10CX105YF780E5G - Cyclone 10 GX FPGA, 105K LE, 780-BGA | Intel
MPN: 10CX105YF780E5G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $460 | $4,600.00 |
| 100 | $420 | $42,000.00 |
| 500 | $385 | $192,500.00 |
| 1,000 | $350 | $350,000.00 |
Drop-in alternatives for 10CX105YF780E5G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX105YF780I5G
✅ Drop-In✓ In Stock
$115 / Unit
View Datasheet →10CX105YF780I6G
✅ Drop-In✓ In Stock
$1495 / Unit
View Datasheet →10CX105YF780E6G
✅ Drop-In✓ In Stock
$580 / Unit
View Datasheet →10CX105YF780C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10CX105YF780C7G
✅ Drop-In📋 Reference alternative (not in catalog)
10CX105YF780I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10CX105YF780E5G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 105,000 |
| Adaptive Logic Modules (ALMs) | 38,000 |
| Embedded Memory (bits) | 8,641,536 (8.439 Mbit) |
| Number of User I/Os | 284 |
| Number of Logic Cells | 104,000 |
| Process Technology | 20 nm |
| Package | 780-ball FCBGA (F780) |
| Ball Pitch | 1.0 mm |
| Operating Supply Voltage | 0.9 V (core) |
| Speed Grade | 5 |
| Operating Temperature | 0 C to +100 C (commercial) |
| Mounting Style | SMD/SMT |
| Transceivers | GX transceivers up to 12.5 Gbps |
| RoHS Status | Compliant |
10CX105YF780E5G 780-ball fcbga (f780) Pin Configuration Guide
Complete pinout information for 10CX105YF780E5G (780-ball fcbga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX105YF780E5G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CX105YF780E5G is suitable for 6 applications: Industrial Machine Vision, Video Broadcast and Surveillance, Software Defined Radio, PCIe Accelerator Cards, Factory Automation Controllers, 5G Small Cell and Fronthaul.
Industrial Machine Vision
The Intel 10CX105YF780E5G fits industrial machine vision because its 105K logic elements provide the parallel processing fabric needed for pixel-level algorithms (Sobel, Canny, color-space conversion), while the 12.5 Gbps GX transceivers handle CoaXPress or GigE Vision uplink to a host PC. The 8.439 Mbit embedded SRAM buffers full image lines, reducing external DDR traffic. Compared with a CPU-only approach, Cyclone 10 GX delivers deterministic sub-millisecond frame latency critical for high-speed inspection lines. The commercial 0 to +100 C grade suits factory-floor enclosures.
Recommended
Video Broadcast and Surveillance
The 10CX105YF780E5G suits video broadcast and surveillance encoders because its 105K LE fabric supports multi-channel H.264/H.265 pipelines, while 12.5 Gbps transceivers carry SDI (3G/6G/12G-SDI) or SMPTE 2110 IP video streams. The 284 user I/Os enable parallel camera input multiplexing without external crosspoint switches. Compared with ASIC encoders, the FPGA allows field upgradeability for emerging codecs. The FCBGA-780 package routes 12G-SDI signals with controlled impedance for signal-integrity compliance with SMPTE standards.
Recommended
Software Defined Radio
The 10CX105YF780E5G is well-matched to software-defined radio (SDR) baseband processing where 12.5 Gbps transceivers connect directly to RF ADCs/DACs and the 105K LE plus variable-precision DSP blocks implement channelizers, FFTs, and demodulators. Hard floating-point DSP reduces soft logic usage for complex modulation schemes. The 8.439 Mbit embedded memory supports symbol-rate buffering between FFT stages. Compared with a DSP-only implementation, Cyclone 10 GX offers better parallelism for multi-channel MIMO receivers.
Recommended
PCIe Accelerator Cards
The 10CX105YF780E5G includes a hard PCIe Gen2 controller, enabling direct endpoint connectivity to host CPUs without consuming programmable fabric. The 105K LE supports custom compute kernels, and the 284 I/Os provide ample GPIO for card management. Compared with PCIe soft-IP cores, the hard Gen2 controller saves approximately 10K LE and improves latency determinism. The FCBGA-780 package supports the high-speed PCIe SerDes lane routing required by card-edge connectors.
Recommended
Factory Automation Controllers
For factory automation PLC and motion controllers, the 10CX105YF780E5G combines 105K logic elements for IEC 61131-3 logic execution with 12.5 Gbps transceivers for EtherCAT or PROFINET IRT master connectivity. The 284 I/Os handle parallel sensor/actuator wiring, while the hard memory controller interfaces DDR3 for program and trace storage. Compared with microcontroller-based PLCs, Cyclone 10 GX delivers faster deterministic cycle times. The commercial 0 to +100 C grade suits climate-controlled cabinets.
Recommended
5G Small Cell and Fronthaul
The 10CX105YF780E5G's 12.5 Gbps transceivers map cleanly to CPRI and eCPRI fronthaul links between 5G baseband units and radio units. The 105K LE handles PHY-layer digital predistortion and crest-factor reduction algorithms, while hard DSP blocks accelerate FFT/iFFT for PRACH and PUCCH processing. Compared with general-purpose DSPs, Cyclone 10 GX offers lower latency for closed-loop DPD adaptation. The FCBGA-780 footprint supports the high pin density required for multi-sector fronthaul aggregation.
Recommended
Recommended Products Summary
Engineering reference data for 10CX105YF780E5G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX105YF780I5G | 10CX105YF780I6G | 10CX105YF780E6G | 10CX105YF780C8G |
|---|---|---|---|---|---|
| Package | 780-ball FCBGA (F780) | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same | 780-ball FCBGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 105,000 | 105,000 (same silicon) | 105,000 (same silicon) | 105,000 (same silicon) | 105,000 (same silicon) |
| Temperature Grade | Commercial 0C to +100C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +100C | Commercial 0C to +100C |
| Speed Grade | 5 | 5 (same) | 6 (slower) | 6 (slower) | 8 (slower) |
| Embedded Memory | 8.439 Mbit | 8.439 Mbit | 8.439 Mbit | 8.439 Mbit | 8.439 Mbit |
| User I/Os | 284 | 284 (same) | 284 (same) | 284 (same) | 284 (same) |
| Transceivers | 12.5 Gbps GX (Y variant) | 12.5 Gbps GX (same) | 12.5 Gbps GX (same) | 12.5 Gbps GX (same) | 12.5 Gbps GX (same) |
| Process / Family | 20 nm Cyclone 10 GX | 20 nm Cyclone 10 GX (same) | 20 nm Cyclone 10 GX (same) | 20 nm Cyclone 10 GX (same) | 20 nm Cyclone 10 GX (same) |
Key Differentiators
- Same silicon as industrial variant enables cost-flexible inventory (vs 10CX105YF780I5G)
- Higher Fmax at speed grade 5 vs slower alternatives (vs 10CX105YF780E6G)
- Mid-density sweet spot for transceiver-rich designs (vs 10CL120YF780I7G)
Design Notes
The 780-ball FCBGA package with 1.0 mm ball pitch requires a high-density PCB stackup. Use at least an 8-layer board with microvia (HDI) technology for inner-row ball breakout. All transceiver channels need 100-ohm differential routing with length matching to within 0.127 mm (5 mil) per the Intel Cyclone 10 GX PCB design guidelines. Place decoupling capacitors on the bottom side directly beneath the BGA, using 0402 or 0201 sizes for the highest-frequency core and transceiver supplies.
Estimated: With all 12 transceiver channels active at 12.5 Gbps and 105K LE utilization around 70%, total power is approximately 6 to 8 W. The FCBGA-780 has no integrated heatsink, so a thermal pad plus heatsink or substantial PCB copper pour is required. Without thermal management, junction temperature can exceed 100 C in still air at commercial ambient. Use Quartus Prime's Early Power Estimator before board layout to size the thermal solution correctly.
Pin allocation must follow Intel's Cyclone 10 GX pin connection guidelines: unused transceiver channels must be left open with proper AC coupling cap placement, and dedicated clock input pins should be reserved for high-frequency reference clocks feeding the transceivers. The PCIe hard IP pins are bank-specific - do not swap them with GPIO. Run Quartus Pin Planner early to validate the I/O bank assignments against your schematic.
For 12.5 Gbps GX transceivers, follow Intel's transceiver signal-integrity checklist: controlled-impedance stripline on inner layers, length-matched differential pairs, and continuous reference plane beneath the traces. AC-coupling capacitors (typically 100 nF 0402) must be placed near the transmitter side. Reference clock jitter must meet the strict Cyclone 10 GX phase noise requirements; use a low-jitter clock generator such as the Si5341 for system reference.
Compliance Information
RoHS and lead-free per Intel/Alterax product declarations on distributor listings. Not AEC-Q100 qualified (commercial grade FPGA). REACH compliant per Intel product page.
