S9S08QD4J2MSC vs MC9S08QG4CFFE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S08QD4J2MSC disebabkan oleh NXP Semiconductors dan MC9S08QG4CFFE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
S9S08QD4J2MSC ✓ Aktif
Pengandingan Spesifikasi
| Parametr | S9S08QD4J2MSC | MC9S08QG4CFFE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Akhir Hidup |
| Manufacturer | NXP Semiconductors | — |
| Core Architecture | HCS08 (8-bit, HC08-compatible with BGND) | — |
| CPU Frequency | 16 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 bytes | — |
| Kemasan | 8-SOIC (0.154", 3.90 mm width) | 16-QFN-EP (5x5 mm), QFN EP |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40C to +125C (automotive grade) | — |
| AEC-Q100 Qualification | Qualified | — |
| Bilangan Pin | 8 | — |
| General-Purpose I/O Pins | 4 (plus 1 input-only and 1 output-only pin) | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: VDD range] | 2.5 V / 3.3 V |
| ADC | On-chip ADC (channel count per datasheet) | — |
| Timers | On-chip timer(s) | — |
| Communication | SCI/SPI (per datasheet) | — |
| Debug Interface | Background Debug Mode (BDM) with breakpoints | — |
| Low-Power Modes | STOP and WAIT | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Frekuensi Klock Maksimum | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Status Lingkungan Hidup | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Gambaran Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |