A3P1000-2FG256M - ProASIC3 FPGA 11K LE 256-FBGA | Microchip
MPN: A3P1000-2FG256M ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.3 | $623.00 |
| 100 | $55.9 | $5,590.00 |
| 500 | $50.2 | $25,100.00 |
| 1,000 | $45.1 | $45,100.00 |
Drop-in alternatives for A3P1000-2FG256M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P1000-2FGG256M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →A3P1000-1FGG256M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1 / Unit
View Datasheet →A3P1000-1FGG256T
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →A3P1000-FGG256M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →A3P1000-FG256M
✅ Drop-In✓ In Stock
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View Datasheet →A3P1000-2FG256M Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| Logic Elements | 11000 LE |
| Number of I/Os | 177 I/O |
| System Frequency | 310 MHz |
| Technology | 130 nm CMOS, flash-based |
| Operating Supply Voltage | 1.5 V |
| Speed Grade | 2 |
| Package / Case | FBGA-256 (256-LBGA) |
| Mounting Style | SMD/SMT |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +85 C |
| Packaging | Tray |
| Programmability | Reprogrammable, non-volatile flash |
| I/O Banks | 4 banks (banked VCCIB) |
| Configuration | Single-chip, instant-on (no external config PROM) |
| Series | A3P1000 |
A3P1000-2FG256M fbga-256 (256-lbga) Pin Configuration Guide
Complete pinout information for A3P1000-2FG256M (fbga-256 (256-lbga) package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P1000-2FG256M.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P1000-2FG256M is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Line Cards, Test and Measurement Instrumentation, Aerospace and Defense Subsystems, Motor Drive and Power Control, Secure Embedded Sensing and IoT Gateways.
Industrial Automation and Control
The A3P1000-2FG256M fits industrial automation controllers because its 11,000 flash-based logic elements implement deterministic state machines, encoder interfaces, and communication bridges without the configuration delay of SRAM FPGAs. With 177 user I/Os across four banked VCCIB domains, it directly interfaces 5V-tolerant-class LVCMOS/LVTTL peripherals alongside LVDS sensor links. Its 0C to +85C rating covers factory-floor enclosures, and the single-chip non-volatile configuration removes boot PROM cost and improves uptime in systems that must be operational within milliseconds of power application.
Recommended
Communications and Networking Line Cards
In networking line cards, the A3P1000-2FG256M provides glue logic, bus bridging, and framer interfacing at speed grade 2 timing (system performance up to 310 MHz), which is sufficient for many parallel data-path and backplane interfaces. The FBGA-256 footprint conserves board area on dense cards, while LVDS-capable I/O banks support high-speed differential links between PHYs and switch ASICs. Non-volatile configuration eliminates the external programming flash and its boot-time window, simplifying hot-swap card management and reducing BOM count on cost-sensitive telecom hardware.
Recommended
Test and Measurement Instrumentation
Bench and modular instruments benefit from the A3P1000's reprogrammability: test sequencers, trigger logic, and instrument bus glue logic can be field-updated via JTAG using Microchip Libero-generated bitstreams. The 11K-LE fabric implements counters, pattern generators, and capture FIFOs with speed grade 2 timing. Instant-on flash configuration means the instrument is ready as soon as power is applied, an advantage in rack systems where all cards must enumerate within a strict power-up window. Four I/O banks permit mixed-voltage interfacing to legacy TTL instrument backplanes and modern LVDS front ends.
Recommended
Aerospace and Defense Subsystems
ProASIC3 flash FPGAs are widely used in defense subsystems because the configuration bitstream resides in on-chip non-volatile flash, reducing the risk of bitstream interception and eliminating SEU-prone external configuration memory at boot. The A3P1000-2FG256M handles payload interface control, housekeeping logic, and sensor aggregation with 177 I/Os and deterministic instant-on behavior. While this commercial temperature part is rated 0C to +85C, its architecture carries over to the family's high-reliability heritage, and designs migrate readily across ProASIC3 density and package options via the published Microchip migration notes.
Recommended
Motor Drive and Power Control
The A3P1000-2FG256M implements PWM generation, dead-time insertion, and rotary/incremental encoder decoding for motor drives, offloading hard-real-time tasks from the host MCU. Its 310 MHz-class fabric allows fine PWM resolution at typical carrier frequencies, and instant-on configuration ensures drive outputs are safely tri-stated and logic active the moment auxiliary power appears. Banked VCCIB supplies let designers tie FPGA I/O directly to 3.3V gate-driver logic and 2.5V feedback circuits on the same device. Supervisory circuitry on board ensures clean sequencing between the 1.5V core and I/O rails.
Recommended
Secure Embedded Sensing and IoT Gateways
For IoT gateways and secure sensor aggregation, the A3P1000's flash fabric provides hardware-rooted logic that is present from power-up, useful for tamper-detect interlocks and secure boot handshakes with an accompanying MCU. The 11K-LE capacity implements sensor interface glue logic, parallel-to-serial bridges, and crypto-accelerator front-end plumbing, while 177 I/Os connect multiple sensor buses simultaneously. The compact FBGA-256 suits small gateway boards, and field reprogrammability allows feature updates in deployed hardware without changing the PCB, extending product life and reducing maintenance logistics.
Recommended
Recommended Products Summary
Engineering reference data for A3P1000-2FG256M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P1000-2FGG256M | A3P1000-1FGG256M | A3P1000-FGG256M | A3P1000-FG256M |
|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 - same footprint | FBGA-256 - same footprint | FBGA-256 - same footprint | FBGA-256 - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 11000 LE | 11000 LE | 11000 LE | 11000 LE | 11000 LE |
| User I/O | 177 I/O | 177 I/O | 177 I/O | 177 I/O | 177 I/O |
| Speed Grade | 2 | 2 - same | 1 - slower | standard - slower | standard - slower |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0C to +85C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Configuration | Flash, single-chip, instant-on | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip |
Key Differentiators
- Fastest grade in the 256-ball FG/FGG family on this footprint (vs A3P1000-FG256M)
- Instant-on non-volatile flash configuration (vs SRAM FPGAs of similar density)
- Trade-off: lower speed grade variants cost less on the same footprint (vs A3P1000-1FGG256M)
Design Notes
The A3P1000-2FG256M requires a 1.5V core rail plus independent VCCIB rails for each of the four I/O banks. Sequence the core rail before or together with I/O rails per the ProASIC3 power-up guidance in the datasheet, and use a supervisor such as a voltage monitor to hold the FPGA in reset until all rails are valid. Estimated: typical core current for a mid-utilization 11K-LE design is on the order of tens of milliamps, but dynamic current scales with clock frequency and toggle rate, so verify with Libero power estimation for your design.
The 256-ball FBGA with 177 signal I/Os generally requires at least a 4-layer PCB with dedicated power and ground planes to break out balls and provide low-impedance VCCIB bank supplies. Place 100nF decoupling capacitors close to each VCC/VCCIB pin pair plus bulk capacitance per rail. Ball pitch and escape routing follow the footprint available from SnapEDA (Altium, KiCad, Allegro exports) - do not hand-draw the 256-ball land pattern.
Only I/O standards with compatible voltage levels may share the same VCCIB bank; package VCCIBx pins are hard-routed to their banks per the Microchip ProASIC3 migration application note. Assign banks early in pin planning - moving a banked voltage later can force a PCB respin. Also note that substituting a different speed grade (e.g., 1 or standard instead of grade 2) requires re-running static timing analysis in Libero to confirm timing closure.
Compliance Information
Compliance status not stated in provided web data; the FGG (lead-free) package variants exist within the same family, suggesting the FG variant may predate full lead-free conversion. Verify on the Microchip product page.
