A3P250-2PQG208I - ProASIC3 FPGA 250K Gates | Microchip
MPN: A3P250-2PQG208I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.2 | $392.00 |
| 100 | $35.8 | $3,580.00 |
| 500 | $32.4 | $16,200.00 |
| 1,000 | $29.9 | $29,900.00 |
Drop-in alternatives for A3P250-2PQG208I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P250-2PQG208
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$23.71 / Unit
View Datasheet →A3P250-PQG208I
✅ Drop-In📋 Reference alternative (not in catalog)
A3P250-1PQG208I
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$16.19 / Unit
View Datasheet →A3P250L-1PQG208I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$44.6 / Unit
View Datasheet →A3P125-2PQG208I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$18.75 / Unit
View Datasheet →A3P400-2PQG208
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$56.9 / Unit
View Datasheet →A3P250-2PQG208I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| Number of Gates | 250K |
| Logic Elements (LEs) | 3000 |
| User I/O | 151 |
| User Flash Memory | 36864 bits |
| Maximum Operating Frequency | 310 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Non-volatile flash, single-chip |
| Speed Grade | -2 |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 208-BFQFP (PQG208) |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Series | A3P250 ProASIC3 |
| Programming | In-system reprogrammable via JTAG |
A3P250-2PQG208I 208-bfqfp (pqg208) Pin Configuration Guide
Complete pinout information for A3P250-2PQG208I (208-bfqfp (pqg208) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P250-2PQG208I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P250-2PQG208I is suitable for 6 applications: Industrial Automation Control, Aerospace and Defense Secure Logic, Medical Instrumentation, Communications Bridging and Glue Logic, Embedded Control and Instant-On Systems, Test and Measurement Equipment.
Industrial Automation Control
The A3P250-2PQG208I fits industrial automation because its 3000 logic elements and 151 user I/Os are sufficient for motor sequencers, sensor-fusion glue logic, and fieldbus interface bridging, while the industrial -40C to +85C rating matches factory-floor environments. Its non-volatile flash configuration means a PLC board powers up instantly with logic active, with no bootloader delay or external configuration PROM to fail in high-vibration installations. The 1.5V core keeps dynamic power low in always-on control panels. Deployed between sensor headers and a host MCU or backplane, it absorbs protocol conversion and timing-critical interlocks; the -2 speed grade supports up to 310 MHz system performance, far above typical industrial clock rates, leaving ample timing margin.
Recommended
Aerospace and Defense Secure Logic
Flash-based ProASIC3 devices are a mainstay in aerospace and defense electronics because the configuration lives in non-volatile flash switches that are inherently immune to the configuration-upset mechanisms affecting SRAM FPGAs, eliminating scrubbing circuitry. The A3P250-2PQG208I provides 250K gates for secure boot controllers, interface translators, and fault-tolerant voting logic, with a single-chip build that shrinks board area and reduces the supply chain to one programmable device. Instant-on behavior satisfies power-up sequencing requirements in avionics, and JTAG live reprogramming supports controlled design updates in the field. Designers should verify programmatic readback disable and security fuse settings in Libero SoC before flight release.
Recommended
Medical Instrumentation
In medical diagnostic and monitoring equipment, the A3P250-2PQG208I serves as deterministic interface and control logic between analog front ends, ADCs, and a host processor. Its 151 user I/Os comfortably bond out parallel ADC data buses, and the 310 MHz-capable -2 fabric implements real-time filtering triggers with certainty that software cannot match. Non-volatile configuration guarantees that instrument calibration glue logic is active the moment power is applied, an important property for devices that must pass power-on self-test before patient use. The industrial temperature rating covers cold-storage and sterilization-adjacent environments, and the 1.5V core limits internal heating inside sealed enclosures with restricted airflow.
Recommended
Communications Bridging and Glue Logic
The A3P250-2PQG208I is well suited to bridging legacy and modern interfaces in networking and telecom line cards. Its 3000 LEs implement dual-UART aggregators, bus width converters, PCI-style handshaking, and custom serial framing, while 151 I/Os support wide parallel buses at 3.3V-tolerant VCCI banks. Because configuration is flash-resident, a line card resumes traffic forwarding instantly after hot replacement, with no bitstream load window. The -2 speed grade supplies ample setup/hold margin at typical backplane clock rates up to 100 MHz-plus, and the low-cost PQFP-208 keeps the total bill of materials competitive against SRAM FPGA plus configuration-flash alternatives for medium-volume communication equipment.
Recommended
Embedded Control and Instant-On Systems
For embedded systems that must be functional within milliseconds of power application, such as power-supply sequencing controllers, security interlocks, and automotive-adjacent test rigs, the A3P250-2PQG208I's flash configuration removes the SRAM-FPGA boot penalty entirely. The 36864 bits of user flash can also store board IDs, calibration constants, or a small firmware table, consolidating functions that would otherwise need an external EEPROM. Designers pair it with a small MCU for supervisory tasks and use the FPGA fabric for cycle-accurate I/O timing; the JTAG interface supports in-system updates during manufacturing without desoldering. The tray-packed PQFP-208 suits both hand assembly of prototypes and automated production lines.
Recommended
Test and Measurement Equipment
Bench and automated test instruments use the A3P250-2PQG208I as a timing and control fabric for stimulus/response subsystems. The -2 speed grade's 310 MHz system performance supports high-resolution edge generation, while the large I/O count fans out to relay matrices, connector breakpoints, and per-channel comparators. Flash configuration means a warmed-up instrument can be power-cycled during calibration with logic immediately operational, cutting test-station cycle time. Deterministic fabric timing gives reproducible channel-to-channel skew that software-timed MCU solutions cannot achieve, and the industrial temperature rating tolerates unventilated rack environments. Libero SoC timing reports document margins for calibration certificates.
Recommended
Recommended Products Summary
Engineering reference data for A3P250-2PQG208I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P250-2PQG208 | A3P250-PQG208I | A3P250-1PQG208I | A3P125-2PQG208I | A3P400-2PQG208 |
|---|---|---|---|---|---|---|
| Package | PQFP-208 (PQG208) | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gate Density | 250K | 250K | 250K | 250K | 125K | 400K |
| User I/O | 151 | 151 | 151 | 151 | 151 | 202 |
| Speed Grade | -2 | -2 | standard | -1 | -2 | -2 |
| Operating Temperature | -40C to +85C (I) | 0C to +70C (C) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | 0C to +70C (C) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile |
| User Flash Memory | 36864 bits | 36864 bits | 36864 bits | 36864 bits | 36864 bits | [DATA_NEEDED] |
Key Differentiators
- Industrial temperature range in a cost-optimized PQFP (vs A3P250-2PQG208)
- Fastest -2 timing grade of the PQ208 industrial family (vs A3P250-1PQG208I)
- Single-chip flash configuration (vs SRAM FPGAs of similar density)
- In-place density migration on the same footprint (vs A3P400-2PQG208)
Design Notes
The A3P250-2PQG208I requires separate 1.5V core (VCCA), 2.5V (VPTB/programming), and per-bank I/O supplies (VCCI) per the ProASIC3 datasheet. Estimated: dynamic power scales with clock frequency and toggle rate; at 310 MHz maximum system performance with a fully active fabric, budget for the datasheet power calculator (available in Libero SoC SmartPower) rather than worst-case tables, which are pessimistic. Decouple each supply pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10uF per rail.
The PQFP-208 fine-pitch package (0.5 mm lead pitch) requires a careful land pattern per the manufacturer's recommended footprint and solder-mask-defined pads for reliable reflow. Use a minimum 4-layer stackup with a solid ground plane to control return paths for the 151 I/O signals; route the JTAG chain (TDI, TDO, TMS, TCK) with series termination close to the driver to prevent ringing at programming frequencies. Keep the exposed PQFP center region clear for probe access during in-system programming.
Do not substitute the commercial A3P250-2PQG208 into an industrial -40C application: timing derating below 0C is not guaranteed and field failures are common in cold-start environments. Also confirm the speed grade suffix (-1, -2, standard) matches your Libero SoC timing constraints; a slower grade may pass place-and-route but fail post-layout timing at temperature. Finally, use VCCI bank voltages consistent with the devices connected to each I/O bank before programming to avoid latch-up.
Compliance Information
Compliance status not explicitly stated in the provided web data; verify on the Microchip product page or distributor compliance documentation before production release.
