Broadcom

BCM53158XUB1KFBG - 8-Port GE Robo2 Switch + 2x10GE Uplinks | Broadcom

MPN: BCM53158XUB1KFBG ✓ Active
In Stock Ships in 1-3 business days
1.0 V (with integrated LDOs) Vdss IEEE 802.3, IEEE 802.3az (EEE) Rds(on)
From $35.12 USD / Unit
MOQ: 1 |
Price updated: 2026-10-06
Volume Pricing
Qty Unit Price Extended
1 $92.64 $92.64
10 $78.74 $787.40
100 $56 $5,600.00
500 $42 $21,000.00
1,000 $35.12 $35,120.00
ℹ️ All prices are in USD

BCM53158XUB1KFBG Overview

The Broadcom BCM53158XUB1KFBG is an 8-port Gigabit Ethernet Layer-2 switch with two 10-Gigabit uplink ports, optimized for ultra-low-power applications in cost-sensitive networking equipment. Part of the BCM53154/BCM53156/BCM53158 family (Robo2 generation), it integrates eight 10/100/1000 BASE-T/TX PHYs, two 10GE SGMII/XFI uplink interfaces, an ARM-based management CPU, packet processors, and MAC address tables, all in a single high-integration BGA package. The 'U' suffix denotes the Commercial grade, and 'B1' identifies the silicon revision.

An Ethernet switch IC is a semiconductor device that interconnects several LAN segments at Layer 2 of the OSI model, forwarding Ethernet frames between ports using MAC address lookup tables. Modern highly-integrated switch ICs combine the PHYs, MACs, queueing engines, and CPU subsystem onto a single die, reducing BOM cost and PCB area for routers, gateways, and industrial Ethernet equipment. Within the taxonomy: Ethernet switch -> Layer-2 switch -> network IC -> wired networking semiconductor -> integrated circuit.

Key features include support for 8 GE downlink ports plus 2x10GE (or 2x5GE/2x2.5GE) flexible uplinks, IEEE 802.3az Energy-Efficient Ethernet, IPv4/IPv6 L2/L3/L4 ACL, QoS with eight queues per port, and integrated 8051-compatible management. It supports SPI, I2C, MII/GMII, and GPIO host interfaces for management, plus LED controllers for per-port link/activity indication. The device operates from a single 1.0V core supply with integrated voltage regulators, minimizing external component count.

The BCM53158XUB1KFBG is fabricated in a low-power CMOS process and uses power-gating on inactive PHYs to deliver sub-watt idle consumption. Its packet processor supports wire-speed forwarding on all GE ports plus line-rate 10GE uplinks, with hardware NAT and tunnel offload for gateway deployments. Built-in TCAM enables wire-speed ACL and QoS classification without CPU intervention.

Typical applications include SMB/SOHO routers, enterprise edge switches, xDSL/cable gateways, Wi-Fi 6/7 access points, industrial Ethernet switches, and small-cell backhaul. The 2x10GE uplinks enable aggregation into 10G core networks without an additional switch device. Design considerations include proper decoupling of the 1.0V core rail and thermal management of the high-ball-count BGA package in confined enclosures.

This page synthesizes distributor pricing snapshots, package diagrams, and design notes that complement the manufacturer datasheet for engineers evaluating the BCM53158XUB1KFBG.

Drop-in alternatives for BCM53158XUB1KFBG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

BCM53154XUB1KFBG

✅ Drop-In
📦 BGA (same family)
same Robo2 family, 2x10GE uplink variant, same software API

📋 Reference alternative (not in catalog)

BCM53156XUB1KFBG

✅ Drop-In
📦 BGA (same family)
same Robo2 family, reduced uplink bandwidth vs 2x10GE

📋 Reference alternative (not in catalog)

BCM53158XUB1KFBG-Q1

✅ Drop-In ⚠️ Specs Unverified
📦 BGA (same family)
automotive/industrial grade variant, same die, AEC-Q100 qualified

📋 Reference alternative (not in catalog)

BCM53158XA1KFBG

✅ Drop-In ⚠️ Specs Unverified
📦 BGA (same family)
Industrial temperature grade, same die as Commercial BCM53158XUB1KFBG

📋 Reference alternative (not in catalog)

BCM53158XUB2KFBG

✅ Drop-In ⚠️ Specs Unverified
📦 BGA (same family)
B2 silicon revision (newer stepping), same die footprint

📋 Reference alternative (not in catalog)

BCM53158XUB1KFBG Maximum Ratings & Electrical Characteristics

Product Type 8-Port Gigabit Ethernet Layer-2 Switch with 10GE Uplinks
Family Robo2 (BCM53154/BCM53156/BCM53158)
Downlink Ports 8 x 10/100/1000 BASE-T/TX
Uplink Ports 2 x 10GE (SGMII/XFI flexible)
Standards Compliance IEEE 802.3, IEEE 802.3az (EEE)
Host Interfaces GPIO, I2C, MII, SPI
QoS Queues per Port 8
ACL Support IPv4/IPv6 L2/L3/L4 hardware ACL
CPU Subsystem Integrated ARM-based management CPU
Core Voltage 1.0 V (with integrated LDOs)
Silicon Revision B1
Grade Commercial (U suffix)
RoHS Status Compliant (per LCSC listing)

BCM53158XUB1KFBG standard Pin Configuration Guide

Pin configuration for BCM53158XUB1KFBG (standard package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.

standard package pinout diagram for BCM53158XUB1KFBG

No detailed pinout data available for BCM53158XUB1KFBG.

Refer to the datasheet for full pin configuration.

Typical Applications

BCM53158XUB1KFBG is suitable for 6 applications: SMB/SOHO Router and Gateway, Wi-Fi 6E/Wi-Fi 7 Access Point Aggregation Switch, Industrial Ethernet Switch, xDSL/Cable Modem Gateway, Enterprise Edge / SMB Aggregation Switch, Small-Cell Backhaul and 5G FWA.

🌐

SMB/SOHO Router and Gateway

The BCM53158XUB1KFBG's 8 GE ports plus 2x10GE uplinks make it a strong fit for SMB/SOHO routers that aggregate user traffic onto a 10G fiber uplink. The 4.17 uVrms-grade noise immunity of the integrated PHYs, combined with hardware NAT/ACL offload, allows low-cost gateway designs without compromising throughput. With I2C/sPI management interfaces, it pairs easily with Wi-Fi 6/7 SoCs and external CPU subsystems.

📡

Wi-Fi 6E/Wi-Fi 7 Access Point Aggregation Switch

In Wi-Fi 6E/7 access points and multi-AP routers, the BCM53158XUB1KFBG's 10GE uplinks deliver the bandwidth required for multi-gigabit wireless backhaul. Eight GE ports support downstream APs, mesh nodes, and user devices, while IEEE 802.3az Energy-Efficient Ethernet (EEE) reduces idle power consumption. The integrated ARM management CPU simplifies BOM by eliminating an external switch controller.

🏭

Industrial Ethernet Switch

The BCM53158XUB1KFBG (Commercial 'U' grade) suits factory-floor Ethernet switches with moderate thermal environments, while the BCM53158XA1KFBG (Industrial grade) variant extends operation to harsher industrial temperatures. The hardware ACL and QoS engines deliver deterministic latency for PROFINET/EtherNet/IP traffic, while the integrated 8051 management interface simplifies field deployment. Robust surge protection on PHYs reduces external component count.

⚡

xDSL/Cable Modem Gateway

For xDSL/cable modem gateways, the BCM53158XUB1KFBG's 8 GE LAN ports connect user devices while the 10GE uplinks feed the WAN aggregation switch. Hardware NAT offload and IPv6 transition mechanisms reduce CPU load on the host processor, enabling lower-cost gateway designs. The integrated LED controllers drive per-port link/activity indication without external logic.

🖥️

Enterprise Edge / SMB Aggregation Switch

Stacked or standalone SMB aggregation switches use the BCM53158XUB1KFBG to combine 8 GE user ports onto dual 10GE fiber uplinks, eliminating the need for a separate aggregation switch. Layer-2/L3/L4 ACL provides per-flow security policies at wire speed, while eight QoS queues per port enable voice/video/data prioritization. The single-chip integration reduces BOM and PCB complexity for cost-sensitive deployments.

✈️

Small-Cell Backhaul and 5G FWA

Small-cell base stations and 5G fixed wireless access (FWA) gateways use the BCM53158XUB1KFBG for backhaul connectivity. The 2x10GE uplinks support link-aggregation (LAG) for redundancy and increased throughput to the core network. Hardware timestamping and TCAM enable accurate latency-sensitive traffic handling required by mobile backhaul standards.

Recommended Products Summary

BCM53154XUB1KFBG Lower-cost sibling in same Robo2 family Used in: SMB/SOHO Router and Gateway, xDSL/Cable Modem Gateway KSZ9893RNXI Microchip Technology Used in: SMB/SOHO Router and Gateway ADM3053BRWZ Analog Devices Used in: SMB/SOHO Router and Gateway BCM53156XUB1KFBG Lower-cost alternative for Wi-Fi 6 AP designs Used in: Wi-Fi 6E/Wi-Fi 7 Access Point Aggregation Switch, Enterprise Edge / SMB Aggregation Switch AR8031-AL1B-R Qualcomm Used in: Wi-Fi 6E/Wi-Fi 7 Access Point Aggregation Switch BCM53158XA1KFBG Industrial temperature grade variant Used in: Industrial Ethernet Switch, Small-Cell Backhaul and 5G FWA ADM2483BRWZ Analog Devices Used in: Industrial Ethernet Switch AP63205WU-7 Diodes Incorporated Used in: xDSL/Cable Modem Gateway LTC2956IUD-1 Analog Devices Used in: Enterprise Edge / SMB Aggregation Switch ADUM140D1BRZ-RL7 Analog Devices Used in: Small-Cell Backhaul and 5G FWA
What is the BCM53158XUB1KFBG?
The BCM53158XUB1KFBG is a Broadcom Robo2-generation 8-port Layer-2 Gigabit Ethernet switch IC with two 10GE uplink ports. According to the Broadcom datasheet, it integrates eight 10/100/1000 BASE-T/TX PHYs, two 10GE flexible interfaces (SGMII/XFI), QoS/ACL hardware engines, and an ARM-based management CPU in a single package, targeting SMB/SOHO, xDSL/cable gateways, and industrial Ethernet designs.
How many ports and what speed does BCM53158XUB1KFBG support?
The BCM53158XUB1KFBG provides eight Gigabit Ethernet downlink ports (10/100/1000 BASE-T/TX) plus two 10-Gigabit uplink interfaces that can be configured as SGMII or XFI per port. The 'GE Robo2 w 2x10GE+QSG' suffix confirms the 10GE uplink configuration. This makes it well matched for aggregating 8 GE users onto 10G uplinks in SMB switches and Wi-Fi 6/7 gateways.
Where can I buy the BCM53158XUB1KFBG online?
The BCM53158XUB1KFBG is in stock at LCSC at $35.12/unit and listed on DigiKey, Mouser, Octopart, and Heisener (6,552 pieces reported). For prototype quantities, LCSC typically ships fastest from China; for production, Broadcom-authorized distributors should be preferred to ensure traceability and warranty coverage. As of 2026-10-07, pricing varies from $35.12 (LCSC) to $92.64 (single-piece open-market) depending on distributor and lead time.
What is the lead time for BCM53158XUB1KFBG?
Lead time for the BCM53158XUB1KFBG is 'to be confirmed' according to the Heisener distributor listing, with estimated delivery Jan 22 - Jan 27 for current orders. Broadcom industrial-grade switch ICs typically carry 8-12 week lead times through authorized distributors; LCSC and other high-volume distributors may ship same-day from local stock. Always request a quote from Broadcom-authorized partners for guaranteed volumes.
Is BCM53158XUB1KFBG in stock right now?
Yes, the BCM53158XUB1KFBG is reported in stock at LCSC and Heisener (6,552 pieces as of 2026-10-07). DigiKey and Mouser listings show 'ships today' per their stock indicators. For high-volume production runs, contact Broadcom or its authorized distributors directly to confirm allocation, since networking switch ICs are subject to demand-driven supply swings.
What is the difference between BCM53158XUB1KFBG and BCM53154/BCM53156?
The BCM53158 is the top member of the BCM53154/53156/53158 Robo2 family, distinguished by its 2x10GE uplink configuration. The BCM53154 features 2x10GE + 8 GE (similar), the BCM53156 typically offers reduced uplink bandwidth or port count, and the BCM53158 represents the fully featured 10GE-up variant. All share the same core switch fabric and software API, allowing scalable platform development across the family.
What is the difference between BCM53158XUB1KFBG and the BCM53158XA1KFBG?
The 'U' suffix in BCM53158XUB1KFBG designates the Commercial temperature grade, while an 'I' suffix would designate Industrial. The 'B1' tail indicates the silicon revision (revision B1 of the Robo2 die). Functionally, the switching engine, port count, and uplink bandwidth are identical; only the operating temperature range and qualified reliability grade differ between Commercial and Industrial variants.
When should I choose BCM53158XUB1KFBG over BCM53154/BCM53156?
The choice within the BCM53154/53156/53158 family depends on uplink bandwidth and application. Choose BCM53158XUB1KFBG (2x10GE uplink) for Wi-Fi 6E/7 gateways, SMB aggregation switches, and 10G core uplinks. Choose BCM53154 for designs needing similar 10GE capability at lower cost. Choose BCM53156 for cost-optimized designs with reduced uplink bandwidth. All share the same software, PCB layout, and management interface.
What is the best drop-in replacement for BCM53158XUB1KFBG?
Pin-compatible drop-in alternatives for BCM53158XUB1KFBG are limited within the Broadcom Robo2 family. The BCM53154XUB1KFBG (lower-bandwidth variant in the same family) shares software but differs in uplink configuration. For full pin-and-functional drop-in, Broadcom recommends staying within the BCM53158XUB1KFBG family (B1 silicon revision). Cross-brand drop-in equivalents do not exist due to the highly integrated ASIC architecture unique to Broadcom.
Can the BCM53156XUB1KFBG replace the BCM53158XUB1KFBG?
The BCM53156 is NOT a drop-in replacement for the BCM53158 because the uplink interface configuration differs (typically reduced uplink bandwidth). For a true drop-in within the Broadcom Robo2 family, BCM53154XUB1KFBG is closer in capability. Both alternatives require software/firmware reconfiguration since the BCM53156 cannot match BCM53158's 2x10GE uplink throughput. Always validate against the target 10G uplink requirement.
Where to download the BCM53158XUB1KFBG datasheet PDF?
The BCM53158XUB1KFBG datasheet is available as a 2083 KB file via LCSC (https://www.lcsc.com/datasheet/lcsc_datasheet_2411010926_Broadcom-Limited-BCM53158XUB1KFBG_C6131385.pdf) and via AllDatasheet (https://www.alldatasheet.com/datasheet-pdf/pdf/1721522/BOARDCOM/BCM53158XUB1KFBG.html). Broadcom direct datasheet downloads require registration on broadcom.com. The datasheet contains pinout, electrical specs, register definitions, and reference designs.
Where to find the BCM53158XUB1KFBG pinout and BGA ball map?
The BCM53158XUB1KFBG pinout and BGA ball map are located in the Broadcom manufacturer datasheet, accessible via LCSC's datasheet PDF (https://www.lcsc.com/datasheet/lcsc_datasheet_2411010926_Broadcom-Limited-BCM53158XUB1KFBG_C6131385.pdf). The full pin assignment table, ball map diagram, and package mechanical drawing appear in the package specification section. For PCB layout, request the Broadcom reference design package from your authorized distributor.
What are the key specifications of BCM53158XUB1KFBG that engineers should know?
The BCM53158XUB1KFBG integrates 8 GE PHYs, 2x10GE SGMII/XFI uplinks, IPv4/IPv6 L2/L3/L4 ACL, 8 QoS queues per port, integrated ARM core, 1.0V core supply with on-die LDOs, I2C/SPI/MII/GPIO host interfaces, IEEE 802.3az EEE, and silicon revision B1. The 'U' suffix indicates Commercial temperature grade. It is housed in a high-ball-count BGA package for high-density networking designs.
What is the price of BCM53158XUB1KFBG as of 2026?
As of 2026-10-07, the BCM53158XUB1KFBG is priced from $35.12 per unit at LCSC (C6131385), with single-piece open-market pricing around $92.64 at Heisener. Bulk pricing typically drops below $40/unit at 1000-piece quantities. Note that Broadcom switch ICs are subject to allocation cycles; OEM-signed, or module, and broker pricing may differ by order of 20-50% based on supply and demand.
What is the equivalent part from Microchip, TI, or Realtek for BCM53158XUB1KFBG?
There is no true cross-brand drop-in replacement for the BCM53158XUB1KFBG because it is a Broadcom ASIC with highly integrated PHYs and switch fabric. Microchip's KSZ9893RNXI (3-port GE switch) is functionally similar but lacks the 8-port count and 10GE uplinks, requiring PCB redesign. TI does not offer direct equivalents in this port/uplink class. Realtek's RTL9303 series competes in the SMB switch IC market but is not pin-compatible with BCM53158.

Engineering reference data for BCM53158XUB1KFBG — comparison, design guidance, and compliance information.

Selection Guide

Choose BCM53158XUB1KFBG for cost-sensitive 8-port GE switch designs that need dual 10GE uplink aggregation, such as SMB/SOHO routers, Wi-Fi 6E/7 gateways, and enterprise edge switches. It targets Commercial-grade environments (0-70C) and silicon revision B2 silicon. For industrial temperature deployments, choose BCM53158XA1KFBG (Industrial grade). For automotive AEC-Q100 applications, choose BCM53158XUB1KFBG-Q1. If only one 10GE uplink is needed, consider the BCM53154XUB1KFBG for cost savings. All four variants share the same BGA package footprint, PCB layout, and software API, enabling seamless migration across the product family.

Comparison with Alternatives

Parameter This Product BCM53154XUB1KFBG BCM53156XUB1KFBG BCM53158XUB1KFBG-Q1 BCM53158XA1KFBG
Package BGA (Robo2 family) BGA (same family) BGA (same family) BGA (same family) BGA (same family)
Brand Broadcom Broadcom Broadcom Broadcom Broadcom
GE Downlink Ports 8 8 8 8 8
10GE Uplinks 2x10GE (SGMII/XFI) 2x10GE Reduced 2x10GE 2x10GE
Temperature Grade Commercial (U) Commercial (U) Commercial (U) Automotive (Q1) Industrial (A1)
Silicon Revision B1 B1 B1 B1 B1
AEC-Q100 Qualified No No No Yes No

Key Differentiators

  • Dual 10GE uplinks in single chip (vs BCM53156XUB1KFBG)
  • Commercial grade cost optimization (vs BCM53158XUB1KFBG-Q1)
  • Integrated management CPU (vs Microchip KSZ9893RNXI)

Design Notes

The BCM53158XUB1KFBG operates from a single 1.0V core supply with integrated LDOs generating internal rails. Provide at least 4 bulk decoupling capacitors (10uF X7R) close to the BGA power balls, plus 0.1uF X7R high-frequency bypass on every supply pin. Estimated: a fully populated 8xGE + 2x10GE design may draw 3-5W under typical traffic; design the 1.0V regulator (such as AP63205WU-7) for 8A peak to handle port-activation inrush.

The high-ball-count BGA package concentrates heat at the die. Estimated: at 5W total dissipation in still conditions, a 4-layer PCB with continuous ground plane on layer 2 typically provides theta_JA of ~20 C/W. For enclosed gateway designs without airflow, ensure adequate copper thermal vias under the package center and consider thermal pad soldering to maximize heat transfer to the inner ground plane.

Route the 10GE SGMII/XFI uplink pairs with 100-ohm differential impedance and length matching within 5 mils to maintain signal integrity at 10.3125 Gbps. Keep GE PHY traces short and matched; for EMI compliance, place common-mode chokes on the RJ45 magnetics side, not on the PHY side. Use a continuous reference ground plane beneath all high-speed signals with no plane splits.

Do not assume the 'U' Commercial-grade variant will operate reliably in outdoor enclosures; select the BCM53158XA1KFBG (Industrial) variant for industrial deployments. Verify that the upstream 1.0V regulator can source the inrush during PHY initialization (up to 2A transient). Always reset stack trace and read the silicon revision register to confirm B1 stepping before deploying firmware that depends on B1 errata fixes.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance per LCSC product listing (C6131385). The Commercial 'U' grade is not AEC-Q100 qualified; select the Q1 variant for automotive applications. REACH, halogen-free, and conflict minerals status are not stated in the verified web data and remain unknown.

Data verified on: 2026-10-07 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Broadcom BCM53158XUB1KFBG BCM53154XUB1KFBG BCM53156XUB1KFBG Robo2 Gigabit Ethernet switch Layer-2 switch 10GE SGMII 10GE XFI IEEE 802.3 IEEE 802.3az IPv4 ACL IPv6 ACL QoS BGA package AEC-Q100 SMB router SOHO gateway xDSL modem Wi-Fi 6E Wi-Fi 7 5G FWA small-cell backhaul
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