A3P125-2PQG208I - ProASIC3 Flash FPGA 1.5KLE | Microchip
MPN: A3P125-2PQG208I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.2 | $262.00 |
| 100 | $23.1 | $2,310.00 |
| 500 | $20.4 | $10,200.00 |
| 1,000 | $18.75 | $18,750.00 |
Drop-in alternatives for A3P125-2PQG208I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P125-1PQG208I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P125-2PQG208
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$22.3 / Unit
View Datasheet βA3P125-PQG208I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P125-1PQG208
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P125-2PQG208M
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P125-2PQG208I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| Logic Elements | 1500 LEs |
| System Gates | 125K gates |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V |
| Number of User I/Os | 133 |
| Number of Registers | 36864 bits system-equivalent entry (per DigiKey listing) |
| Configuration Memory | Nonvolatile flash (single chip, Instant On) |
| Speed Grade | -2 |
| Temperature Grade | Industrial (I) |
| Package | 208-BFQFP (PQG208) |
| Mounting Type | Surface Mount |
| Reprogrammability | Yes, in-system reprogrammable |
| Security | Flash lock / live-at-power-up design security |
| RoHS Status | Lead free per distributor listing (Kynix: LEAD FREE) |
A3P125-2PQG208I 208-bfqfp (pqg208) Pin Configuration Guide
Complete pinout information for A3P125-2PQG208I (208-bfqfp (pqg208) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P125-2PQG208I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P125-2PQG208I is suitable for 6 applications: Industrial Control and Automation, Secure Single-Chip Glue Logic and Bus Bridging, Avionics and Defense Subsystems, Portable and Battery-Powered Instrumentation, ASIC Prototyping and Low-Volume Replacement, IoT Edge Nodes and Smart Sensors.
Industrial Control and Automation
The A3P125-2PQG208I fits industrial control because its industrial temperature rating, nonvolatile Instant-On fabric, and 310 MHz system performance cover deterministic sequencing, sensor interfacing, and glue logic in PLCs, motor drives, and factory nodes. In typical use it bridges between an MCU and peripherals, implementing state machines and safety interlocks across the 133 user I/Os. Because configuration resides in on-chip flash on the 130 nm process, the design is active within microseconds of power-up with no external boot device, improving system availability and simplifying the BOM versus SRAM FPGAs.
Recommended
Secure Single-Chip Glue Logic and Bus Bridging
Legacy bus and interface bridging is a natural fit for the A3P125-2PQG208I: its 1,500 logic elements suffice for address decoders, memory controllers, and protocol translators, while flash-based design security resists bitstream extraction that plagues SRAM FPGAs. Single-chip Instant-On operation means bridge logic is functional before the host CPU finishes booting, meeting timing requirements of early-bus-initiation protocols. The 208-pin PQFP with 133 I/Os provides enough pins for wide parallel buses, and the -2 speed grade supports the modest timing targets these bridges require.
Recommended
Avionics and Defense Subsystems
Microchip positions ProASIC3 as a cost-effective ASIC replacement for avionics and defense markets, and the A3P125-2PQG208I inherits that positioning: nonvolatile flash avoids configuration-write vulnerabilities at power-up, a concern in secure platforms. The industrial-grade -I device serves non-critical defense and avionics subsystems such as telemetry formatting, sensor aggregation, and discrete interface conditioning. The 130 nm flash process offers radiation-tolerant configuration storage relative to SRAM cells, and the reprogrammable fabric supports in-field capability updates without new silicon, reducing lifecycle cost for long-deployment programs.
Recommended
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the A3P125-2PQG208I's low static power on the 1.5V core and its single-chip flash architecture that removes the standby power and board area of an external configuration PROM. The 208-pin PQFP is mechanically robust for field equipment, and 133 user I/Os handle front-end multiplexing, display control, and sensor timing. Instant-On behavior lets the instrument capture events immediately upon trigger, which matters in data loggers and handheld test gear. The -2 speed grade comfortably covers timing-critical acquisition sequencing without the cost of faster grades.
Recommended
ASIC Prototyping and Low-Volume Replacement
Microchip markets ProASIC3 explicitly as an ASIC replacement with low total cost of ownership, and the A3P125-2PQG208I is the entry point for that workflow. Designers map small ASIC netlists (up to roughly 1,500 LEs) into the fabric for prototyping or bridge production while ASIC tooling is in progress. Because the device is reprogrammable, RTL respins cost no NRE, and Instant-On flash startup matches ASIC power-up behavior that SRAM FPGAs cannot replicate without external configuration. The 208-pin PQFP also simplifies prototyping boards compared with fine-pitch BGA alternatives.
Recommended
IoT Edge Nodes and Smart Sensors
IoT edge nodes use the A3P125-2PQG208I to offload deterministic tasks from the host MCU: pulse capture, PWM generation, sensor timing, and protocol framing across the 133 I/Os. The flash fabric's low quiescent draw on the 1.5V core suits battery- and energy-harvesting-powered nodes, and Instant-On operation lets the node respond to wake events instantly. Design security through flash lock protects proprietary sensor algorithms at the edge, and reprogrammability enables over-the-air logic field updates via the host MCU when new sensor behaviors are required in deployed fleets.
Recommended
Recommended Products Summary
Engineering reference data for A3P125-2PQG208I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P125-1PQG208I | A3P125-2PQG208 | A3P125-PQG208I | A3P125-1PQG208 |
|---|---|---|---|---|---|
| Package | 208-BFQFP (PQG208) | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 1500 LEs | 1500 LEs | 1500 LEs | 1500 LEs | 1500 LEs |
| Speed Grade | -2 | -1 (slower) | -2 (same) | Standard (slower) | -1 (slower) |
| Temperature Grade | Industrial (I) | Industrial (I) | Commercial | Industrial (I) | Commercial |
| User I/Os | 133 | 133 | 133 | 133 | 133 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Type | Nonvolatile flash (Instant On) | Nonvolatile flash (Instant On) | Nonvolatile flash (Instant On) | Nonvolatile flash (Instant On) | Nonvolatile flash (Instant On) |
Key Differentiators
- Faster timing margin in same footprint (vs A3P125-1PQG208I)
- Industrial temperature guarantee (vs A3P125-2PQG208)
- Nonvolatile Instant-On flash vs SRAM FPGAs (vs Comparable SRAM FPGA families)
Design Notes
The A3P125-2PQG208I requires a 1.5V core supply plus per-bank I/O voltages. Estimated: power-up sequencing recommendations in the ProASIC3 datasheet allow the core and I/O rails in any order, but add bulk (10-22 uF) and per-bank decoupling (0.1 uF per VCCIO pin) close to the 208-pin QFP power pins. Flash programming during in-system updates draws additional transient current, so size the core rail regulator margin above the static active current specified in the datasheet power tables.
The 208-pin QFP has a 0.5 mm pin pitch; use care in stencil design (0.12-0.13 mm stencil) and generous paste aperture reduction to avoid solder bridging on fine-pitch leads. Place the JTAG header with short traces to the TMS/TCK/TDI/TDO pins, since FlashPro programming reliability depends on signal integrity on TCK. Keep configuration-related pins per datasheet recommendations even though configuration is internal flash.
I/O bank voltage constraints are the most common error when migrating designs between ProASIC3 packages: a pin assignment valid on the 208-pin PQFP may violate bank VCCIO rules if moved to a smaller package, and vice versa. Verify all I/O standard assignments per bank in Libero before release. Also, do not substitute commercial-grade A3P125-2PQG208 for the -I industrial part in applications below 0C - the temperature suffix matters for guaranteed timing.
Compliance Information
Kynix distributor listing explicitly marks A3P125-2PQG208I as LEAD FREE. Automotive ProASIC3 variants exist as a separate family; this standard part is not AEC-Q100 qualified. REACH and conflict minerals status should be confirmed on the Microchip product page.
