XC6SLX75-2FG484C vs XC6SLX75-2FGG484I Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci XC6SLX75-2FG484C disebabkan oleh AMD dan XC6SLX75-2FGG484I disebabkan oleh AMD. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr XC6SLX75-2FG484C XC6SLX75-2FGG484I
Merek AMD AMD
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Unknown Aktif
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX —
Internal Frequency 667 MHz —
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Package Type 484-BBGA, MS-034 FBGA —
Package Dimensions 23 x 23 mm —
Package Pitch 1 mm —
Number of Balls 484 balls —
Suhu Operasi 0 to 85 C —
Speed Grade -2 -2 (mid-range)
Temperature Grade Commercial —
Process Technology CMOS 45 nm CMOS
Jenis Pemasangan Surface mount ball grid array Surface Mount (BGA)
Configuration [DATA_NEEDED: configuration architecture] —
Tegangan Pemberi Arus [DATA_NEEDED: supply voltage] —
Block RAM [DATA_NEEDED: block RAM] 4,824 Kbits (180 x 18 Kbit)
DSP Resources [DATA_NEEDED: DSP resources] —
User I/O [DATA_NEEDED: user I/O count] —
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Device Family — Spartan-6 LX
Logic Elements / Slices — 11,650 slices
System Gates — 3,170,304
DSP Slices (DSP48A1) — 132
User I/Os — 280
Maximum Internal Frequency — 667 MHz
Core Supply Voltage (VCCINT) — 1.14 V to 1.26 V
Auxiliary Supply Voltage (VCCAUX) — 3.3 V
Kemasan — 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Operating Temperature (Industrial) — -40 °C to +100 °C (junction to +125 °C)
Aras MSL — 3 (168 hours)

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