SPC5605BK0MLL6R vs SPC5605BK0CLL6 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci SPC5605BK0MLL6R disebabkan oleh NXP Semiconductors dan SPC5605BK0CLL6 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | SPC5605BK0MLL6R | SPC5605BK0CLL6 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Aktif |
| Core Processor | e200z0h (Power Architecture, MPC56xx Qorivva) | — |
| Core Size | 32-bit | — |
| Frekuensi Klock Maksimum | 64 MHz | 64 MHz |
| Flash Memory | 768 KB (768K x 8) | — |
| Supply Voltage Range | 3 V to 5.5 V | — |
| Suhu Operasi | -40C to +125C | -40C to +85C |
| Kemasan | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) |
| Number of Pins / Terminals | 100 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Grade | Automotive Grade | — |
| RAM | [DATA_NEEDED: SRAM size] | — |
| Communication Interfaces | CAN, LIN, FlexRay-oriented family peripherals | — |
| ADC Resolution | 10-bit, 12-bit (per family data) | — |
| Tingkat sensitiviti Air Nama (MSL) | 3 | — |
| Peak Reflow Temperature | 260 C | — |
| Terminal Finish | Tin (JESD-609 code e3) | — |
| Packaging | Tape and Reel (R suffix) | — |
| Status RoHS | RoHS Compliant | Compliant |
| Core | — | e200z0h (Power Architecture technology) |
| APU | — | VLE (variable-length encoding) |
| Bit Width | — | 32-bit |
| Program Memory Size | — | 768 KB (768K x 8) Flash |
| RAM Size | — | [DATA_NEEDED: RAM size in KB] |
| Tegangan Pemberi Arus | — | 3.3 V / 5 V |
| Automotive Grade | — | AEC-Q100 qualified |
| Family | — | MPC56xx Qorivva |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-Free | — | Yes |
| Tray Quantity | — | Per NXP standard tray |