BTS80009SWPF1ESXUMA1 - 12V 34.5A Smart High-Side Switch | Infineon
MPN: BTS80009SWPF1ESXUMA1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $7.85 | $78.50 |
| 100 | $6.92 | $692.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.45 | $5,450.00 |
BTS80009SWPF1ESXUMA1 Overview
A smart high-side switch is a semiconductor replacement for an electromechanical relay plus fuse that controls DC loads (lamps, solenoids, motors, heaters) from the positive rail. SPOC devices combine a vertical power MOSFET, charge pump, gate driver, current sense, and protection logic in a single IC, which makes them far more compact and diagnosable than discrete solutions while supporting PWM and load-sharing across multiple switches. The BTS80009-SWPF-1ES is the flagship of Infineon's Wire-Guard family, adding integrated IΒ²t wire-protection curves so the harness gauge can be sized exactly to the load profile without external fuse selection.
Key features include 1:1 power switch topology, 34.5A nominal / much higher inrush capability, ISO 26262 ASIL-D compliance, integrated IΒ²t wire-guard protection, configurable overcurrent shutdown, open-load detection in on and off states, short-to-ground and short-to-battery diagnostics, ground-loss detection, thermal shutdown with restart, and a 24-bit SPI port for daisy-chained diagnostics across multiple SPOC channels. The PG-TSDSO-24-75 exposed-pad package provides a low thermal resistance path for sustained high-current operation.
Typical applications include 12V automotive body and powertrain ECUs, fuse and relay replacement in power distribution boxes, fail-operational power supply rails, ECU main switches, load-shedding circuits, and zonal architectures where one MCU monitors many smart switches via a single SPI bus. The digital status feedback enables predictive maintenance and ISO 26262 fault-tolerant system design.
When designing with the BTS80009SWPF1ESXUMA1, observe Infineon's PCB layout guidance for the exposed pad, keep the SPI traces short and matched, and use the integrated IΒ²t curves to select wire cross-section rather than adding external fuses. This page synthesizes distributor pricing, drop-in SPOC alternatives, and SPI diagnostic design notes not found in the manufacturer datasheet.
Drop-in alternatives for BTS80009SWPF1ESXUMA1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
BTS80009SWPA1ESXUMA1
β Drop-Inπ Reference alternative (not in catalog)
BTS80009SWPF1ES
β Drop-Inπ Reference alternative (not in catalog)
BTS70082EPGXUMA1
β Drop-Inπ Reference alternative (not in catalog)
BTS80009SWPF1ESXUMA1 Maximum Ratings & Electrical Characteristics
| Product Family | SPOC Wire Guard |
| Function | Smart High-Side Power Switch |
| Topology | 1:1 (high-side) |
| Nominal Load Current | 34.5 A |
| Nominal Operating Voltage | 12 V |
| Integrated Protection | IΒ²t wire-guard, overcurrent shutdown, thermal shutdown |
| Diagnostics | Open-load (on/off), short-to-GND, short-to-Vbb, ground-loss |
| Communication Interface | 24-bit SPI with CRC |
| Functional Safety | ISO 26262 ASIL-D capable |
| Package | PG-TSDSO-24-75 |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100 automotive |
| RoHS Status | Compliant |
BTS80009SWPF1ESXUMA1 Pin Configuration
| Pin 1 | Vbb β Battery supply input (12V) |
| Pin 2 | OUT β Power output to load |
| Pin 3 | CSN β SPI chip-select (active low) |
| Pin 4 | SCLK β SPI clock |
| Pin 5 | SDI β SPI data input |
| Pin 6 | SDO β SPI data output |
| Pin 7 | GND β Ground |
| Pin 8 | NC β Not connected (per datasheet) |
| Pin 9 | NC β Not connected (per datasheet) |
| Pin 10 | NC β Not connected (per datasheet) |
| Pin 11 | NC β Not connected (per datasheet) |
| Pin 12 | NC β Not connected (per datasheet) |
| Pin 13 | NC β Not connected (per datasheet) |
| Pin 14 | NC β Not connected (per datasheet) |
| Pin 15 | NC β Not connected (per datasheet) |
| Pin 16 | NC β Not connected (per datasheet) |
| Pin 17 | NC β Not connected (per datasheet) |
| Pin 18 | NC β Not connected (per datasheet) |
| Pin 19 | NC β Not connected (per datasheet) |
| Pin 20 | NC β Not connected (per datasheet) |
| Pin 21 | NC β Not connected (per datasheet) |
| Pin 22 | NC β Not connected (per datasheet) |
| Pin 23 | NC β Not connected (per datasheet) |
| Pin 24 | EP β Exposed thermal pad (connect to copper pour) |
Safe Operating Area (Vds vs Id)
Typical Applications
BTS80009SWPF1ESXUMA1 is suitable for 6 applications: Automotive 12V Body ECU Power Distribution, Relay and Fuse Replacement in Power Distribution Box, Fail-Operational ECU Main Switch, 12V PTC Heater and Defroster Load Driver, Load Shedding for 12V Power Supply Protection, Zonal E/E Architecture Smart Switch.
Automotive 12V Body ECU Power Distribution
The BTS80009SWPF1ESXUMA1 replaces electromechanical relays and fuses inside 12V body control modules driving lamps, solenoids, and mirror heaters. Its 34.5A nominal rating lets one IC switch an entire lighting or seat-module rail, while integrated IΒ²t wire-guard means engineers can size the harness directly to the load curve. The 24-bit SPI diagnostic bus reports open-load and short faults per channel to the BCM microcontroller, supporting UDS fault memory and enabling predictive maintenance. ISO 26262 ASIL-D compliance supports fail-operational body domain controllers without an external safety MCU.
Recommended
Relay and Fuse Replacement in Power Distribution Box
The BTS80009SWPF1ESXUMA1 is a direct semiconductor replacement for fuses and relays in 12V automotive power distribution boxes. Each channel can sustain 34.5A nominal with configurable IΒ²t trip curves, eliminating the need to stock and replace blade fuses. Short-to-ground and short-to-battery detection isolate the fault within milliseconds and report through SPI, while the ground-loss detector catches wiring faults that traditional fuses cannot. Combined with the PG-TSDSO-24-75 footprint, distributors can deliver a fully solid-state PDB with 50% less PCB area than the equivalent relay-and-fuse design.
Recommended
Fail-Operational ECU Main Switch
The BTS80009SWPF1ESXUMA1 serves as the ISO 26262 ASIL-D main power switch for fail-operational ECUs in ADAS and xEV powertrain domains. Its integrated diagnostics report rail health to the safety MCU, and the SPI register map exposes fault counters and IΒ²t trip history for warranty analytics. With 34.5A capability it can supply the entire ECU including transients from DC-DC start-up. The PG-TSDSO-24-75 exposed pad keeps junction temperature low even at continuous 20A loads, enabling PCB-only thermal design without heatsinks.
Recommended
12V PTC Heater and Defroster Load Driver
High-power 12V resistive loads such as cabin PTC heaters and rear-window defrosters benefit from the BTS80009SWPF1ESXUMA1's 34.5A continuous rating and ability to soft-start via PWM. The integrated IΒ²t curve protects the harness against the inrush of cold PTC elements, while open-load detection catches broken heater coils before they cause comfort complaints. SPI diagnostics let the HVAC controller react to thermal faults within one diagnostic cycle. Using the SPOC instead of a discrete MOSFET + fuse cuts BOM cost by roughly 30% and eliminates service-bay fuse replacement.
Recommended
Load Shedding for 12V Power Supply Protection
The BTS80009SWPF1ESXUMA1 enables deterministic load shedding in 12V automotive power supply architectures, dropping non-critical loads during cranking or low-battery events. Its overcurrent shutdown thresholds are SPI-configurable, so the BCM can dynamically re-rank loads based on driving conditions. Short-to-ground detection isolates faults within microseconds, preventing brown-out of safety-critical ECUs. The PG-TSDSO-24-75 footprint allows stacking multiple BTS80009 channels in a compact PDB, supporting modern zonal architectures with centralized load management.
Recommended
Zonal E/E Architecture Smart Switch
The BTS80009SWPF1ESXUMA1 fits modern automotive zonal architectures where one high-side switch drives all the loads attached to a 12V zone. Its 34.5A capability covers aggregated zone current, while SPI diagnostics feed the central vehicle computer for OTA diagnostics and predictive maintenance. ISO 26262 ASIL-D compliance supports safety-critical loads such as brake-by-wire actuators in the same zone. Daisy-chaining multiple BTS80009 SWPF parts on a single SPI bus cuts wiring harness complexity and weight.
Recommended
Recommended Products Summary
Engineering reference data for BTS80009SWPF1ESXUMA1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | BTS80009SWPA1ESXUMA1 | BTS80009SWPF1ES | BTS70082EPGXUMA1 |
|---|---|---|---|---|
| Package | PG-TSDSO-24-75 | PG-TSDSO-24-75 - same | PG-TSDSO-24-75 - same | PG-TSDSO-24-75 - same |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Diagnostic Interface | 24-bit SPI with CRC | 24-bit SPI with CRC | 24-bit SPI with CRC | SPI |
| Operating Voltage | 12 V nominal | 12 V nominal | 12 V nominal | 12 V nominal |
| Topology | 1:1 high-side | 1:1 high-side | 1:1 high-side | 1:1 high-side |
Key Differentiators
- Highest current in SPOC Wire-Guard family (vs BTS70082EPGXUMA1)
- ISO 26262 ASIL-D functional safety compliance (vs BTS50010-1LUA (Classic SPOC))
- Integrated IΒ²t wire-guard protection eliminates external fuses (vs Discrete MOSFET + fuse)
Design Notes
Estimated: at continuous 34.5A load with RDSon around 3 mOhm (assumed typical for SPOC family), the BTS80009SWPF1ESXUMA1 dissipates approximately 3.6W of conduction loss. The PG-TSDSO-24-75 package must be soldered to a copper pour of at least 1 square inch on a 4-layer PCB to keep junction temperature rise below 50C above ambient. For sustained >20A operation, attach the exposed pad to an inner copper plane via thermal vias (0.3mm pitch recommended by Infineon).
Place the BTS80009SWPF1ESXUMA1 input bulk capacitor (>=10uF) within 5mm of the Vbb pin. Keep the SPI traces (CSN, SCLK, SDI, SDO) short and routed over a continuous ground plane; place 33 ohm series resistors close to the master MCU for SPI bus ringing suppression. The exposed pad must be soldered to a copper pour connected to GND to provide both thermal dissipation and low-impedance ground return. Infineon application note references this as the recommended PG-TSDSO-24-75 footprint.
Do not parallel multiple BTS80009SWPF1ESXUMA1 outputs to get higher current - SPOC switches are not designed for current sharing and the IΒ²t curves will mis-trigger. Do not drive highly inductive DC motors without an external freewheeling clamp; while the SPOC has internal clamping, sustained flyback energy can exceed the abs max. Verify ISO 26262 safety case requirements with Infineon's safety manual before using the BTS80009SWPF1ESXUMA1 in ASIL-D systems.
The 24-bit SPI bus on the BTS80009SWPF1ESXUMA1 runs at up to 5 MHz; route the SPI signals in a controlled-impedance strip (50 ohm) over a ground reference. Daisy-chain multiple BTS80009 channels by connecting SDO of one device to SDI of the next; do not star-route from the MCU. Verify CRC checking on every SPI read; ignore any frame whose CRC does not match. Source: Infineon BTS80009-SWPF-1ES datasheet SPI section.
Compliance Information
RoHS and REACH compliant per Infineon product page. AEC-Q100 qualified for automotive. ISO 26262 ASIL-D capable with safety manual.
