QD4J1VSC | S9S08QD4J2MSCR |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Architecture | HCS08 (S08 family) | — |
| CPU Bit Width | 8-bit | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Suhu Operasi | -40C to +105C | -40 C to +125 C |
| Kemasan | 8-pin SOIC (SOIC-8) | 8-SOIC (0.154 inch, 3.90 mm width) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| ADC | 8-channel 10-bit | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | TPM (16-bit) + MTIM (8-bit) | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug Interface | Background debug (single wire) + on-chip breakpoints | — |
| AEC-Q100 | Qualified (automotive) | — |
| Instruction Set | HC08 + BGND | — |
| Aras MSL | MSL3 (per SOIC-8 standard) | — |
| Status RoHS | Compliant | Compliant |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Tegangan Pemberi Arus | — | 2.7 V to 5.5 V |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |