W971GG6NB-6 vs W971GG6NB-25 TR Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci W971GG6NB-6 disebabkan oleh Winbond dan W971GG6NB-25 TR disebabkan oleh Winbond. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | W971GG6NB-6 | W971GG6NB-25 TR |
|---|---|---|
| Merek | Winbond | Winbond |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR2 SDRAM | SDRAM - DDR2 |
| Saiz Ingatan | 1 Gbit | 1 Gbit |
| Organisasi | 8M x 8 banks x 16 bits | 64M x 16 (8,388,608 words x 8 banks x 16 bits) |
| Speed Grade | -6 (DDR2-667, 667 Mbps) | — |
| Interface Standard | SSTL_18 (1.8 V) | — |
| Clock Frequency | 333 MHz (667 Mbps data rate) | 400 MHz |
| Access Time | [DATA_NEEDED: precise CL-trcd-trp in ns] | 57.5 ns |
| Number of Banks | 8 | 8 |
| Burst Length | 4 / 8 (programmable) | — |
| On-Die Termination | Dynamic ODT (supported) | — |
| Data Mask (DM) | Supported | — |
| Auto Precharge | Supported | — |
| Self-Refresh | Supported | — |
| Operating Temperature Range (commercial) | 0C to +85C (TCASE) | — |
| Supply Voltage VDD/VDDQ | 1.8 V (typ) | — |
| Kemasan | 84-ball TFBGA (8 x 12.5 mm) | 84-TFBGA (8 x 12.5 mm) |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| RoHS / Halogen-Free | Compliant / Halogen-Free (per Winbond) | — |
| JEDEC Standard | JEDEC DDR2 (DDR2-667 grade) | — |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Write Cycle Time | — | 15 ns |
| Antaramuka | — | SSTL_18 |
| Tegangan Pemberi Arus | — | 1.8 V |
| Kadar Data | — | DDR2-800 |
| Packaging | — | Tape & Reel (TR) |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| Refresh Interval | — | [DATA_NEEDED: refresh interval] |
| Status RoHS | — | Compliant (all Winbond packaging RoHS compliant per manufacturer) |