S9S12B128F0MFUE vs MC9S12B64CFUE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci S9S12B128F0MFUE disebabkan oleh NXP Semiconductors dan MC9S12B64CFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
S9S12B128F0MFUE - 16-bit 128KB Flash Automotive MCU QFP-80 | NXP
S9S12B128F0MFUE NrndNXP Semiconductors
MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP
MC9S12B64CFUE ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | S9S12B128F0MFUE | MC9S12B64CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Masa Terakhir Dibeli |
| Core Processor | HCS12 | — |
| Core Size | 16-bit | — |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 128 KB (128K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| Number of I/O | 59 | — |
| Data Converters | A/D 8x10b | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | POR, PWM, WDT | — |
| Suhu Operasi | -40C to +125C (Automotive Grade 1) | — |
| Kemasan | 80-LQFP (14x14 mm) | 80-QFP (14x14 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| AEC-Q100 Qualification | Qualified | — |
| Series | HCS12 / MC9S12B (S9S12B128, Sturgeon) | — |
| Status RoHS | Compliant per NXP product page | Compliant |
| Core | — | HCS12 (S12 CISC, 16-bit) |
| Flash Memory | — | 64 KB |
| RAM | — | 2 KB |
| EEPROM | — | 1 KB |
| Maximum CPU Frequency | — | 25 MHz |
| Tegangan Pemberi Arus | — | 5 V (typical) |
| Gambaran Suhu Operasi | — | 0C to +70C (commercial 'C' grade) |
| ADC | — | 8-channel, 10-bit |
| CAN Module | — | 1x MSCAN 2.0A/B |
| SCI/SPI | — | 2x SCI, 1x SPI |
| Timers | — | 16-bit Timer + 8-bit PWM + PIT |
| I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Terminal Finish | — | Matte Tin (Sn) |
| Peak Reflow Temperature | — | 260C (max 40 s) |