W971GG6NB-6 vs W971GG6NB-25 TR Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng W971GG6NB-6 sa pamamagitan ng Winbond at W971GG6NB-25 TR sa pamamagitan ng Winbond. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | W971GG6NB-6 | W971GG6NB-25 TR |
|---|---|---|
| Brand | Winbond | Winbond |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR2 SDRAM | SDRAM - DDR2 |
| Laki ng Memory | 1 Gbit | 1 Gbit |
| Organisasyon | 8M x 8 banks x 16 bits | 64M x 16 (8,388,608 words x 8 banks x 16 bits) |
| Speed Grade | -6 (DDR2-667, 667 Mbps) | — |
| Interface Standard | SSTL_18 (1.8 V) | — |
| Clock Frequency | 333 MHz (667 Mbps data rate) | 400 MHz |
| Access Time | [DATA_NEEDED: precise CL-trcd-trp in ns] | 57.5 ns |
| Number of Banks | 8 | 8 |
| Burst Length | 4 / 8 (programmable) | — |
| On-Die Termination | Dynamic ODT (supported) | — |
| Data Mask (DM) | Supported | — |
| Auto Precharge | Supported | — |
| Self-Refresh | Supported | — |
| Operating Temperature Range (commercial) | 0C to +85C (TCASE) | — |
| Supply Voltage VDD/VDDQ | 1.8 V (typ) | — |
| Packhaging | 84-ball TFBGA (8 x 12.5 mm) | 84-TFBGA (8 x 12.5 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| RoHS / Halogen-Free | Compliant / Halogen-Free (per Winbond) | — |
| JEDEC Standard | JEDEC DDR2 (DDR2-667 grade) | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Write Cycle Time | — | 15 ns |
| Interface | — | SSTL_18 |
| Volte ng Pagbibigay | — | 1.8 V |
| Rate ng Data | — | DDR2-800 |
| Packaging | — | Tape & Reel (TR) |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| Refresh Interval | — | [DATA_NEEDED: refresh interval] |
| Tindminan RoHS | — | Compliant (all Winbond packaging RoHS compliant per manufacturer) |