ATSAM3SD8CA-CUR - 64MHz Cortex-M3 MCU 512KB Flash | Microchip
MPN: ATSAM3SD8CA-CUR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.4451 | $3.45 |
| 10 | $3.25 | $32.50 |
| 100 | $3.05 | $305.00 |
| 500 | $2.85 | $1,425.00 |
| 1,000 | $2.68 | $2,680.00 |
ATSAM3SD8CA-CUR Overview
A microcontroller (MCU) is a single-chip computer that integrates a processor core, program memory, data memory, and a rich set of peripherals on one die. Within the semiconductor hierarchy, the ATSAM3SD8CA-CUR belongs to the SAM3S family of flash-based MCUs under the ARM Cortex-M embedded processor class, positioned for general-purpose embedded control where a full operating system is not required. Its flash-based program storage allows field firmware updates, while on-chip SRAM holds run-time data and stacks.
Key features include 79 general-purpose I/O lines, a wide 1.62V to 3.6V operating supply range, and industrial-grade operation from -40C to +85C. Connectivity peripherals cover EBI/EMI external bus, I2C (TWI), IrDA, a memory card interface, SPI, SSC (synchronous serial controller), UART/USART, and full-speed USB, enabling flexible system expansion. The device also integrates 10-bit and 12-bit ADC converters plus a 12-bit DAC, an internal oscillator, and is pin-to-pin compatible with AT91SAM7S legacy products (64-pin versions) and SAM3S4/2/1 family members.
Technically, the ARM Cortex-M3 core provides a 3-stage pipeline, Thumb-2 instruction set, and a nested vectored interrupt controller for deterministic interrupt latency. The embedded flash controller supports wait-state tuning for reliable 64 MHz execution, and the multiple serial controllers offload communication tasks from the CPU.
Typical applications include industrial automation nodes, consumer electronics, and medical devices, where the combination of USB connectivity, precision analog, and small 9x9 mm BGA footprint fits space-constrained designs.
When designing with this device, verify that the 1.62V-3.6V supply rail and the 100-TFBGA ball layout match your PCB fabrication capabilities, since fine-pitch BGA assembly requires appropriate process control.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAM3SD8CA-CUR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3SD8CA-CUR (same form factor and footprint) — differing in Series, Core Processor, Maximum Clock Frequency, Temperature Grade, Connectivity.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM3SD8CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2.41 / Unit
View Datasheet →ATSAM4N8CA-CUR
✅ Drop-In✓ In Stock
$1.74 / Unit
View Datasheet →ATSAM4N8CA-CU
✅ Drop-In✓ In Stock
$2.02 / Unit
View Datasheet →ATSAM3S8CA-CUR
✅ Drop-In ⚠️ 参数待验证✓ In Stock
Contact for price
View Datasheet →ATSAM3SD8CA-CUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max Clock Speed | 64 MHz |
| Flash Memory | 512 KB (512K x 8) |
| SRAM | 64 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Operating Temperature | -40C to +85C |
| Number of I/O | 79 |
| ADC Resolution | 10-bit, 12-bit |
| DAC Resolution | 12-bit |
| Connectivity | EBI/EMI, I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB |
| Oscillator | Internal oscillator |
| Package | 100-TFBGA (9x9 mm) |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Series | SAM3S |
| Program Memory Type | FLASH |
ATSAM3SD8CA-CUR 100-tfbga (9x9 mm) Pin Configuration Guide
Pin configuration for ATSAM3SD8CA-CUR (100-tfbga (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3SD8CA-CUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3SD8CA-CUR is suitable for 6 applications: Industrial Automation Nodes, Medical Devices, Consumer Electronics, Embedded Data Loggers, USB Peripheral Controllers, Legacy AT91SAM7S Product Migration.
Industrial Automation Nodes
The ATSAM3SD8CA-CUR fits industrial automation nodes because its -40C to +85C industrial temperature rating, 1.62V-3.6V supply tolerance, and 79 GPIO lines allow direct interfacing with sensors, actuators, and backplane logic without level-shifting overhead. The EBI/EMI external bus controller can attach memory-mapped peripherals or displays, while multiple UART/USART, SPI, and I2C ports link PLC I/O modules and field devices. The 10/12-bit ADC digitizes analog process signals such as 4-20 mA loops after conditioning, and the internal oscillator reduces BOM cost in clock-tolerant designs. Using the Cortex-M3 at 64 MHz, a typical node scans digital inputs, runs control loops, and reports over RS-485-style UART links with deterministic interrupt latency from the NVIC.
Recommended
Medical Devices
Distributor data identifies medical devices as a typical application for the ATSAM3SD8CA-CUR. The on-chip 12-bit ADC supports patient-sensor acquisition with adequate resolution for physiological signals, while the 12-bit DAC can generate stimulus or alarm tones. USB full-speed connectivity provides a standard data pathway to host PCs for monitoring equipment, and the SSC peripheral synchronizes external audio or front-end converters. The wide 1.62V-3.6V supply range suits battery-powered portable diagnostics, and the 9x9 mm TFBGA footprint fits handheld enclosures. Note that the MCU itself carries no medical certification: system-level compliance (for example IEC 60601 design practices and ISO 13485 quality processes) is the responsibility of the device manufacturer, and the SAM3S family's long product lifecycle supports multi-year medical product roadmaps.
Recommended
Consumer Electronics
In consumer electronics, the ATSAM3SD8CA-CUR combines USB device connectivity, a memory card interface, and audio-capable SSC in a single 64 MHz Cortex-M3, which suits peripherals such as docking accessories, card readers, and interactive controllers. The memory card interface reads and writes SD-class media directly, eliminating an external card controller, while full-speed USB handles data transfer at up to 12 Mbps. The 12-bit DAC supports audio cue generation and simple tone output. At approximately $3.45 per unit as of 2026-09-19, the cost point is competitive for volume consumer products, and the internal oscillator removes the need for an external crystal in timing-tolerant applications, reducing bill-of-materials cost and PCB area in compact designs.
Recommended
Embedded Data Loggers
The ATSAM3SD8CA-CUR is well suited to data logger applications: the memory card interface writes directly to removable storage, the 512 KB internal flash buffers configuration and firmware, and the 64 KB SRAM holds time-stamped sample buffers. Multiple USARTs accept streams from GPS receivers, sensors, or modems, while the 12-bit ADC digitizes analog channels. The wide 1.62V-3.6V input range allows direct operation from Li-ion or three-cell alkaline supplies without an LDO in some topologies, and low-power modes of the Cortex-M3 extend battery life between wake-ups. Firmware can be field-updated over USB, which is valuable for deployed loggers. The -40C to +85C rating supports outdoor and cold-chain monitoring deployments without component derating.
Recommended
USB Peripheral Controllers
With integrated full-speed USB device capability, the ATSAM3SD8CA-CUR serves as a self-contained USB peripheral controller for custom HID, CDC, or vendor-class devices. The 64 MHz Cortex-M3 processes USB transactions through the on-chip USB peripheral with DMA support, while 512 KB flash stores complete firmware including USB descriptors and class drivers. Additional UART/USART and SPI ports let the device bridge USB to legacy serial buses, printers, or sensors, and the EBI/EMI interface can attach external memory for large buffering. Compared with discrete USB interface chips, integration reduces BOM count and development effort. The 12-bit DAC further enables USB-controlled analog output modules used in test fixtures and industrial command interfaces.
Recommended
Legacy AT91SAM7S Product Migration
Microchip states that the SAM3S family, including the ATSAM3SD8CA-CUR, is pin-to-pin compatible with AT91SAM7S legacy products in 64-pin versions and with SAM3S4/2/1 family members, making it the designated migration path for aging ARM7TDMI designs. Designers gain a modern Cortex-M3 core at 64 MHz, doubled or quadrupled flash (up to 512 KB), and added peripherals such as the 12-bit DAC and USB, while preserving PCB footprints and much of the peripheral programming model. This shortens qualification cycles for mature industrial and medical products that must remain in production. Firmware porting typically involves updating the CMSIS/device header set and revalidating timing-critical routines, with the flash accelerator mitigating the faster core-to-memory speed differential.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3SD8CA-CUR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3SD8CA-CU | ATSAM4N8CA-CUR | ATSAM4N8CA-CU | ATSAM3S8CA-CUR |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | TFBGA-100 - same | TFBGA-100 - same | TFBGA-100 (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M3 / 64 MHz | ARM Cortex-M3 / 64 MHz | ARM Cortex-M4 / 100 MHz | ARM Cortex-M4 / 100 MHz | ARM Cortex-M3 / 64 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Integrated 12-bit DAC plus memory card interface (vs ATSAM4N8CA-CUR)
- Best power efficiency for moderate workloads (vs ATSAM4N8CA-CU)
- Legacy migration compatibility (vs ATSAM3S8CA-CUR)
Design Notes
The 100-TFBGA (9x9 mm) package uses a fine-pitch BGA ballout, so the PCB must support controlled-impedance fanout with via-in-pad or dog-bone escape routing. Confirm your fabricator supports the ball pitch before layout, and define non-solder-mask-defined (NSMD) pads per Microchip's package outline drawing. Distribute power and ground balls to a solid internal plane pair, and place a 100 nF ceramic capacitor at each supply ball group with one bulk capacitor (4.7-10 uF) near the part. Keep the USB D+/D- pair length-matched and routed over an unbroken ground plane for signal integrity at full-speed 12 Mbps operation.
Supply the device from a single 3.3V rail within the specified 1.62V-3.6V window; the wide range allows direct battery connection in portable designs, but monitor brownout. Microchip SAM3S parts include brownout detection and supply monitoring - enable it in firmware so the Cortex-M3 does not execute code from an under-volted flash array. If using the internal oscillator instead of a crystal to save cost, verify clock accuracy against your UART or USB timing budgets, since USB full-speed requires tighter clock tolerance than UART and may force an external crystal or PLL configuration.
Do not assume pin numbering is shared between the TFBGA-100 and LQFP-100 versions of the SAM3S family - always use the BGA-specific ball map from the manufacturer datasheet. Second, the ATSAM4N8C Cortex-M4 alternatives are not binary-compatible with SAM3SD8 firmware: recompile and revalidate all code, especially timing loops written for 64 MHz. Third, when migrating from AT91SAM7S legacy parts, remember that peripheral register maps changed between ARM7 and Cortex-M3 generations; only the physical footprint compatibility is guaranteed.
Compliance Information
JLCPCB lists the TFBGA-100 device as ROHS; Mouser describes the part as 'BGAGreen' indicating green/lead-free packaging. REACH, halogen-free, and conflict-minerals declarations must be obtained from Microchip's official compliance documentation.
