EP1S30F780C6GA - Stratix FPGA 32470 LEs 780-FBGA | Intel
MPN: EP1S30F780C6GA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1337.09 | $1,337.09 |
| 10 | $1280 | $12,800.00 |
| 100 | $1200 | $120,000.00 |
| 500 | $1150 | $575,000.00 |
| 1,000 | $1100 | $1,100,000.00 |
Drop-in alternatives for EP1S30F780C6GA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S30F780C6
✅ Drop-In✓ In Stock
$1125 / Unit
View Datasheet →EP1S25F780C6
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View Datasheet →EP1S25F780C6N
✅ Drop-In✓ In Stock
$780 / Unit
View Datasheet →EP1S20F780C6
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1S20F780C6N
✅ Drop-In✓ In Stock
$188.75 / Unit
View Datasheet →EP1S30F780C6GA Maximum Ratings & Electrical Characteristics
| Series | Stratix |
| Family | Stratix FPGA |
| Logic Elements | 32,470 |
| Total RAM Bits | 3,317,184 |
| Number of I/O | 597 (maximum user I/O) |
| Core Voltage | 1.425 V to 1.575 V |
| Process Technology | 0.13 um |
| Package / Case | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29 x 29 mm) |
| Mounting Type | Surface Mount |
| DSP Blocks | Integrated dedicated multipliers |
| PLL Count | Multiple (per Stratix family) |
| Configuration Memory | SRAM-based, volatile |
| Architecture | Altera Stratix (programmable logic + TriMatrix memory + DSP blocks) |
EP1S30F780C6GA 780-fbga (29 x 29 mm) Pin Configuration Guide
Complete pinout information for EP1S30F780C6GA (780-fbga (29 x 29 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S30F780C6GA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S30F780C6GA is suitable for 6 applications: Communications Baseband Processing, Industrial Automation and Control, High-Speed Data Acquisition Front-Ends, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
Communications Baseband Processing
The EP1S30F780C6GA suits communications baseband and protocol-bridging designs because of its 32,470 logic elements and dedicated DSP blocks for high-throughput multiply-accumulate operations. Its 597 user I/O accommodate multiple external memory interfaces (DDR, QDR, SRAM) and high-speed LVDS links to RF front-ends. The 1.5 V core and Stratix TriMatrix memory deliver deterministic latency for symbol-rate processing in 3G/4G base stations.
Recommended
Industrial Automation and Control
Industrial controllers, programmable logic controllers (PLCs), and motion-control systems benefit from the EP1S30F780C6GA's high logic density and abundant I/O. The 597 available user I/O can drive dozens of sensor inputs, encoder feedback channels, and actuator outputs concurrently. Integrated PLLs provide deterministic clocking for multi-axis servo loops, and Quartus II enables deterministic real-time firmware development for safety-critical machinery.
Recommended
High-Speed Data Acquisition Front-Ends
The EP1S30F780C6GA's 3,317,184 RAM bits provide buffering for streaming ADC data at hundreds of MSPS, while 597 user I/O support wide LVDS or parallel CMOS interfaces to high-resolution converters. The dedicated DSP blocks accelerate FIR filtering and FFT pipelines commonly required in oscilloscopes, spectrum analyzers, and software-defined radio front-ends. Pin counts at 597 leave ample margin for downstream processing and storage links.
Recommended
ASIC Prototyping and Emulation
Designers use the EP1S30F780C6GA for ASIC prototyping and hardware emulation because the 32,470 LEs can map large RTL blocks before committing to silicon. The 780-FBGA package exposes enough I/O to bring out test points, memory buses, and emulation headers. Quartus II integration with synthesis tools allows rapid incremental compilation cycles that speed verification of multi-million-gate ASIC designs.
Recommended
Military and Aerospace Signal Processing
The EP1S30F780C6GA, when ordered with industrial or military temperature grades, serves in avionics, radar processing, and electronic-warfare subsystems. Its high logic density implements parallel beamforming and pulse-Doppler processing at sample rates unattainable with general-purpose processors. The 780-BGA package supports ruggedized board stacks with underfill and is documented in the Stratix Device Handbook for defense applications.
Recommended
Test and Measurement Instrumentation
Logic analyzers, protocol testers, and bit-error-rate testers leverage the EP1S30F780C6GA's 597 I/O for multi-channel pattern generation and capture. On-chip TriMatrix memory buffers deep acquisition records, while DSP blocks accelerate real-time protocol decoding. Quartus II IP cores for PCIe, Ethernet, and serial RapidIO simplify integrating the FPGA into modular instrumentation chassis.
Recommended
Recommended Products Summary
Engineering reference data for EP1S30F780C6GA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S30F780C6 | EP1S25F780C6 | EP1S25F780C6N | EP1S20F780C6 | EP1S20F780C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same |
| Logic Elements | 32,470 | 32,470 (same) | 25,660 | 25,660 | 18,460 | 18,460 |
| Total RAM Bits | 3,317,184 | 3,317,184 (same) | 1,922,048 | 1,922,048 | 1,663,696 | 1,663,696 |
| User I/O (max) | 597 | 597 | 597 | 597 | 586 | 586 |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Speed Grade | C6 | C6 | C6 | C6 | C6 | C6 |
| Lead-Free (N suffix) | Unknown | Unknown | Unknown | Yes (N suffix) | Unknown | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Higher logic capacity in same 780-FBGA footprint (vs EP1S25F780C6)
- Larger TriMatrix memory than smaller density siblings (vs EP1S20F780C6)
- Single-supply 1.5 V core simplifies power architecture (vs Cross-brand SRAM FPGAs)
Design Notes
Estimated: at a typical Stratix core current of approximately 1.5 A at 1.5 V plus I/O bank power, the EP1S30F780C6GA can draw 3 to 5 W depending on toggle rate. Use a buck regulator with at least 10 percent headroom on the 1.5 V rail, and decouple with 100 nF X7R ceramic capacitors within 5 mm of every supply pin plus bulk polymer or tantalum capacitors on each power plane. The 780-FBGA exposes dozens of GND balls; connect all to a continuous ground plane for thermal dissipation.
The 780-FBGA package has a fine 1.0 mm ball pitch, which typically requires 0.4 mm laser-drilled microvias and via-in-pad technology for reliable assembly. Use a high-Tg FR-4 or low-loss PCB laminate to manage z-axis expansion, and apply underfill during board-level reliability qualification. Per the Stratix Device Handbook pinout guide, all 597 user I/O are assigned to banks; place bank reference voltage pins with local decoupling and verify with the Quartus II pin planner before tape-out.
Stratix SRAM-based FPGAs are volatile and must be configured at every power-up from a configuration device such as an EPC16 or EPCS serial flash; forgetting the configuration source renders the device non-functional. JTAG and passive serial configuration modes are supported but require dedicated pins that must be reserved in the pin planner. Mixing I/O standards across banks without matching VREF voltages causes input latch-up, and exceeding the 1.575 V maximum core voltage instantly destroys the die.
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-mineral compliance were not present in the verified distributor snippets for EP1S30F780C6GA. Intel/Altera discontinued the original Stratix family long before these compliance fields were systematically published, so most reseller listings do not surface them. Industrial (I) temperature grade variants exist for the same die.
