10CX150YF672E5G - Cyclone 10 GX FPGA, 150K LE, 672-FCBGA | Intel
MPN: 10CX150YF672E5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $397.5 | $3,975.00 |
| 100 | $355 | $35,500.00 |
| 500 | $322.5 | $161,250.00 |
| 1,000 | $295 | $295,000.00 |
Drop-in alternatives for 10CX150YF672E5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX105YF672E5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →10CX085YF672E5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$289 / Unit
View Datasheet →10CX150YF672E6G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$124.9 / Unit
View Datasheet →10CX150YF672I5G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$278.4 / Unit
View Datasheet →10CX150YF672I6G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$215 / Unit
View Datasheet →10CX150YF672E5G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 GX |
| Family | Intel Cyclone 10 GX (10CX150) |
| Logic Elements (LE) | 150,000 |
| Embedded Memory | 10,907,648 bits (10.9 Mbits) |
| Number of I/O | 236 |
| Supply Voltage - Core | 0.95 V (typical, internal) |
| Supply Voltage - I/O | 1.2 V to 3.3 V (per bank) |
| Process Technology | 20 nm |
| Transceiver Data Rate | Up to 6.144 Gbps |
| DSP Blocks | 490 variable-precision DSP blocks |
| 18x19 Multipliers | 156 |
| M20K Block RAM | 8.5 Mbits |
| MLAB Memory | 9.6 Mbits |
| PLLs | 6 (fractional-N) |
| PCIe Hard IP | PCIe Gen2 x4 |
| Package | 672-ball FCBGA (F672, 27x27 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40C to +100C (E5G = commercial) |
| Speed Grade | 5 |
| RoHS Status | Compliant |
10CX150YF672E5G 672-ball fcbga (f672, 27x27 mm) Pin Configuration Guide
Complete pinout information for 10CX150YF672E5G (672-ball fcbga (f672, 27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX150YF672E5G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX150YF672E5G is suitable for 6 applications: Industrial Machine Vision Systems, PCIe-Based Hardware Accelerator Cards, Video Broadcast and Format Conversion, Wireless Backhaul Modem Baseband, Factory Automation and Industrial IoT Gateways, Test and Measurement Instrumentation.
Industrial Machine Vision Systems
The 10CX150YF672E5G fits industrial machine vision because its 490 variable-precision DSP blocks (each implementing a 27x27 multiplier with accumulator) and 8.5 Mbits of M20K block RAM deliver 1-2 Mpixels/line of image processing bandwidth per pipeline stage. The hardware single-precision floating-point DSP engine accelerates Bayer demosaicing, gamma correction, and convolution kernels without consuming LE fabric. With 6 transceiver channels at up to 6.144 Gbps, the FPGA aggregates 4-6 MIPI CSI-2 or GigE Vision sensors into a single PCIe Gen2 x4 uplink to a host controller. The 0C to +100C commercial junction range supports most factory enclosures when paired with a 4-layer thermal PCB stack-up.
Recommended
PCIe-Based Hardware Accelerator Cards
The 10CX150YF672E5G suits half-height PCIe accelerator cards thanks to its hardened PCIe Gen2 x4 endpoint controller, which saves 10-15K LEs versus a soft PCIe core and guarantees PCI-SIG-compliant link training. The 150K LE budget accommodates 1-2 custom compute kernels (FFT, encryption, AI inference), while the 9.6 Mbits of MLAB enables wide-register data paths without external SRAM. The 672-FCBGA's 1.0 mm ball pitch keeps the card short enough for half-height bracket designs, and the 6.144 Gbps transceivers provide a secondary high-speed port for inter-card or backplane links.
Recommended
Video Broadcast and Format Conversion
Broadcast video processing leverages the 10CX150YF672E5G's 490 variable-precision DSP blocks to implement real-time SD/HD/3G-SDI scaling, deinterlacing, and color-space conversion at frame rates up to 60 Hz. The M20K block RAM holds 4-8 horizontal line buffers at 1920-pixel widths, eliminating the need for external SDRAM for typical scaler data paths. Six transceivers route in/out 3G-SDI streams, and the PCIe Gen2 endpoint links to a host SoC for content control. The 150K LE capacity fits mid-density multi-stream designs, with the FCBGA 672 ball-grid allowing 1.0 mm-pitch escape routing on standard low-cost PCBs.
Recommended
Wireless Backhaul Modem Baseband
The 10CX150YF672E5G targets low-density wireless backhaul and small-cell baseband modems because its six transceivers support up to 6.144 Gbps CPRI or OBSAI links to a remote radio head while the DSP fabric implements channel coding (LTE turbo, 5G LDPC), FFT/iFFT, and crest-factor reduction in real time. The hard PCIe Gen2 x4 connects to a baseband SoC for L2/L3 offload, and 236 user I/O accommodate Ethernet MAC interfaces plus GPS and synchronization pins. Commercial 0C to +100C operation is adequate for indoor microcells; for outdoor radios, the industrial I-grade variant is recommended.
Recommended
Factory Automation and Industrial IoT Gateways
The 10CX150YF672E5G is well matched to industrial IoT gateways because its 150K LE budget supports multiple real-time industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP) on the same die via the Triple-Speed Ethernet IP cores. The 236 user I/O accommodate 4-8 isolated PHY interfaces plus GPIO and serial fieldbus lines, and the M20K block RAM buffers deterministic cycle data at microsecond rates. PCIe Gen2 x4 connects to an application processor, while the transceivers drive optional SFP fiber uplinks for factory backbone traffic. The commercial 0-100C temperature envelope suits most control cabinet environments.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments leverage the 10CX150YF672E5G's combination of transceivers up to 6.144 Gbps, 490 DSP blocks, and 8.5 Mbits of M20K block RAM to implement multi-channel arbitrary waveform generators, protocol analyzers, and high-speed digitizers. The hard PCIe Gen2 x4 streams captured data to a host at sustained 1.6 GB/s, while the LE fabric accommodates custom triggering, sequencing, and on-the-fly signal processing (FIR/IIR filtering, decimation). The 672-FCBGA footprint allows multi-board instruments with shared clock and trigger buses, and the commercial temperature range suits laboratory and ATE environments.
Recommended
Recommended Products Summary
Engineering reference data for 10CX150YF672E5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX105YF672E5G | 10CX085YF672E5G | 10CX150YF672E6G | 10CX150YF672I5G | 10CX150YF672I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FCBGA (F672) | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same | 672-FCBGA (F672) - same |
| Logic Elements | 150,000 | 105,000 (-30%) | 85,000 (-43%) | 150,000 (same) | 150,000 (same) | 150,000 (same) |
| Embedded Memory (bits) | 10,907,648 | 7,024,640 (approx -36%) | 5,810,048 (approx -47%) | 10,907,648 (same) | 10,907,648 (same) | 10,907,648 (same) |
| DSP Blocks | 490 | 320 (approx -35%) | 266 (approx -46%) | 490 (same) | 490 (same) | 490 (same) |
| Speed Grade | 5 | 5 (same) | 5 (same) | 6 (faster) | 5 (same) | 6 (faster) |
| Operating Temperature | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) | 0C to +100C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Transceiver Data Rate | Up to 6.144 Gbps | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) | Up to 6.144 Gbps (same) |
| User I/O | 236 | 236 (same) | 236 (same) | 236 (same) | 236 (same) | 236 (same) |
Key Differentiators
- Highest-density Cyclone 10 GX in the F672 package (vs 10CX105YF672E5G)
- Higher DSP density than smaller Cyclone 10 GX siblings (vs 10CX085YF672E5G)
- Balanced performance and operating temperature envelope (vs 10CX150YF672E6G)
Design Notes
The 672-ball FCBGA with 1.0 mm ball pitch requires a high-density PCB stack-up; use microvia (laser-drilled) vias for inner-to-outer breakout and at least a 6-layer board to fan out the transceiver signals. Follow Intel's Cyclone 10 GX pin connection guidelines for unused pin tie-offs (GND on most unused balls, with explicit NC exceptions documented in the pin-out file). Estimate: a 6-layer 1-oz copper stack-up with 4 mil dielectrics keeps transceiver loss under 1 dB/inch at 6 Gbps.
Estimated: at typical 1.0 W static plus 0.5 W dynamic dissipation for a 50%-utilization Cyclone 10 GX design, total junction heating is around 1.5 W. With a 4-layer JEDEC EIA/JESD51 test board theta_JA of approximately 12 C/W for the F672 FCBGA, junction temperature rise is ~18 C above ambient - comfortable for the commercial 0C to +100C window. For industrial or sealed-enclosure designs, derate ambient by 10-15 C or add a small heatsink; refer to Intel's 'AN 740: Thermal Management' for the official theta_JA values.
Do not mix Cyclone 10 GX bitstreams with Cyclone IV or Cyclone V devices - configuration file formats and JTAG IDs differ. When migrating from Cyclone 10 LP to Cyclone 10 GX, the F672 package is not pin-compatible with the U484 or F484 footprints used on 10 LP devices; the PCB must be re-laid-out. Always run Quartus Prime I/O Assignment Analysis before tape-out to catch unassigned pin, voltage-standard, and current-strength conflicts that can damage the device.
Compliance Information
RoHS and REACH compliance per Intel's Cyclone 10 GX product page; lead-free FCBGA with Pb-free SAC solder balls; no AEC-Q100 qualification for this OPN (industrial I-grade variant available for extended temperature).
