A3P600L-1FGG484 - 600K Gate Flash FPGA | Microchip | FBGA-484
MPN: A3P600L-1FGG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.2 | $45.20 |
| 10 | $41.8 | $418.00 |
| 100 | $37.5 | $3,750.00 |
| 500 | $33.9 | $16,950.00 |
| 1,000 | $30.4 | $30,400.00 |
Drop-in alternatives for A3P600L-1FGG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600L-1FGG484I
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →A3P600L-FGG484I
✅ Drop-In✓ In Stock
$41.35 / Unit
View Datasheet →A3P600L-FG484
✅ Drop-In✓ In Stock
$85.9 / Unit
View Datasheet →A3P600-1FGG484
✅ Drop-In✓ In Stock
$52.4 / Unit
View Datasheet →A3PE600-1FGG484
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600L-1FGG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| Total Gates | 600000 |
| Logic Cells (CLBs) | 13824 |
| Maximum Clock Frequency | 350 MHz |
| Core Supply Voltage | 1.2 V |
| I/O Count | 235 |
| RAM Bits | 110592 |
| Package | 484-FBGA (23x23 mm, 1.00 mm pitch) |
| Technology | 130 nm CMOS |
| Flash*Freeze Current | 5 mA (typical) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (Green) |
| Terminal Pitch | 1.00 mm |
| Height | 2.23 mm |
A3P600L-1FGG484 484-fbga (23x23 mm, 1.00 mm pitch) Pin Configuration Guide
Complete pinout information for A3P600L-1FGG484 (484-fbga (23x23 mm, 1.00 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600L-1FGG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600L-1FGG484 is suitable for 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P600L-1FGG484 is ideal for industrial control systems due to its low power consumption and instant-on capability. With 235 I/Os and 600K gates, it can handle motor control logic, sensor interfacing, and communication protocols. The Flash*Freeze mode allows the FPGA to enter a low-power state when idle, reducing heat and energy costs in factory automation. Its 1.2V core and 130nm process ensure reliable operation in harsh environments. The device supports various I/O standards, enabling direct connection to industrial sensors and actuators. Its reprogrammability allows for firmware updates in the field, reducing downtime. The 484-FBGA package provides a compact footprint for space-constrained control panels. According to the datasheet, the FPGA can operate at up to 350MHz, sufficient for real-time control loops. The embedded RAM supports data buffering for communication interfaces. Overall, the A3P600L offers a balance of performance and power efficiency, making it a cost-effective solution for industrial applications.
Recommended
Automotive Electronics
In automotive electronics, the A3P600L-1FGG484 is used for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS). Its low power consumption is critical for battery-powered vehicles, and the instant-on capability ensures immediate response when the ignition is turned on. The 235 I/Os allow interfacing with various sensors and actuators, while the 600K gates provide enough logic for complex control algorithms. The Flash*Freeze mode enables the FPGA to enter a low-power state when the vehicle is off, preserving battery life. The device operates over a wide temperature range (industrial grade available), making it suitable for under-hood applications. Its reprogrammability allows for over-the-air updates, a growing requirement in modern vehicles. The 484-FBGA package is compact enough for space-constrained automotive modules. According to Microchip, the ProASIC3L family is designed for low-power and high-reliability applications, making it a trusted choice for automotive designs.
Recommended
Communications Infrastructure
The A3P600L-1FGG484 is well-suited for communications infrastructure such as base stations, routers, and switches. Its 600K gates and 235 I/Os enable implementation of protocol processing, packet buffering, and interface bridging. The low power consumption reduces cooling requirements in densely packed equipment racks. The device supports multiple I/O standards, allowing direct connection to high-speed transceivers and memory interfaces. The embedded RAM can be used for FIFO buffers and packet queues. The Flash*Freeze mode allows the FPGA to enter a low-power state during idle periods, saving energy in always-on infrastructure. The 350MHz clock frequency is sufficient for many communication protocols. The 484-FBGA package provides a compact footprint for line cards and modules. According to the datasheet, the ProASIC3L family is designed for low-power and high-reliability applications, making it suitable for 24/7 operation. Its reprogrammability enables field upgrades to support new standards.
Recommended
Consumer Electronics
In consumer electronics, the A3P600L-1FGG484 is used in smart home devices, wearables, and portable electronics. Its low power consumption extends battery life, and the instant-on capability provides a seamless user experience. The 235 I/Os allow interfacing with displays, sensors, and wireless modules. The 600K gates provide enough logic for user interface control, data processing, and connectivity. The Flash*Freeze mode enables the device to enter a low-power state when not in use, preserving battery life. The 1.2V core voltage is compatible with modern battery technologies. The 484-FBGA package is compact enough for portable devices. According to Microchip, the ProASIC3L family is designed for low-power applications, making it ideal for battery-powered consumer products. Its reprogrammability allows for feature updates and bug fixes after deployment. The device's low static power (5mA in Flash*Freeze) is a key advantage for always-on devices.
Recommended
Medical Devices
The A3P600L-1FGG484 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its low power consumption is essential for battery-powered devices, and the instant-on capability ensures immediate readiness. The 235 I/Os allow interfacing with sensors, displays, and communication interfaces. The 600K gates provide enough logic for signal processing, data logging, and control algorithms. The Flash*Freeze mode enables the device to enter a low-power state when not in use, extending battery life. The device's reliability and long-term availability make it suitable for medical applications where product lifecycles are long. The 484-FBGA package is compact enough for portable devices. According to Microchip, the ProASIC3L family is designed for low-power and high-reliability applications, making it a trusted choice for medical electronics. Its reprogrammability allows for firmware updates to meet evolving regulatory requirements.
Recommended
Aerospace and Defense
The A3P600L-1FGG484 is used in aerospace and defense applications such as avionics, satellite systems, and military radios. Its low power consumption is critical for space-constrained and power-limited platforms. The instant-on capability ensures immediate operation after power-up, which is essential for safety-critical systems. The 235 I/Os allow interfacing with various sensors and communication links. The 600K gates provide enough logic for signal processing, encryption, and control. The Flash*Freeze mode enables the device to enter a low-power state during idle periods, conserving power in battery-operated equipment. The device's radiation tolerance (if specified) and wide temperature range make it suitable for harsh environments. The 484-FBGA package is compact for avionics modules. According to Microchip, the ProASIC3L family is designed for high-reliability applications, making it a trusted choice for defense and aerospace. Its reprogrammability allows for secure field updates.
Recommended
Recommended Products Summary
Engineering reference data for A3P600L-1FGG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-1FGG484I | A3P600L-FGG484 | A3P600L-FG484 | A3P600-1FGG484 | A3PE600-1FGG484 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total Gates | 600000 | 600000 | 600000 | 600000 | 600000 | 600000 |
| Logic Cells | 13824 | 13824 | 13824 | 13824 | 13824 | 13824 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.5 V | 1.5 V |
| Max Clock Frequency | 350 MHz | 350 MHz | [DATA_NEEDED] | [DATA_NEEDED] | 350 MHz | 350 MHz |
| Flash*Freeze | Yes | Yes | Yes | Yes | No | No |
| I/O Count | 235 | 235 | 235 | 235 | 235 | 235 |
Key Differentiators
- Flash*Freeze technology for ultra-low static power (vs A3P600-1FGG484)
- Lower core voltage (1.2V vs 1.5V) (vs A3P600-1FGG484)
- Instant-on capability without external boot memory (vs SRAM-based FPGAs)
Design Notes
The A3P600L-1FGG484 requires a 1.2V core supply. Use a low-dropout regulator (LDO) or a DC-DC converter with low ripple to power the core. Decouple each VCC pin with a 0.1uF ceramic capacitor and add a 10uF bulk capacitor near the power entry point. The Flash*Freeze mode reduces static current to 5mA, so ensure the power supply can handle the transient when entering/exiting this mode. Estimated: For a 1.2V supply and 5mA static current, power dissipation is 6mW in Flash*Freeze, but dynamic power depends on logic activity and clock frequency.
For the 484-FBGA package, follow the layout guidelines in the Microsemi A3P600L datasheet. Use a 4-layer or more PCB with dedicated power and ground planes. Place decoupling capacitors as close to the BGA balls as possible, ideally on the opposite side of the board. Ensure the thermal pad (if present) is properly connected to ground for heat dissipation. The 1.00mm pitch requires careful routing; use via-in-pad or microvias for high-density designs. Estimated: The 23x23mm package with 484 balls requires at least 4 signal layers for routability.
One common pitfall is neglecting the Flash*Freeze pin handling. The Flash*Freeze pin must be tied to a defined logic level (high or low) to avoid unintended entry into low-power mode. Also, ensure the core voltage is within the specified range (1.2V +/- 5%) to avoid reliability issues. Do not exceed the maximum clock frequency of 350MHz; use the PLLs for clock management. When migrating from A3P600 to A3P600L, remember to change the core voltage from 1.5V to 1.2V and update the power supply design.
Compliance Information
The A3P600L-1FGG484 is listed as Green (RoHS compliant) in the datasheet. Other compliance details are not specified in the provided data.
