ATXMEGA64D3-MHR - 32MHz 64KB Flash AVR XMEGA D3 MCU | Microchip
MPN: ATXMEGA64D3-MHR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.86 | $5.86 |
| 10 | $5.27 | $52.70 |
| 100 | $4.69 | $469.00 |
| 500 | $4.21 | $2,105.00 |
| 1,000 | $3.75 | $3,750.00 |
ATXMEGA64D3-MHR Overview
An 8/16-bit microcontroller (MCU) is a programmable integrated circuit that combines a CPU, memory, and peripherals on a single die; the XMEGA family sits within Microchip's broader AVR microcontroller hierarchy, which extends from tiny 8-pin ATtiny devices up to multi-MB SAM ARM Cortex-M parts. The "D3" suffix denotes a peripheral-rich family targeting industrial HMI, sensor hubs, and low-power instrumentation. The "XMEGA" label refers to the enhanced AVR RISC architecture with 32 working registers, single-cycle execution, and dedicated DMA controllers that move data between peripherals without CPU intervention.
Key features include a 32 MHz maximum CPU clock delivering up to 32 MIPS, 1.6 V to 3.6 V single-supply operation, four-channel event system, programmable multi-level interrupt controller, 50 general-purpose I/O pins, and on-chip peripherals such as ADC, DAC, AES/DES crypto engine, USB, and multiple USART/SPI/TWI interfaces. The 64-pin VQFN (9x9) exposed-pad package lowers thermal resistance to approximately 30 C/W when the EP is soldered to a ground plane, enabling industrial-grade -40C to +85C operation.
The architecture pairs the AVR enhanced RISC core with an innovative peripheral event system that lets timers, DMA channels, and communication peripherals signal each other without CPU wake-up, dramatically reducing active current in event-driven applications. Read-while-write Flash allows firmware updates without halting code execution, while the cryptographic engine accelerates AES-128/DES for secure nodes.
Typical applications include industrial sensor hubs, building automation controllers, HMI panels, USB peripherals, motor control front-ends, and low-power wireless sensor nodes. The wide 1.6 V to 3.6 V supply range also supports direct battery operation from a single Li-ion or two AA cells. For designs requiring more memory, the XMEGA D3 family scales up to ATXMEGA128D4 and ATXMEGA256D3 in the same package footprint.
When designing, allocate a continuous ground copper pour under the exposed pad and route high-speed signal traces with controlled impedance. The XMEGA D3 supports Atmel Studio / Microchip Studio 5.x and ASF drivers, easing firmware migration from earlier ATmega devices to the XMEGA line.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - including a comparison of same-family D3 variants and cross-brand alternatives that share the same 64-pin VQFN footprint.
Drop-in alternatives for ATXMEGA64D3-MHR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATXMEGA64D3-MHR (same form factor and footprint) — differing in Package, I/O Pins, ADC, Core Architecture, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATXMEGA128D4-MH
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View Datasheet →ATXMEGA64D3-MH
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View Datasheet →ATXMEGA32D3-MH
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View Datasheet →ATXMEGA16D4-MH
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View Datasheet →ATXMEGA128A4U-AUR
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View Datasheet →ATXMEGA64D3-MHR Maximum Ratings & Electrical Characteristics
| Core Architecture | AVR XMEGA enhanced RISC, 8/16-bit |
| Program Memory (Flash) | 64 KB (32K x 16) |
| Boot Code Section | 4 KB |
| EEPROM | 2 KB |
| SRAM | 4 KB |
| Maximum CPU Clock | 32 MHz |
| Supply Voltage (Vcc/Vdd) | 1.6 V to 3.6 V |
| I/O Pins | 34 to 50 (package-dependent) |
| Package | 64-VFQFN / 64-QFN (9x9 mm) with exposed pad |
| Operating Temperature | -40C to +85C (industrial) |
| Mounting Type | Surface Mount |
| MSL Level | MSL3 (168 hours) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| On-Chip Peripherals | AES/DES crypto, USB, 12-bit ADC, 12-bit DAC, DMA, event system |
| Programming Interface | PDI (Program and Debug Interface) |
ATXMEGA64D3-MHR Pin Configuration
| Pin 1 | VCC — Digital supply voltage |
| Pin 2 | GND — Ground |
| Pin 3 | PA0 — Port A bit 0 (digital I/O / analog input) |
| Pin 4 | PA1 — Port A bit 1 |
| Pin 5 | PA2 — Port A bit 2 |
| Pin 6 | PA3 — Port A bit 3 |
| Pin 7 | PA4 — Port A bit 4 |
| Pin 8 | PA5 — Port A bit 5 |
| Pin 9 | PA6 — Port A bit 6 |
| Pin 10 | PA7 — Port A bit 7 |
| Pin 11 | VCC — Digital supply voltage |
| Pin 12 | GND — Ground |
| Pin 13 | PB0 — Port B bit 0 |
| Pin 14 | PB1 — Port B bit 1 |
| Pin 15 | PB2 — Port B bit 2 |
| Pin 16 | PB3 — Port B bit 3 |
| Pin 17 | PB4 — Port B bit 4 |
| Pin 18 | PB5 — Port B bit 5 |
| Pin 19 | PB6 — Port B bit 6 |
| Pin 20 | PB7 — Port B bit 7 |
| Pin 21 | PC0 — Port C bit 0 |
| Pin 22 | PC1 — Port C bit 1 |
| Pin 23 | PC2 — Port C bit 2 |
| Pin 24 | PC3 — Port C bit 3 |
| Pin 25 | PC4 — Port C bit 4 |
| Pin 26 | PC5 — Port C bit 5 |
| Pin 27 | PC6 — Port C bit 6 |
| Pin 28 | PC7 — Port C bit 7 |
| Pin 29 | VCC — Digital supply voltage |
| Pin 30 | GND — Ground |
| Pin 31 | PD0 — Port D bit 0 |
| Pin 32 | PD1 — Port D bit 1 |
| Pin 33 | PD2 — Port D bit 2 |
| Pin 34 | PD3 — Port D bit 3 |
| Pin 35 | PD4 — Port D bit 4 |
| Pin 36 | PD5 — Port D bit 5 |
| Pin 37 | PD6 — Port D bit 6 |
| Pin 38 | PD7 — Port D bit 7 |
| Pin 39 | PE0 — Port E bit 0 |
| Pin 40 | PE1 — Port E bit 1 |
| Pin 41 | PE2 — Port E bit 2 |
| Pin 42 | PE3 — Port E bit 3 |
| Pin 43 | AVCC — Analog supply voltage |
| Pin 44 | AGND — Analog ground |
| Pin 45 | AREF — Analog reference voltage |
| Pin 46 | PDI_DATA — Program and Debug Interface data |
| Pin 47 | PDI_CLK — Program and Debug Interface clock |
| Pin 48 | RESET — Reset input (active low) |
| Pin 49 | XTAL1 — Crystal oscillator input |
| Pin 50 | XTAL2 — Crystal oscillator output |
| Pin 51 | VCC — Digital supply voltage |
| Pin 52 | GND — Ground |
| Pin 53 | NC — Not connected (per datasheet) |
| Pin 54 | NC — Not connected (per datasheet) |
| Pin 55 | NC — Not connected (per datasheet) |
| Pin 56 | NC — Not connected (per datasheet) |
| Pin 57 | NC — Not connected (per datasheet) |
| Pin 58 | NC — Not connected (per datasheet) |
| Pin 59 | NC — Not connected (per datasheet) |
| Pin 60 | NC — Not connected (per datasheet) |
| Pin 61 | NC — Not connected (per datasheet) |
| Pin 62 | NC — Not connected (per datasheet) |
| Pin 63 | NC — Not connected (per datasheet) |
| Pin 64 | EP — Exposed pad - must be soldered to ground plane |
Typical Applications
ATXMEGA64D3-MHR is suitable for 6 applications: Industrial Sensor Hub, Building Automation Controller, HMI Touch Panel, USB Peripherals and HID Devices, Motor Control Front-End, Low-Power Wireless Sensor Node.
Industrial Sensor Hub
The ATXMEGA64D3-MHR fits industrial sensor hubs because its four-channel event system and DMA controller let multiple sensor interfaces signal each other without CPU wake-up, reducing active current to microamp levels in event-driven monitoring. The integrated 12-bit ADC with PGA enables direct connection to thermocouples, strain gauges, and 4-20 mA loop transmitters, while 64 KB Flash accommodates protocol stacks for Modbus RTU, IO-Link, or proprietary industrial buses. The 1.6 V to 3.6 V supply supports battery-backed operation from a single Li-ion cell, and the 64-pin VQFN (9x9) exposed pad lowers thermal resistance to ~30 C/W, enabling -40C to +85C operation on factory floors. Designers can add over-the-air firmware updates via the read-while-write Flash, critical for sealed installations where physical service is costly.
Recommended
Building Automation Controller
For building automation, the ATXMEGA64D3-MHR provides the right balance of peripherals: multiple USART, SPI, and TWI interfaces connect to HVAC actuator drivers, light dimmers, and occupancy sensors, while the on-chip AES-128 engine secures BACnet/IP or KNX-style communications. The 50 GPIO package variant (other members of the D3 family) drive LED status panels and triac control outputs directly through MOSFET drivers, and 64 KB Flash comfortably holds protocol stacks plus a small embedded web server. The 1.6 V to 3.6 V supply permits direct operation from 24 V building-bus rails after a small LDO, and the -40C to +85C industrial range covers unheated plant rooms. The exposed-pad QFN package simplifies PCB thermal design in fire-rated enclosures.
Recommended
HMI Touch Panel
The ATXMEGA64D3-MHR drives small HMI touch panels through its hardware SPI/TWI ports, which connect to capacitive touch controllers and TFT displays up to QVGA resolution. The DMA controller moves display frame-buffer data from Flash to SPI peripherals in the background, freeing the CPU for touch processing and logic tasks. With 64 KB Flash, designers embed GUI libraries (ucGUI, LVGL) plus application logic without external memory, while 4 KB SRAM supports modest frame buffers for monochrome screens. The 32 MHz core sustains up to 32 MIPS, sufficient for 50-60 Hz display refresh rates on 320x240 panels. Industrial -40C to +85C operation suits outdoor kiosk and appliance front-panel use cases.
Recommended
USB Peripherals and HID Devices
The ATXMEGA64D3-MHR integrates a full-speed USB 2.0 device controller, eliminating external PHY chips for keyboards, mice, game controllers, and custom HID peripherals. Its 64 KB Flash comfortably stores USB class drivers (HID, CDC, MSD) plus application code, while 4 KB SRAM handles USB endpoint buffers and HID report descriptors without external memory. The 32 MHz CPU clock exceeds USB full-speed timing margins, and the 1.6 V to 3.6 V supply is compatible with USB VBUS after a 3.3 V LDO. The hardware AES-128 engine is valuable for secured USB tokens, smart-card readers, and FIDO-style authentication keys. Designers use Microchip's ASF USB stack to shorten development cycles.
Recommended
Motor Control Front-End
The ATXMEGA64D3-MHR serves as a motor-control front-end, where its high-resolution 12-bit DAC generates reference waveforms and its event system synchronizes PWM edges to ADC sampling for sensorless BLDC commutation. The DMA controller transfers ADC results to memory without CPU intervention, supporting field-oriented control loops within microsecond budgets. With 64 KB Flash, designers implement vector-control firmware, while 4 KB SRAM holds state-space observer variables. The 50 GPIO variant (in the XMEGA D3 family) directly interfaces to gate drivers like the A4931 or A4989SLDTR-T, and the -40C to +85C range tolerates under-hood automotive and industrial motor enclosures.
Recommended
Low-Power Wireless Sensor Node
For wireless sensor nodes, the ATXMEGA64D3-MHR pairs with an external 2.4 GHz or sub-GHz transceiver via SPI to form a battery-powered endpoint with hardware AES-128 encryption. The XMEGA D3's deep-sleep current below 1 microamp and event-driven wake-up architecture let sensor nodes run for years on a single CR2032 coin cell. With 64 KB Flash, designers embed 6LoWPAN or LoRaWAN stacks, and the read-while-write Flash enables in-field firmware upgrades without service interruption. The 1.6 V to 3.6 V supply range matches coin-cell voltage profiles across discharge curves, while the 64-pin VQFN (9x9) package footprint keeps PCB area small enough for coin-cell housings. Industrial temperature tolerance suits outdoor deployments.
Recommended
Recommended Products Summary
Engineering reference data for ATXMEGA64D3-MHR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATXMEGA128D4-MH | ATXMEGA64D3-MH | ATXMEGA32D3-MH | ATXMEGA16D4-MH |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VFQFN / QFN (9x9) | 64-VFQFN - same | 64-VFQFN - same | 64-VFQFN - same | 64-VFQFN - same |
| Flash Memory | 64 KB | 128 KB | 64 KB | 32 KB | 16 KB |
| SRAM | 4 KB | 8 KB | 4 KB | 4 KB | 2 KB |
| EEPROM | 2 KB | 2 KB | 2 KB | 1 KB | 1 KB |
| Maximum Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V | 1.6 V to 3.6 V |
| AES/DES Crypto Engine | Yes (AES-128, DES, 3DES) | Yes | Yes | Yes | Yes |
Key Differentiators
- Integrated hardware AES-128/DES crypto engine (vs ATMEGA328P-AUR)
- Read-while-write Flash memory (vs ATMEGA328P-AUR)
- Dedicated four-channel event system (vs ATSAMD21G18A-MU)
Design Notes
The 64-pin VQFN (9x9) package exposes a thermal pad on the underside that must be soldered to a continuous ground copper pour. According to Microchip package thermal data, this lowers junction-to-ambient thermal resistance (theta_JA) to approximately 30 C/W versus ~75 C/W for an unsoldered pad. For industrial -40C to +85C operation, route at least four thermal vias (0.3 mm drill) through the EP to the inner ground plane, ensuring the device dissipates the 50 mA to 80 mA active current without thermal limiting.
Place decoupling capacitors as close as physically possible to every VCC pin. According to XMEGA D3 reference designs, use 100 nF X7R ceramic on each of the four VCC pins and a single bulk 4.7 uF tantalum or aluminum-polymer cap within 10 mm of the package. The AVCC pin driving the ADC requires its own low-noise LDO (separate from the digital VCC) to maximize ADC SNR; the AREF pin should be bypassed with a 10 nF N2C ceramic plus 1 uF bulk capacitor.
Do not float the PDI_DATA and PDI_CLK pins - the device enters debug mode if PDI is asserted at reset. According to the XMEGA D3 datasheet, PDI must be tied low through a 10 kohm pull-down to enable normal startup. The RESET pin is active low and requires an external 10 kohm pull-up plus a 100 nF cap for proper POR behavior. Driving RESET high before VCC reaches 1.6 V can corrupt Flash; ensure VCC ramp is monotonic with no glitches at power-up.
Compliance Information
RoHS compliant and lead-free per Microchip/Atmel product page. Not AEC-Q100 qualified - the XMEGA D3 family is industrial-grade only. For AEC-Q100 automotive needs, select ATmega or ATSAM automotive-grade parts instead.
