10AX115R2F40E2SG - Arria 10 GX FPGA 1150K LE FCBGA-1517 | Intel
MPN: 10AX115R2F40E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6450 | $6,450.00 |
| 10 | $6190 | $61,900.00 |
| 100 | $5895 | $589,500.00 |
| 500 | $5640 | $2,820,000.00 |
| 1,000 | $5410 | $5,410,000.00 |
Drop-in alternatives for 10AX115R2F40E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115R2F40E1SG
✅ Drop-In✓ In Stock
$6875 / Unit
View Datasheet →10AX115R2F40E2LG
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$10300 / Unit
View Datasheet →10AX115R1F40E1SG
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Contact for price
View Datasheet →10AX115R2F40I1SG
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$3490 / Unit
View Datasheet →10AX115H4F34E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115R2F40E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory Bits | 68,857,856 |
| M20K Memory Blocks | 2,128 |
| MLAB Memory Bits | 8,812,800 |
| Variable-Precision DSP Blocks | 1,518 |
| 18 x 19 Multipliers | 3,036 |
| PLLs | 16 |
| User I/O Pins | 342 |
| Transceiver Count | 48 (max 96 for the family) |
| Transceiver Data Rate | up to 17.4 Gbps (chip-to-chip) |
| Hard Memory Controllers | Yes |
| PCIe Hard IP | Gen3 x1/x2/x4/x8 |
| Process Technology | 20 nm TSMC |
| Speed Grade | -2 (E2, mid) |
| Operating Temperature | 0C to +100C (commercial) |
| Package | 1517-ball FCBGA, 40 x 40 mm |
| Mounting Type | Surface Mount (flip-chip BGA) |
| RoHS | Compliant |
10AX115R2F40E2SG 1517-ball fcbga, 40 x 40 mm Pin Configuration Guide
Complete pinout information for 10AX115R2F40E2SG (1517-ball fcbga, 40 x 40 mm package) with 342 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R2F40E2SG.
Refer to the datasheet for full pin configuration.
Estimated pin count: 342 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R2F40E2SG is suitable for 7 applications: 100G Optical Transport Network Line Card, 4G/5G Baseband Processing Card, Military Radar Signal Processing, Medical Imaging Accelerator (CT/MRI), High-Performance Compute Fabric Card (PCIe Gen3 Accelerator), Video Broadcast and 4K/8K Processing, Industrial Test & Measurement Equipment.
100G Optical Transport Network Line Card
The 10AX115R2F40E2SG's 48 transceiver channels at 17.4 Gbps pair with hardened 100G Ethernet MACs to build a single-chip OTU4/100G line card. The device absorbs 4x 25.78G OTU4 lanes or 10x 10G OTU2 clients through its 1,518 variable-precision DSP blocks, providing forward-error-correction and framer assist without off-chip ASICs. At 1,150,000 LEs, designers can host the full GFP/OTN mapper, hitless protection switching, and GMPLS control plane in fabric logic, while a low-jitter fractional-N PLL bank handles the line-side and client-side reference clocks.
Recommended
4G/5G Baseband Processing Card
The 10AX115R2F40E2SG targets 4G/5G baseband with its 1,518 DSP blocks, 48 CPRI/OBSAI links at 9.8 Gbps, and PCIe Gen3 x8 host interface. It can map a complete LTE-Advanced carrier aggregation chain (4x 20 MHz CCs) or a 5G NR sub-6 GHz L1 cell onto its 1150K-LE fabric, with the hardened MAC plus 100G Ethernet MAC providing backhaul to the DU/CU. Compared to GPU/CPU implementations, the FPGA reduces 5G L1 latency by 5-10x while dissipating ~30 W at full DSP utilization. A single board can host two carrier cards back-to-back with CPRI front-haul, simplifying radio unit integration.
Recommended
Military Radar Signal Processing
The 10AX115R2F40E2SG is well suited to phased-array radar, SAR imaging, and EW systems where 1,150,000 LEs, 1,518 variable-precision DSP blocks, and 48 transceivers deliver 250 GMACs of FP16/INT8 throughput per device. Designers typically build a beamforming matrix (64x64 elements), pulse-compression correlators, and a CFAR detector in fabric, then stream digitized antenna samples over 10 Gbps links to a high-performance back-end. The 68.86 Mbit embedded memory holds tap-weight tables and coefficient banks, eliminating external SRAM access in the inner loop. For radar-grade thermal headroom, the I-grade variant 10AX115R2F40I1SG supports -40C to 100C.
Recommended
Medical Imaging Accelerator (CT/MRI)
The 10AX115R2F40E2SG accelerates CT, MRI, and ultrasound back-end reconstruction through its parallel DSP fabric and high-bandwidth memory interface. A 256x256x256 CT volume can be back-projected in near-real time using the 1,518 DSP blocks at FP16 precision, and the PCIe Gen3 x8 link delivers raw digitized RF to the FPGA at line rates above 6 GByte/s. The hardened memory controller connects to DDR4 with ECC, providing 25 GByte/s sustained bandwidth for sinogram buffering. Medical systems benefit from the device's deterministic latency, which simplifies IEC 62304 software verification and FDA 510(k) submission traceability.
Recommended
High-Performance Compute Fabric Card (PCIe Gen3 Accelerator)
The 10AX115R2F40E2SG is widely deployed as a PCIe Gen3 x8/x16 host accelerator card in HPC and financial trading systems. Designers implement custom FFTs, Black-Scholes option pricers, or Monte-Carlo kernels in the variable-precision DSP, achieving 200-400 GMACs of FP16 throughput per device. The 68.86 Mbit embedded memory supports tile-level data reuse, while the 17.4 Gbps transceivers feed a backplane that can chain 4-8 FPGAs in a ring for distributed back-test workloads. Compared to discrete GPU solutions, the FPGA wins on deterministic latency-critical paths and on per-watt efficiency for streaming integer DSP.
Recommended
Video Broadcast and 4K/8K Processing
The 10AX115R2F40E2SG handles 4K and 8K video pipelines in broadcast studios and live-event trucks. The 1,150,000 LEs plus 1,518 DSP blocks sustain real-time HEVC/H.265 main-10 encoding at 8K/60p, while the 12G-SDI/quad-link 3G-SDI physical layer is absorbed by the 17.4 Gbps transceivers. A single device can host a multi-channel 4K frame-synchronizer matrix with embedded audio (AES3/EBU) de-embedders, color-space converters, and HDR tone-mapping logic. Compared to ASIC-based broadcast routers, the FPGA allows studios to roll out new codec features via remote bitstream updates instead of forklift upgrades.
Recommended
Industrial Test & Measurement Equipment
The 10AX115R2F40E2SG is ideal for high-end oscilloscopes, BERT testers, and protocol analyzers where wide analog bandwidth, real-time DSP, and deep trigger memory are required. The 48 transceivers sample multiple lanes at 10-17 Gbps for protocol-aware triggering, while the 68.86 Mbit embedded memory stores millions of sample points without off-chip DRAM access. Engineers implement custom FFT, eye-diagram analysis, and PAM4 decode logic in the variable-precision DSP, and the PCIe Gen3 link streams captured data to a host PC at 6+ GByte/s for offline processing. The 0C to 100C commercial range covers lab and production-floor environments.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R2F40E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R2F40E1SG | 10AX115R2F40E2LG | 10AX115R1F40E1SG | 10AX115R2F40I1SG | 10AX115H4F34E3SG |
|---|---|---|---|---|---|---|
| Package | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA, 40 x 40 mm | 1517-ball FCBGA, 40 x 40 mm | 1152-ball FCBGA, 35 x 35 mm |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -2 (E2, mid) | -1 (E1, slow) | -2 (E2, mid) | -1 (E1) | -1 (I1, industrial) | -3 (E3, fast) |
| User I/O Pins | 342 | 342 | 342 | 342 | 342 | 504 |
| Embedded Memory (Mbit) | 65.66 (68,857,856 bits) | 65.66 | 65.66 | 65.66 | 65.66 | 65.66 |
| Transceiver Channels | 48 | 48 | 48 | 48 | 48 | 48 |
| Operating Temperature | 0C to +100C (commercial) | 0C to +100C | 0C to +100C | 0C to +100C | -40C to +100C (industrial) | 0C to +100C |
| Approx. Unit Price (qty 1, USD) | 6,450 | 5,890 | 6,450 | 5,720 | 7,200 | 5,990 |
Key Differentiators
- Same F40 FCBGA footprint across speed grades, lead-free options, and industrial temperature variants (vs 10AX115R2F40I1SG)
- Higher transceiver channel count vs same-density Arria 10 GT/ST alternatives (vs 10AT115N4F40E3SGE2)
- Lower power envelope vs same-density Arria 10 SX SoC alternatives (vs 10AS066K3F35I2SG (Arria 10 SX SoC with ARM cores))
Design Notes
Estimated: at 17.4 Gbps full utilization of 48 transceivers plus ~80% DSP utilization, the 10AX115R2F40E2SG dissipates 28-32 W typical (per Intel Early Power Estimator for similar Arria 10 GX designs). The 1517-ball FCBGA exposes a heat-spreader-compatible top; pair the part with a thermal-interface material (TIM) and a heat spreader or heatsink capable of 25 C/W. Without forced airflow, junction-to-ambient thermal resistance must be reduced to under 8 C/W to keep Tj below 100C. Place 6-8 thermal vias below the die-flag footprint on the PCB inner planes to extract heat directly into the ground stack-up.
Recommended: use 12 layer stack-up with 6 signal/4 ground/2 power split. Each 17.4 Gbps transceiver channel requires matched-length differential routing with intra-pair skew under 1.5 ps and pair-to-pair skew under 5 ps. The Arria 10 Transceiver PHY User Guide specifies 85-100 ohm differential impedance for the 17G channels and 90-100 ohm for 10G channels; place DC-blocking caps within 100 mil of the FPGA ball. Reference clock distribution requires a 5 mV or better phase-noise source (e.g. Crystek CVHD-950 or SiTime SiT9121) routed as a 50 ohm single-ended line to the REFCLK pins.
Recommended: signal-integrity simulation (Ansys SIwave or Cadence PowerSI) is mandatory for the transceiver breakout, since 17.4 Gbps NRZ is highly sensitive to via stubs. Use back-drilled vias with stub length under 8 mils, or HDI micro-via layer transitions, on each transceiver differential pair. Add a 4-7 dB pre-emphasis / de-emphasis setting (via Quartus Transceiver Toolkit) for lossy backplane channels above 15 inches. For multi-board systems, AC-coupling on each side of the connector keeps DC bias and common-mode within the FPGA's 1.5 V range.
Critical: do not power up the 10AX115R2F40E2SG without a valid configuration bitstream loaded, because the high-speed transceivers may power up in undefined states that pull excessive current. Always include a valid factory default bitstream in flash (e.g. EPCQ-L256) that configures all GPIOs to input mode. Do not exceed 0.9 V on the 17.4 Gbps transceiver analog supply (VCCR_GXB/VCCT_GXB); use a dedicated LDO with +/- 1.5% tolerance. Avoid routing the 17G transceiver lanes across PCB splits, since return-path discontinuities create 5-8 dB loss spikes at 8 GHz.
Recommended: separate the digital and transceiver power domains onto distinct power islands. The 20 nm core VCC runs at 0.85 V nominal (VCC, VCCP) and the GXB/PLL analog at 0.9 V, with a 100 dB PSRR target at 1 MHz. Place a Pi-filter (ferrite bead + 22 uF + 100 nF) between the digital and analog supply pins. Reference the design to Intel's Arria 10 GX Reference Manual (AN 778) and the Arria 10 GX Power Distribution Network Application Note for the recommended decoupling scheme; specifically, place one 220 nF cap on each 8-10 GXB lanes, one 22 uF on each 4 lanes, and one 220 uF on every voltage rail at the PCB edge connector.
Compliance Information
RoHS compliant per DigiKey product page. E2 commercial temperature grade. Not AEC-Q100 qualified (automotive is not a target market for this OPN). LG suffix variants are lead-free RoHS; E2 suffix is Pb-free per Intel product numbering convention. REACH compliance per Intel product environmental reporting.
