XC6SLX75-2FG484C vs XC6SLX75-2FGG484I 比較

詳細並排比較 XC6SLX75-2FG484C 由 AMD 與 XC6SLX75-2FGG484I 由 AMD. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 XC6SLX75-2FG484C XC6SLX75-2FGG484I
品牌 AMD AMD
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Unknown 啟用中
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Spartan-6 LX —
Internal Frequency 667 MHz —
Logic Cells 74,637 cells 74,637
Configurable Logic Blocks 5,831 CLBs —
Package Type 484-BBGA, MS-034 FBGA —
Package Dimensions 23 x 23 mm —
Package Pitch 1 mm —
Number of Balls 484 balls —
工作溫度 0 to 85 C —
Speed Grade -2 -2 (mid-range)
Temperature Grade Commercial —
Process Technology CMOS 45 nm CMOS
安裝類型 Surface mount ball grid array Surface Mount (BGA)
Configuration [DATA_NEEDED: configuration architecture] —
供應電壓 [DATA_NEEDED: supply voltage] —
Block RAM [DATA_NEEDED: block RAM] 4,824 Kbits (180 x 18 Kbit)
DSP Resources [DATA_NEEDED: DSP resources] —
User I/O [DATA_NEEDED: user I/O count] —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
Device Family — Spartan-6 LX
Logic Elements / Slices — 11,650 slices
System Gates — 3,170,304
DSP Slices (DSP48A1) — 132
User I/Os — 280
Maximum Internal Frequency — 667 MHz
Core Supply Voltage (VCCINT) — 1.14 V to 1.26 V
Auxiliary Supply Voltage (VCCAUX) — 3.3 V
封裝 — 484-ball FBGA (FGG484), 23 x 23 mm, 1.0 mm pitch
Operating Temperature (Industrial) — -40 °C to +100 °C (junction to +125 °C)
MSL 等級 — 3 (168 hours)

資料表與資源

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