10CL010YM164A7G - Cyclone 10 LP FPGA, 10K LE, 164-MBGA | Intel
MPN: 10CL010YM164A7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.45 | $2,945.00 |
| 500 | $24.8 | $12,400.00 |
| 1,000 | $21.1 | $21,100.00 |
Drop-in alternatives for 10CL010YM164A7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CL016YM164A7G
✅ Drop-In✓ In Stock
$16.75 / Unit
View Datasheet →10CL006YM164A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10CL010YM164I7G
✅ Drop-In✓ In Stock
$9.45 / Unit
View Datasheet →10CL010YM164C8G
✅ Drop-In✓ In Stock
$12.1 / Unit
View Datasheet →10CL010YM164A7G
✅ Drop-In✓ In Stock
$21.1 / Unit
View Datasheet →10CL010YM164A7G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Logic Elements | 10,320 |
| Embedded Memory | 423,936 bits |
| Maximum User I/O | 101 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 2 |
| Package | 164-MBGA (TFBGA-164), 8x8 mm, 0.5 mm pitch |
| Process Technology | Low-power CMOS |
| Operating Junction Temperature | -40C to +125C (Automotive) |
| Configuration Memory | SRAM (volatile, external flash required) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Design Software | Intel Quartus Prime |
10CL010YM164A7G 164-mbga (tfbga-164), 8x8 mm, 0.5 mm pitch Pin Configuration Guide
Complete pinout information for 10CL010YM164A7G (164-mbga (tfbga-164), 8x8 mm, 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL010YM164A7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL010YM164A7G is suitable for 6 applications: Industrial Motor Control, Automotive Infotainment Display Bridging, IoT Edge Sensor Aggregation, Video Processing Pipeline, Protocol Bridging and Glue Logic, Test and Measurement Front-End.
Industrial Motor Control
The 10CL010YM164A7G fits industrial motor control applications because its 10,320 logic elements and 46 embedded 18x18 multipliers can implement field-oriented control (FOC) loops, encoder interfaces, and PWM generation in a single chip. The automotive -40C to +125C temperature grade tolerates the harsh thermal environment of motor drive enclosures. The 164-MBGA 8x8 mm footprint fits compact inverter PCBs alongside gate drivers and current-sense amplifiers, while the 2 PLLs provide jitter-free clocking for resolver or BiSS feedback.
Recommended
Automotive Infotainment Display Bridging
Use the 10CL010YM164A7G as a display bridge between an automotive SoC's MIPI DSI output and an LVDS panel. Its 10K logic elements and 423,936 bits of embedded memory comfortably handle pixel-rate conversion, color space translation, and partial-frame buffer storage. The AEC-Q100 qualification and -40C to +125C range satisfy automotive cluster and head-unit thermal requirements. The 164-MBGA footprint is small enough to mount on the flex PCB behind the display, and 101 user I/Os provide ample headroom for backlight, touch, and GPIO multiplexing.
Recommended
IoT Edge Sensor Aggregation
The 10CL010YM164A7G aggregates multiple low-speed sensor buses (I2C, SPI, UART) onto a single Ethernet or CAN uplink in IoT edge nodes. Its 10K logic elements implement soft cores such as RISC-V or Nios II for protocol handling and local filtering, while 46 multipliers accelerate FFT-based vibration or acoustic analysis. The low-power Cyclone 10 LP process keeps idle consumption low for always-on industrial edge devices. Pair with a QSPI flash for configuration storage and a small PHY for Ethernet connectivity.
Recommended
Video Processing Pipeline
The 10CL010YM164A7G handles mid-complexity video processing pipelines such as deinterlacing, scaling, and OSD overlay for industrial cameras and machine-vision front-ends. Its 46 18x18 multipliers accelerate 2D convolution and basic filtering, while 423 Kbits of embedded memory buffer scan-line data without external SRAM. The 101 user I/Os accept parallel CMOS sensor interfaces and drive HDMI or LVDS outputs. The -40C to +125C range supports outdoor and factory deployments.
Recommended
Protocol Bridging and Glue Logic
Replace aging CPLD-based protocol bridges with the 10CL010YM164A7G when designs outgrow 1-2K LUTs. The 10K LE fabric implements UART-to-Ethernet, SPI-to-CAN, and I2C-to-USB bridges in a single device with room for diagnostic state machines and watchdogs. The 164-MBGA 0.5 mm pitch integrates into existing CPLD footprints where pin-count allows. Lower BOM cost than multi-CPLD solutions at this density.
Recommended
Test and Measurement Front-End
The 10CL010YM164A7G serves as a reconfigurable front-end for low-speed test instruments: programmable gain stages, muxing, and trigger logic can all be implemented in fabric. The 46 embedded multipliers support real-time FIR filtering, and the 2 PLLs generate precise sample clocks for downstream ADCs. The automotive temperature grade allows use in field-deployed test gear. Compact 164-MBGA package fits handheld form factors.
Recommended
Recommended Products Summary
Engineering reference data for 10CL010YM164A7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YM164A7G | 10CL006YM164A7G | 10CL010YM164I7G | 10CL010YM164C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 164-MBGA (M164) | 164-MBGA (M164) - same | 164-MBGA (M164) - same | 164-MBGA (M164) - same | 164-MBGA (M164) - same |
| Logic Elements | 10,320 | 15,408 (+49%) | 6,272 (-39%) | 10,320 (same) | 10,320 (same) |
| Embedded Memory | 423,936 bits | 516,096 bits | 270,336 bits | 423,936 bits | 423,936 bits |
| Multipliers (18x18) | 46 | 56 | 30 | 46 | 46 |
| Maximum User I/O | 101 | 101 | 101 | 101 | 101 |
| Temperature Grade | Automotive -40C to +125C | Automotive -40C to +125C | Automotive -40C to +125C | Industrial -40C to +100C | Automotive -40C to +125C |
| Speed Grade | 7 | 7 | 7 | 7 | 8 (slower) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Approx. Unit Price (USD, qty 1) | 38.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest LE count in the M164 automotive drop-in family (vs 10CL006YM164A7G)
- Automotive temperature grade up to +125C junction (vs 10CL010YM164I7G)
- Faster speed grade (7) at same price tier (vs 10CL010YM164C8G)
- Compact 164-MBGA footprint with 101 I/Os (vs 10CL010YU256A7G)
Design Notes
Cyclone 10 LP devices require multiple supply rails: core VCC, VCCIO for I/O banks, VCCA for PLL analog, and VCCPD for pre-drivers. Decouple each rail with at least one 0.1 uF X7R ceramic capacitor per bank plus a single 10-100 uF bulk capacitor per rail placed close to the BGA. Add a ferrite bead between the board 3.3 V supply and VCCA to keep PLL jitter within specification. Power-on sequence (VCC before VCCIO before VCCPD) must follow Intel's power management user guide.
The 164-MBGA package uses a 0.5 mm ball pitch on an 8x8 mm body. Route escape with microvias on inner layers, and place at least 4 ground vias in the BGA center pad for thermal and return-path continuity. Match trace lengths within a bank for LVDS pairs and DDR interfaces to keep skew below 50 ps. Use Intel's symbol libraries for the Cyclone 10 LP M164 footprint - third-party symbols frequently omit the central thermal pad or misnumber balls.
Configuration flash is mandatory because Cyclone 10 LP SRAM is volatile. Do not use JTAG-only boot in production: power cycling will erase the design. Always include an EPCQ-L or compatible flash in the BOM. JTAG chain integrity must be verified post-reflow; MSEL pin resistors determine configuration mode and must be sized for the chosen flash interface. Confirmed via Intel's configuration user guide.
Estimated: at 100% logic utilization, 50% toggle rate, and worst-case process corner, the 10CL010YM164A7G dissipates approximately 0.8-1.2 W. The 164-MBGA's theta_JA of roughly 28 C/W on a 4-layer JEDEC test board produces a 22-34 C junction rise above ambient - manageable without a heatsink at automotive ambient up to ~105 C. Forced airflow is recommended above ambient 85 C.
Series-dampening resistors (22-33 ohm) on each LVDS output and on clock outputs reduce reflections and overshoot in long backplane traces. For DDR2/DDR3 interfaces, maintain 50-ohm single-ended impedance and use Intel's pinout-aware IO Planner to keep DQS groups matched within 25 ps. Keep high-speed serial lines (LVDS) away from noisy switching supplies; if not possible, stitch ground vias along the trace path to provide a low-impedance return.
Compliance Information
AEC-Q100 qualified per ordering part number 'A' suffix. RoHS compliance confirmed by JLCPCB part detail listing. Halogen-free status not explicitly stated in available data.
