ATSAM3X4CA-CU - 84MHz Cortex-M3 MCU 256KB Flash | Microchip
MPN: ATSAM3X4CA-CU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.2 | $9.20 |
| 10 | $8.3 | $83.00 |
| 100 | $7.4 | $740.00 |
| 500 | $6.7 | $3,350.00 |
| 1,000 | $6.1 | $6,100.00 |
ATSAM3X4CA-CU Overview
A microcontroller (MCU) integrates a processor core, memory, and peripherals on a single chip, forming the computational heart of embedded systems. The ATSAM3X4CA-CU belongs to the SAM3X family within Microchip's ARM-based SAM3 line, sitting in the hierarchy: ARM Cortex-M3 -> 32-bit flash MCU -> embedded microcontroller -> semiconductor device. Its Cortex-M3 revision 2.0 core implements the Thumb-2 instruction set, includes a Memory Protection Unit (MPU) and a 24-bit SysTick counter, and uses a Nested Vector Interrupt Controller for deterministic interrupt handling.
Key features include 84 MHz core speed, 256KB on-chip flash, and rich connectivity: CAN, Ethernet, I2C, IrDA, LIN, MMC, SPI, and SSC serial audio interface. Ethernet and dual CAN make it unusually well equipped for networked industrial nodes, while the SSC targets audio and telecom peripherals.
Architecturally, the device operates from a low 1.8V-class supply (per distributor listings, 1.8V core with 3.3V I/O) in an industrial temperature grade. The green, MRL A qualified BGA100 packaging supports lead-free surface-mount assembly, and the 9x9 mm ball grid array saves board area versus 100-pin QFP alternatives while improving signal integrity for high-speed peripherals.
Typical applications include industrial automation and PLC nodes, Ethernet-connected gateways and IoT edge devices, motor control and CAN networking equipment, and consumer or embedded control boards such as Arduino Due-class platforms built on the SAM3X family.
When designing with this device, plan power sequencing and decoupling for the 100-ball BGA: use a solid ground plane under the array and verify that your assembly partner supports 0.8 mm-pitch BGA reflow. Budget flash usage carefully, as the 256KB density is fixed within the family package footprint.
This page synthesizes distributor pricing availability, drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for ATSAM3X4CA-CU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3X4CA-CU (same form factor and footprint) — differing in Connectivity, Package, RoHS Status, Flash Memory, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM3X8CA-CU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$8.9 / Unit
View Datasheet →ATSAM3A4CA-CU
✅ Drop-In✓ In Stock
$5.4 / Unit
View Datasheet →ATSAM3S8BA-MUR
✅ Drop-In✓ In Stock
$5.15 / Unit
View Datasheet →ATSAM3N4BA-MU
✅ Drop-In✓ In Stock
$3.48 / Unit
View Datasheet →ATSAM3X4CA-CU Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 revision 2.0 |
| Core Size | 32-bit |
| Maximum Clock Speed | 84 MHz |
| Flash Memory | 256KB (256K x 8) |
| Instruction Set | Thumb-2 |
| Memory Protection | MPU (Memory Protection Unit) |
| SysTick Counter | 24-bit |
| Interrupt Controller | Nested Vector Interrupt Controller (NVIC) |
| Connectivity | CAN, Ethernet, I2C, IrDA, LIN, MMC, SPI, SSC |
| Supply Voltage | 1.8 V (core, per distributor listing) |
| Package | 100-TFBGA (9x9 mm), BGA100 |
| Mounting Type | Surface Mount |
| Temperature Grade | Industrial |
| Package Color / MRL | GREEN, MRL A |
| RoHS Status | Compliant (GREEN package) |
| Series | SAM3X (ATSAM3X) |
ATSAM3X4CA-CU green, mrl a Pin Configuration Guide
Pin configuration for ATSAM3X4CA-CU (green, mrl a package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3X4CA-CU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3X4CA-CU is suitable for 6 applications: Industrial Automation and PLC Nodes, Ethernet Gateways and IoT Edge Devices, CAN Networking and Motor Control Equipment, Audio and Telecom Peripherals via SSC, Embedded Control Boards (Arduino Due-Class Platforms), Data Logging and Storage Devices.
Industrial Automation and PLC Nodes
The ATSAM3X4CA-CU fits industrial automation controllers because it combines an 84 MHz Cortex-M3 with dual industrial network interfaces: Ethernet for supervisory links and CAN for deterministic fieldbus communication. In a PLC or distributed I/O node, the MCU runs control loops and protocol stacks while the Nested Vector Interrupt Controller and Memory Protection Unit provide deterministic interrupt latency and firmware fault isolation. The industrial temperature grade and GREEN MRL A BGA100 package tolerate harsh cabinet environments and lead-free reflow assembly. Designers should allocate flash carefully since 256KB must hold both the application and the network stacks, and use the SSC or SPI for high-speed expansion modules.
Recommended
Ethernet Gateways and IoT Edge Devices
For IoT edge gateways, the ATSAM3X4CA-CU's integrated Ethernet MAC removes the need for an external network controller, cutting BOM cost and board area in the 9x9 mm TFBGA. The 84 MHz Cortex-M3 with Thumb-2 code density can run a lightweight TCP/IP stack alongside application logic, while the 256KB flash stores firmware and web-server assets. The MCU can bridge sensor buses (I2C, SPI, UART) to an Ethernet backbone, with the MPU isolating the network stack from safety-critical code. Engineers should size external PHY circuitry and magnetics to the Ethernet MAC and consider ATSAM3X8CA-CU if TLS stacks and logging grow beyond 256KB.
Recommended
CAN Networking and Motor Control Equipment
The ATSAM3X4CA-CU supports CAN connectivity at the silicon level, making it suitable for vehicle-adjacent and factory CAN nodes such as motor control drives, battery management masters, and j1939-style gateways. The 84 MHz core provides headroom for field-oriented control math while servicing CAN interrupts, and the NVIC prioritizes time-critical control loops over communication tasks. Operating from a low-voltage 1.8V-class core supply with 3.3V-class I/O eases integration with transceivers and gate drivers. When the design needs no Ethernet, ATSAM3A4CA-CU offers a CAN-optimized variant of the same 84 MHz Cortex-M3 platform.
Recommended
Audio and Telecom Peripherals via SSC
The integrated SSC (Synchronous Serial Controller) makes the ATSAM3X4CA-CU a strong host for audio codecs and telecom line interfaces, supporting I2S-class synchronous serial streams at audio rates. The 84 MHz Cortex-M3 can handle sample buffering, protocol framing, and control interfaces over I2C or SPI simultaneously, while IrDA support covers short-range optical links in telecom equipment. In a 100-TFBGA footprint the short ball-out traces improve signal integrity for high-speed serial clocks compared with leaded QFP packages. Designers should verify DMA channel allocation for glitch-free audio streaming and reserve flash headroom for codec configuration code.
Recommended
Embedded Control Boards (Arduino Due-Class Platforms)
The SAM3X family is the silicon behind the Arduino Due, so the ATSAM3X4CA-CU is a natural choice for custom embedded control boards that reuse the Due ecosystem of bootloaders, toolchains, and libraries. The 84 MHz Cortex-M3 delivers a large step up from 8-bit AVR parts such as the ATMEGA8A, with 32-bit arithmetic, Thumb-2 density, and rich peripherals (SPI, I2C, MMC for SD cards, Ethernet on SAM3X). The 100-TFBGA package suits compact production boards, though hobbyists prototyping may prefer LQFP family members for hand assembly. Flash at 256KB accommodates the Due-class core plus moderate application code.
Recommended
Data Logging and Storage Devices
With MMC/SDIO support on-chip, the ATSAM3X4CA-CU interfaces directly to SD card media for data loggers, metering equipment, and portable instrumentation. The 84 MHz core sustains practical SD write throughput while the SSC/SPI handle sensor front ends, and IrDA plus UART links cover legacy instrument connectivity. The industrial temperature grade supports loggers deployed in unconditioned environments. Because the 100-TFBGA 9x9 package requires reflow assembly, volume production of loggers benefits from the compact footprint, while 256KB flash should be budgeted across the FAT filesystem driver, application logic, and any Ethernet reporting functionality.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3X4CA-CU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3X8CA-CU | ATSAM3A4CA-CU | ATSAM3S8BA-MUR | ATSAM3N4BA-MU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-LFBGA | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz | ARM Cortex-M3, 84 MHz |
| Flash Memory | 256KB | 512KB | 256KB | 512KB | 256KB |
| Ethernet MAC | Yes | Yes | No | No | No |
| CAN | Yes | Yes | Yes | Limited | No |
| Supply Voltage (Core) | 1.8 V class | 1.8 V class | 1.8V / 2.5V / 3.3V (per Utmel) | 1.8 V class | 1.8 V class |
Key Differentiators
- Integrated Ethernet MAC in a 100-ball footprint (vs ATSAM3S8BA-MUR)
- Dual network capability (Ethernet + CAN) (vs ATSAM3A4CA-CU)
- Cost-optimized within family for 256KB designs (vs ATSAM3X8CA-CU)
Design Notes
The 100-TFBGA 9x9 mm package uses approximately 0.8 mm ball pitch, requiring controlled-impedance PCB fabrication with via-in-pad or dog-bone fanout. Place a solid, unbroken ground plane directly under the ball array to provide return paths for the 84 MHz core and high-speed Ethernet/SPI signals. Confirm your assembly house can handle BGA reflow and X-ray inspection. Specify ENIG or OSP surface finish for reliable ball wetting, and follow Microchip's SAM3X hardware design guidance for the power distribution network.
Distributor data lists a 1.8 V-class core supply with 3.3 V I/O for the SAM3X family, so plan a dual-rail power architecture with proper sequencing between core and I/O domains. Decouple each supply group with an array of 100 nF ceramics placed as close to the ball fanout vias as possible, plus bulk capacitance near the regulator. Verify exact per-rail limits and sequencing requirements in the manufacturer datasheet before finalizing the power tree, as distributor summaries do not capture all absolute maximum ratings.
The most frequent ATSAM3X4CA-CU pitfall is flash exhaustion: 256KB must hold the application, the Ethernet TCP/IP stack, and the CAN stack simultaneously in networked designs. Prototype with ATSAM3X8CA-CU (512KB, same TFBGA100 footprint) if code size projections exceed roughly 200KB, since the swap is pin-to-pin. Second, SAM3X peripheral multiplexing is extensive across 100 balls; lock the ball map early and cross-check every assigned function in the datasheet multiplexing tables to avoid a respin.
Compliance Information
Mouser and DigiKey listings describe the device as BGA100, GREEN, IND TEMP, MRL A - Microchip's GREEN designation indicates RoHS-compliant, halogen-free, lead-free construction. REACH and conflict minerals status not stated in provided data.
