CY62167EV30LL-45BVXI - 16Mb SRAM 45ns 1M×16/2M×8 VFBGA-48 | Infineon
MPN: CY62167EV30LL-45BVXI ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $4.91 | $491.00 |
| 500 | $4.32 | $2,160.00 |
| 1,000 | $3.78 | $3,780.00 |
CY62167EV30LL-45BVXI Overview
An asynchronous SRAM (static random-access memory) is a volatile memory that retains data as long as power is applied, without needing refresh cycles. It occupies the memory IC tier of the hierarchy: SRAM -> volatile memory -> memory IC -> semiconductor. Compared with DRAM, SRAM trades density for speed and simplicity, which is why it is favored for cache, FIFOs, and working buffers in embedded systems.
The MoBL® process technology used in the CY62167EV30 family achieves very low active current (2 mA at 1 MHz typical) and ultra-low standby current. A BYTE pin on the 48-ball BGA allows the user to organize the array as 1M × 16 (BYTE = VCC) or 2M × 8 (BYTE = VSS). Standard features include chip-enable (CE1#, CE2), output enable (OE#), and write enable (WE#) controls, supporting common asynchronous read/write protocols. The 45 ns access time is well-suited to mid-speed microcontrollers, ASICs, and DSPs that do not require synchronous burst interfaces.
The VFBGA-48 (BV48) package provides a small 6 mm × 8 mm footprint suitable for handheld and space-limited designs. Multiple temperature grades are offered within the family (industrial -40 °C to +85 °C and automotive variants), and the part is Pb-free / RoHS compliant.
Typical applications include industrial handheld terminals, point-of-sale (POS) terminals, automotive infotainment buffers, networking line cards, and battery-backed metering or instrumentation buffers where data retention must survive short power interruptions.
When designing with the CY62167EV30LL-45BVXI, observe proper decoupling (0.1 µF + 1 µF near VCC) and avoid lengthy traces to the data bus to minimize bus-turnaround skew. For lower-power standby, drive CE1# high during idle periods and CE2 low to enter standby mode.
This page synthesizes distributor stock, drop-in alternatives and design guidance not consolidated on the manufacturer product page.
Drop-in alternatives for CY62167EV30LL-45BVXI — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with CY62167EV30LL-45BVXI (same form factor and footprint) — differing in Memory Type, Mounting Type, Organization, Package, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
CY62167EV30LL-45BVXIT
✅ Drop-In📋 Reference alternative (not in catalog)
CY62167G30-45BVXI
✅ Drop-In📋 Reference alternative (not in catalog)
CY62167G30-45BVXIT
✅ Drop-In📋 Reference alternative (not in catalog)
CY62167EV30LL-45BVI
✅ Drop-In📋 Reference alternative (not in catalog)
IS62WV102416EBLL-45BI
✅ Drop-In📋 Reference alternative (not in catalog)
CY62167EV30LL-45BVXI Maximum Ratings & Electrical Characteristics
| Memory Type | Asynchronous SRAM (MoBL®) |
| Density | 16 Mbit (16,777,216 bits) |
| Organization | 1M × 16 / 2M × 8 (BYTE-pin configurable) |
| Access Time | 45 ns |
| Supply Voltage (VCC) | 2.2 V to 3.6 V |
| Active Current (1 MHz typical) | 2 mA |
| Interface | Parallel, asynchronous |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Package | 48-ball VFBGA (6 × 8 × 1 mm) |
| Package Code | BV48 |
| Mounting Type | Surface Mount |
| Byte Pin | Yes (BYTE# for ×8 / ×16 selection) |
| RoHS Status | Compliant (Pb-free) |
CY62167EV30LL-45BVXI Pin Configuration
| Pin A1 | A19 — Address input 19 |
| Pin A2 | OE# — Output Enable (active low) |
| Pin A3 | A16 — Address input 16 |
| Pin A4 | BYTE# — Byte select (VCC = x16, VSS = x8) |
| Pin A5 | NC — Not connected (per datasheet) |
| Pin A6 | DQ8 — Data I/O 8 (x16 mode) |
| Pin B1 | A18 — Address input 18 |
| Pin B2 | A17 — Address input 17 |
| Pin B3 | CE1# — Chip Enable 1 (active low) |
| Pin B4 | DQ15 — Data I/O 15 (x16 mode) |
| Pin B5 | DQ7 — Data I/O 7 |
| Pin B6 | VSS — Ground |
| Pin C1 | VCC — Power supply (2.2-3.6 V) |
| Pin C2 | A15 — Address input 15 |
| Pin C3 | A14 — Address input 14 |
| Pin C4 | DQ14 — Data I/O 14 (x16 mode) |
| Pin C5 | DQ6 — Data I/O 6 |
| Pin C6 | DQ5 — Data I/O 5 |
| Pin D1 | A13 — Address input 13 |
| Pin D2 | A12 — Address input 12 |
| Pin D3 | A11 — Address input 11 |
| Pin D4 | DQ13 — Data I/O 13 (x16 mode) |
| Pin D5 | DQ4 — Data I/O 4 |
| Pin D6 | DQ3 — Data I/O 3 |
| Pin E1 | A10 — Address input 10 |
| Pin E2 | A9 — Address input 9 |
| Pin E3 | A8 — Address input 8 |
| Pin E4 | DQ12 — Data I/O 12 (x16 mode) |
| Pin E5 | DQ2 — Data I/O 2 |
| Pin E6 | DQ1 — Data I/O 1 |
| Pin F1 | CE2 — Chip Enable 2 (active high) |
| Pin F2 | A7 — Address input 7 |
| Pin F3 | A6 — Address input 6 |
| Pin F4 | DQ11 — Data I/O 11 (x16 mode) |
| Pin F5 | DQ0 — Data I/O 0 (LSB in x16, only data in x8) |
| Pin F6 | VCC — Power supply (2.2-3.6 V) |
| Pin G1 | WE# — Write Enable (active low) |
| Pin G2 | A5 — Address input 5 |
| Pin G3 | A4 — Address input 4 |
| Pin G4 | A3 — Address input 3 |
| Pin G5 | DQ10 — Data I/O 10 (x16 mode) |
| Pin G6 | DQ9 — Data I/O 9 (x16 mode) |
| Pin H1 | A2 — Address input 2 |
| Pin H2 | A1 — Address input 1 |
| Pin H3 | A0 — Address input 0 (LSB) |
| Pin H4 | VSS — Ground |
| Pin H5 | NC — Not connected (per datasheet) |
| Pin H6 | VSS — Ground |
Typical Applications
CY62167EV30LL-45BVXI is suitable for 6 applications: Industrial Handheld Terminals, Point-of-Sale (POS) Terminals, Automotive Infotainment Buffers, Networking Line Cards / Router Buffers, Battery-Backed Metering and Instrumentation, Industrial IoT Edge Gateways.
Industrial Handheld Terminals
The CY62167EV30LL-45BVXI fits industrial handheld terminals (bar-code scanners, portable data terminals) thanks to its ultra-low active current (~2 mA at 1 MHz per Infineon MoBL® datasheet) and wide 2.2-3.6 V supply that aligns with two-AA-cell packs. Its 45 ns access time supports mid-speed MCUs (e.g., Cortex-M class) without wait states in most configurations, while the 48-ball VFBGA (BV48) package keeps the BOM footprint under 48 mm². Paired with a low-power MCU like an ATSAM3U4EA-CU or ATMEGA32U4-AU, the part forms a robust working-memory buffer for scanner firmware and transaction logs, retaining state across short power interruptions.
Recommended
Point-of-Sale (POS) Terminals
POS terminals benefit from the CY62167EV30LL-45BVXI's 16-Mbit capacity (1M × 16 or 2M × 8), which is sufficient for transaction buffers, font tables, and display frame storage. The 45 ns asynchronous interface allows direct connection to common embedded host processors without external bus-arbitration logic, reducing BOM cost. The BGA package fits within compact POS chassis, and the part's industrial -40 °C to +85 °C range covers retail and warehouse environments. Compared with synchronous SRAM, the asynchronous design simplifies firmware because no clock-domain crossing is required. Companion components: CP2102N-A02-GQFN28 USB bridge for host connectivity and ATSAMD21G18A-MU ARM Cortex-M0+ for terminal control.
Recommended
Automotive Infotainment Buffers
In automotive infotainment systems, the CY62167EV30LL-45BVXI provides a non-cache working buffer for audio samples, GUI frame data, and CAN-bus message queues. The MoBL® family's ultra-low standby current keeps quiescent drain low on accessory rails while the car is parked, and the wide-voltage supply supports direct 3.3 V rail connection. While the industrial-grade 'I' suffix is the part covered here, the Infineon family also offers 'A'-suffix AEC-Q100 variants on the same die for safety-critical zones. The 45 ns access time pairs well with NXP i.MX and Renesas R-Car application processors. Recommended companion: COM20022I3V-HT ARCNET controller for legacy in-vehicle networking.
Recommended
Networking Line Cards / Router Buffers
Networking line cards use the CY62167EV30LL-45BVXI as a packet-buffer or lookup-table SRAM that supports high-throughput ASICs and NPU lookup engines. The 16-Mbit density accommodates 1024 × 16-bit IPv4 routing entries with headroom for QoS tags. The 45 ns asynchronous interface aligns with mid-speed network processors that lack embedded SRAM of sufficient size; designers can connect CE1#, OE#, and WE# directly to the host's memory bus. The VFBGA-48 footprint simplifies multi-IC PCB layouts where line cards often carry several discrete SRAMs. Companion parts: COM20022I3V-HT for legacy ARCNET interfaces and AT91SAM9260B-CU for embedded Linux control-plane CPUs.
Recommended
Battery-Backed Metering and Instrumentation
Battery-backed metering (electricity, gas, water AMR modules) and portable instrumentation benefit from the CY62167EV30LL-45BVXI's wide-voltage operation that tracks two lithium cells down to 2.2 V. The MoBL® family datasheet specifies ultra-low active current (~2 mA at 1 MHz), preserving battery life during continuous logging. The 16-Mbit capacity stores months of interval-metering samples at 15-minute resolution. The BGA package's small footprint fits AMR modules that often share a coin-cell footprint. When the meter loses main power, an external super-cap or lithium backup keeps VCC above data-retention threshold (~2 V), preserving logged data indefinitely. Companion parts: A5191HRTLG-XTD (ARCNET modem for AMR backhaul) and ATMEGA328P-AUR (low-power 8-bit MCU host).
Recommended
Industrial IoT Edge Gateways
Industrial IoT edge gateways use the CY62167EV30LL-45BVXI as a high-density working buffer for Modbus, CAN, MQTT, and sensor-data aggregation before uplink transmission. Its 1M × 16 organization maps cleanly onto TCP/IP packet buffers used by Ethernet-connected gateways. The 45 ns access time keeps the gateway responsive even with multi-protocol polling at sub-second intervals, while the industrial temperature grade supports outdoor cabinet installations. The MoBL® family's low active current helps gateways pass Energy Star and EU eco-design standby budgets. Companion parts: ATSAMR21G18A-MUT (ARM Cortex-M0+ wireless MCU) and CC1310F128RHBR (sub-GHz radio for LoRa-style backhaul).
Recommended
Recommended Products Summary
Engineering reference data for CY62167EV30LL-45BVXI — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CY62167EV30LL-45BVXIT | CY62167G30-45BVXI | CY62167G30-45BVXIT | CY62167EV30LL-45BVI | IS62WV102416EBLL-45BI |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | ISSI |
| Package | 48-VFBGA (BV48, 6x8 mm) | 48-VFBGA (BV48, 6x8 mm) - same | 48-VFBGA (BV48, 6x8 mm) - same | 48-VFBGA (BV48, 6x8 mm) - same | 48-VFBGA (BV48, 6x8 mm) - same | 48-BGA (6x8) - same footprint |
| Density | 16 Mbit | 16 Mbit | 16 Mbit | 16 Mbit | 16 Mbit | 16 Mbit |
| Organization | 1M × 16 / 2M × 8 | 1M × 16 / 2M × 8 | 1M × 16 / 2M × 8 | 1M × 16 / 2M × 8 | 1M × 16 / 2M × 8 | 1M × 16 / 2M × 8 |
| Access Time | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns |
| Supply Voltage | 2.2 V - 3.6 V | 2.2 V - 3.6 V | 2.2 V - 3.6 V | 2.2 V - 3.6 V | 2.2 V - 3.6 V | 2.2 V - 3.6 V |
| Process Family | MoBL® LL (ultra-low power) | MoBL® LL (ultra-low power) | MoBL® G (higher speed) | MoBL® G (higher speed) | MoBL® LL (ultra-low power) | ISSI LP SRAM |
| RoHS / Pb-free | Yes | Yes | Yes | Yes | Yes (X-mark absent) | Yes |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C (industrial) |
Key Differentiators
- MoBL® ultra-low-power process (vs IS62WV102416EBLL-45BI (ISSI))
- Single-family pin compatibility (vs CY62167G30-45BVXI)
- Wide voltage operation (vs 5 V-only SRAMs (legacy))
Design Notes
Place a 0.1 µF X7R ceramic decoupling capacitor within 3 mm of each VCC ball, and add a bulk 1 µF to 4.7 µF tantalum or polymer cap near the SRAM. Per the Infineon MoBL® datasheet, decoupling must cover both VCC balls (C1 and F6) and all VSS returns (B6, H4, H6). This minimizes switching noise on the asynchronous bus and reduces soft-error rate in noisy environments such as motor-drive enclosures.
For the 48-ball VFBGA BV48 package, use a 4-layer PCB with a continuous ground plane directly under the BGA, and route all 16 data signals on the top layer with matched lengths (within ±2 mm) to keep bus-turnaround skew low. Escape the inner-row balls (C, D, E rows) via micro-vias in-pad; do not route signals under the BGA. Use 50 Ω controlled impedance for traces longer than 25 mm to avoid reflections on the asynchronous bus.
Never leave the BYTE pin floating - tie BYTE# to VCC for 1M × 16 mode or to VSS for 2M × 8 mode. A floating BYTE# can cause intermittent bus-width mismatches and corrupt reads. Also ensure CE2 is tied high (active) and CE1# is driven by the host; deasserting CE2 or asserting CE1# puts the device into ultra-low standby. Do not exceed 3.6 V on VCC or the part will suffer permanent damage per the absolute maximum ratings.
Compliance Information
Pb-free / RoHS compliant per Infineon product page and DigiKey listing. The 'I' suffix denotes industrial grade (-40 °C to +85 °C); for AEC-Q100 automotive qualification, choose the 'A'-suffix variant from the same CY62167E family.
