ATSAM3X8CA-CU - 84MHz Cortex-M3 MCU, 512KB Flash | Microchip
MPN: ATSAM3X8CA-CU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.42 | $12.42 |
| 10 | $11.8 | $118.00 |
| 100 | $10.62 | $1,062.00 |
| 500 | $9.54 | $4,770.00 |
| 1,000 | $8.9 | $8,900.00 |
ATSAM3X8CA-CU Overview
A microcontroller unit (MCU) is a single-chip embedded computer that integrates a processor core, non-volatile program memory, RAM, and a rich set of peripherals onto one die. The SAM3X family sits within Microchip's (formerly Atmel's) 32-bit SAM MCU hierarchy, positioned above the entry-level SAM3N/SAM3S families by adding Ethernet MAC, CAN controllers, and a USB device port for connected embedded systems.
Key features include the ARM Cortex-M3 revision 2.0 core with Thumb-2 instruction set, a Memory Protection Unit (MPU), a 24-bit SysTick timer, and a Nested Vector Interrupt Controller (NVIC). Connectivity spans CAN, Ethernet, I2C (TWI), IrDA, LIN, MMC/SD, SPI, SSC, UART, and USB, making this part a single-chip networking and control hub. The 512KB flash is organized as two 256KB banks supporting dual-bank flash operations.
Technical depth: the Cortex-M3 pipeline is optimized for interrupt-driven control code, with deterministic exception handling suited to industrial communication stacks such as CANopen and EtherCAT-adjacent protocols. The two-bank flash architecture allows firmware management schemes, while the MPU supports RTOS-based designs requiring memory isolation between tasks.
Typical applications include industrial automation and control nodes, embedded Ethernet/CAN gateways, and USB-connected instrumentation. Notably, this MCU family powers the Arduino Due development board, giving it an extensive open-source software ecosystem.
Design consideration: the 100-ball TFBGA package requires controlled-impedance PCB layout with via-in-pad or escape routing; plan at least a six-layer or well-planned four-layer board for the Ethernet and USB interfaces.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAM3X8CA-CU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3X8CA-CU (same form factor and footprint) — differing in RoHS Status, Connectivity, Package, Supply Voltage, Core Processor.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM3X4CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6.1 / Unit
View Datasheet →ATSAM3S8CA-CU
✅ Drop-In✓ In Stock
$5.25 / Unit
View Datasheet →ATSAM3SD8CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2.41 / Unit
View Datasheet →ATSAM3S4CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4.95 / Unit
View Datasheet →ATSAM3N4BA-MU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3.48 / Unit
View Datasheet →ATSAM3X8CA-CU Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 revision 2.0 |
| Core Size | 32-bit |
| Maximum Clock Speed | 84 MHz |
| Flash Memory | 512KB (512K x 8), 2 x 256KB banks |
| SRAM | 96KB (64KB + 32KB) |
| Instruction Set | Thumb-2 |
| Memory Protection | MPU (Memory Protection Unit) |
| SysTick Timer | 24-bit |
| Connectivity | CAN, Ethernet, I2C, IrDA, LIN, MMC, SPI, SSC, UART, USB |
| Supply Voltage | 1.8V / 2.5V / 3.3V |
| Package | 100-TFBGA (9x9 mm) |
| Mounting Type | Surface Mount |
| Interrupt Controller | NVIC (Nested Vector Interrupt Controller) |
| RoHS Status | Compliant (Green package per distributor data) |
| Series | SAM3X |
ATSAM3X8CA-CU 100-tfbga (9x9 mm) Pin Configuration Guide
Pin configuration for ATSAM3X8CA-CU (100-tfbga (9x9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3X8CA-CU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3X8CA-CU is suitable for 6 applications: Industrial Automation and Control Nodes, Embedded Ethernet Gateways, USB-Connected Test and Measurement Instruments, Building Automation and Security Panels, IoT Edge Nodes and Smart Devices, Robotics and Motor Control Communication Hubs.
Industrial Automation and Control Nodes
The ATSAM3X8CA-CU fits industrial control nodes because its dual CAN controllers and 84 MHz Cortex-M3 core handle deterministic real-time fieldbus communication while running control loops. The 512KB dual-bank flash supports firmware update schemes in deployed equipment, and the MPU enables RTOS task isolation for safety-adjacent logic. Typical deployments place the MCU on a 3.3V rail with SPI-isolated I/O and CAN transceivers; the NVIC provides deterministic interrupt latency for time-critical CAN message handling. Compared to smaller SAM3S parts, the SAM3X removes the need for an external CAN controller, reducing BOM complexity in multi-node factory automation networks.
Recommended
Embedded Ethernet Gateways
The ATSAM3X8CA-CU is well suited to protocol gateway designs because its integrated Ethernet MAC eliminates external network controllers, while CAN, UART, SPI, and SSC peripherals bridge legacy field buses to IP networks. With 96KB of SRAM (64KB + 32KB banks), the part has headroom for TCP/IP stacks such as lwIP alongside application buffers. At 84 MHz the Cortex-M3 sustains line-rate small-packet forwarding for low-traffic industrial links; a dedicated Ethernet PHY such as the KSZ8081 connects via RMII. The dual 256KB flash banks enable redundant-image bootloaders, an important reliability feature for remotely deployed gateways that cannot be serviced easily.
Recommended
USB-Connected Test and Measurement Instruments
The ATSAM3X8CA-CU's USB device port, high-speed SPI, and SSC (synchronous serial controller) make it a strong fit for bench instruments that stream sensor or ADC data over USB to host software. The 84 MHz core sustains 12 Mbps full-speed USB traffic while concurrently servicing SPI or SSC data streams, and the 96KB SRAM buffers burst acquisitions. Its dual-bank flash supports in-field firmware upgrades - a standard requirement for instrumentation. This is the same MCU family (ATSAM3X8E) used in the Arduino Due, so ASF3 driver libraries and community USB stack code substantially shorten firmware development time for measurement products.
Recommended
Building Automation and Security Panels
Building automation controllers benefit from the ATSAM3X8CA-CU's combination of CAN, LIN, UART, and Ethernet connectivity, letting a single chip talk to HVAC field devices, access-control readers, and supervisory IP networks. The 512KB flash accommodates protocol stacks plus application logic, and the MPU partitions RTOS tasks handling network input from safety-relevant door/alarm control code. The 100-ball 9x9 mm TFBGA keeps board area small for DIN-rail and panel-mount controllers. Running from 3.3V, the SAM3X interfaces directly with standard RS-485 transceivers via its USARTs for Modbus RTU slave or master implementations.
Recommended
IoT Edge Nodes and Smart Devices
For connected edge devices, the ATSAM3X8CA-CU offers wired connectivity (Ethernet and USB) with enough compute at 84 MHz to preprocess sensor data before uplink, reducing cloud bandwidth costs. The 512KB flash holds both a protocol stack and OTA-capable bootloader, and the 24-bit SysTick timer supports freeRTOS scheduling for concurrent sensor sampling and network tasks. The two SRAM banks allow DMA-heavy ADC buffering to run independently of the network stack's heap, improving real-time behavior. Its green RoHS-compliant BGA package suits compact smart-meter and smart-building hardware where a wired backhaul is preferred over wireless modules.
Recommended
Robotics and Motor Control Communication Hubs
Robotics controllers use the ATSAM3X8CA-CU as a communication and supervision hub: its CAN controllers link motor drive nodes, SSC interfaces encoders, and Ethernet connects to a host controller. The 84 MHz Cortex-M3 with NVIC handles periodic control coordination with deterministic latency, while 96KB SRAM holds trajectory queues and CAN transmit buffers. The Thumb-2 instruction set keeps control code compact within the 512KB flash even with multiple protocol stacks resident. Because this is the Arduino Due MCU family, ROS-adjacent firmware builders can prototype on Due hardware before moving to the custom BGA100 board.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3X8CA-CU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3X4CA-CU | ATSAM3S8CA-CU | ATSAM3SD8CA-CU | ATSAM3S4CA-CU | ATSAM3N4BA-MU |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-ball BGA - same footprint | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA - same footprint (verify ball map) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz |
| Flash Memory | 512KB (2 x 256KB banks) | 256KB | 512KB | 512KB | 256KB | 512KB |
| Ethernet MAC | Yes | Yes | No | No | No | No |
| CAN Controllers | Yes | Yes | No | No | No | No |
| USB Device | Yes | Yes | Yes (HS device) | Yes | Yes | No |
Key Differentiators
- Integrated Ethernet MAC plus dual CAN in one MCU (vs ATSAM3S8CA-CU)
- Maximum flash in the 100-pin family (vs ATSAM3X4CA-CU)
- Mature Arduino Due ecosystem (vs ATSAM3SD8CA-CU)
Design Notes
The 100-ball TFBGA (9x9 mm, 0.8 mm ball pitch class) requires escape routing on at least two signal layers plus dedicated power and ground planes. Plan fan-out symmetrically from the ball grid: use via-in-pad (filled/capped) or dog-bone escapes, and reserve the inner ball rows for power/ground pairs. Ethernet RMII and USB differential pairs need controlled-impedance routing (90 ohm differential for USB). Start layout from the Microchip SAM3X reference design (used in the Arduino Due for the LQFP variant) to inherit proven decoupling and crystal placement.
The SAM3X supports 1.8V, 2.5V, or 3.3V supply operation; most designs run the core and I/O from a single 3.3V rail with the on-chip regulator handling the core domain. Decouple each VDD ball with 100 nF close to the ball, plus bulk 10 uF per supply domain. Estimated: at 84 MHz the core current is in the tens of mA range (see datasheet power consumption tables), so a 150-200 mA LDO budget for the MCU plus transceivers is a reasonable starting point - confirm against the datasheet current consumption figures for your exact clock configuration.
Do not confuse order-code variants: the -CU suffix is the 100-ball TFBGA, while -AU is the 100-lead TQFP - they are NOT footprint-compatible despite sharing the same die. Also verify the SAM3X8CA (100-pin) vs SAM3X8E (144-pin) peripheral multiplexing: pin counts differ and the Arduino Due examples map to the 144-pin part. When substituting SAM3S-family parts on the same BGA100 footprint, recheck the ball map and the absence of Ethernet/CAN peripheral support in your firmware before committing.
Compliance Information
Distributor listings describe the package as 'GREEN IND TEMP, MRLA' (green/halogen-free, industrial temperature). REACH and conflict-minerals status not stated in provided data.
