CYW43455LXKUBGT - WiFi 5 802.11ac + BT Combo | Infineon
MPN: CYW43455LXKUBGT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $6.9 | $690.00 |
| 500 | $6.2 | $3,100.00 |
| 1,000 | $5.6 | $5,600.00 |
Drop-in alternatives for CYW43455LXKUBGT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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CYW43455XKUBGT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3.14 / Unit
View Datasheet →CYW43455XKUBGT
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3.14 / Unit
View Datasheet →CYW43455LXKUBGT Maximum Ratings & Electrical Characteristics
| Product Type | RF Transceiver + MCU, Wi-Fi and Bluetooth Combo |
| Wi-Fi Standard | Wi-Fi 5 (802.11ac) |
| Bluetooth Version | Bluetooth 5.3 (per Infineon product page); DigiKey category lists Bluetooth v4.1 |
| Frequency Bands | 2.4 GHz and 5 GHz |
| Package | 140-UFBGA / WLBGA (WLCSP-140) |
| Package Dimensions | 4.47 x 5.27 mm |
| Integrated MCU | Yes (runs Wi-Fi/BT protocol stacks) |
| Mounting Type | Surface Mount |
CYW43455LXKUBGT 4.47 x 5.27 mm Pin Configuration Guide
Complete pinout information for CYW43455LXKUBGT (4.47 x 5.27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for CYW43455LXKUBGT.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
CYW43455LXKUBGT is suitable for 6 applications: Smart Home Gateways and IoT Hubs, Streaming Media Devices and Set-Top Boxes, Industrial Wireless Connectivity, Wearables and Portable Devices, Medical Monitoring and Health Devices, Automotive Aftermarket and Telematics Accessories.
Smart Home Gateways and IoT Hubs
The CYW43455LXKUBGT fits smart-home gateways because its dual-band Wi-Fi 5 (802.11ac) operation on 2.4 GHz and 5 GHz lets the gateway separate low-rate sensor traffic (2.4 GHz) from high-throughput camera and streaming traffic (5 GHz), while the integrated Bluetooth 5.3 radio handles device provisioning and beacon-based presence detection. In a typical hub, the combo chip connects to the host MCU or application processor via its standard host interface and runs both protocol stacks on its integrated MCU, offloading wireless processing entirely. The small 4.47 x 5.27 mm WLCSP-140 footprint fits compact gateway enclosures, and concurrent Wi-Fi/BT coexistence in the 2.4 GHz band is managed on-chip, simplifying antenna and RF design to a shared or dual-antenna arrangement.
Recommended
Streaming Media Devices and Set-Top Boxes
For streaming sticks, set-top boxes, and smart displays, the CYW43455LXKUBGT provides the 802.11ac 5 GHz throughput needed for smooth 4K video streaming while Bluetooth 5.3 carries remote-control and audio accessory links. The Wi-Fi 5 radio with 80 MHz-class channel support per the family datasheet reduces buffering in congested apartment RF environments, and on-chip coexistence prevents Bluetooth remote traffic from stalling the video stream. Its integrated MCU executes the connectivity stacks so the main SoC's CPU budget is preserved for video decoding. Because the device is a raw WLCSP-140 IC, it suits products with HDI PCB capability and volume production, where a discrete combo chip is more cost-effective than a certified module.
Recommended
Industrial Wireless Connectivity
Industrial equipment such as factory sensors, HMIs, and machine-monitoring nodes benefits from the CYW43455LXKUBGT's robust, standards-compliant radios: the Infineon datasheet states the Bluetooth section fully complies with the Bluetooth Radio Specification and EDR, delivering high link quality of service in the noisy 2.4 GHz ISM band. The 5 GHz Wi-Fi band offers a quieter spectrum than the crowded factory 2.4 GHz environment, and the integrated MCU maintains connectivity even when the main controller is busy or in a safe state. Designers should verify the extended-temperature ordering variant in the Infineon ordering table, since industrial deployments typically require it. The WLCSP package needs conformal-coating-compatible assembly for harsh environments.
Recommended
Wearables and Portable Devices
The CYW43455LXKUBGT's 4.47 x 5.27 mm WLCSP-140 package is one of the most compact ways to integrate dual-band Wi-Fi 5 plus Bluetooth 5.3 into a wearable or portable product, where board area is the dominant constraint. Low-power design intent, per the Infineon datasheet's stated goal of low-power, low-cost communication, combined with host-offload via the integrated MCU, extends battery life by letting the application processor sleep during idle periods. Bluetooth 5.3 supports LE audio accessories and beacon interactions for companion apps. Designers must budget for the WLCSP's HDI assembly cost and verify sleep-state current figures in the datasheet power tables during battery-sizing analysis.
Recommended
Medical Monitoring and Health Devices
Connected medical monitors and health hubs use the CYW43455LXKUBGT to stream patient data over Wi-Fi 5 while pairing to sensors, cuffs, and clinician mobile devices over Bluetooth 5.3. Dual-band operation lets the device move telemetry to the less-congested 5 GHz band in hospital environments dense with 2.4 GHz traffic, improving data reliability for continuous monitoring. The integrated MCU isolates wireless stack certification and maintenance from the safety-critical application firmware, easing compliance documentation. Because medical designs need strict supply-chain and traceability control, the datasheet-compliant Bluetooth link quality of service and Infineon's longevity commitments make the AIROC family a defensible component choice.
Recommended
Automotive Aftermarket and Telematics Accessories
Aftermarket telematics units, dongles, and in-vehicle connectivity accessories use the CYW43455LXKUBGT to provide passenger Wi-Fi (802.11ac on 5 GHz for high-speed tethering) and Bluetooth 5.3 for phone pairing and hands-free profiles. The combo architecture keeps BOM cost low - one antenna-friendly IC replaces two radios - and the integrated MCU handles both stacks, reducing host firmware complexity. Note that the standard CYW43455 is not an AEC-Q100-qualified automotive-grade part; for applications inside the ECU domain, designers should consult Infineon for automotive-qualified connectivity options, while the standard grade is appropriate for powered-accessory products outside safety-critical paths.
Recommended
Recommended Products Summary
Engineering reference data for CYW43455LXKUBGT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CYW43455XKUBGT | CYW43455XKUBG |
|---|---|---|---|
| Package | 140-UFBGA / WLBGA (WLCSP-140), 4.47 x 5.27 mm | 140-UFBGA / WLBGA (WLCSP-140) - same | 140-UFBGA / WLBGA (WLCSP-140) - same |
| Brand | Infineon Technologies (AIROC, ex-Cypress) | Infineon Technologies | Infineon Technologies |
| Wi-Fi Standard | Wi-Fi 5 (802.11ac) | Wi-Fi 5 (802.11ac) | Wi-Fi 5 (802.11ac) |
| Bluetooth Version | Bluetooth 5.3 (per Infineon page) | Bluetooth 5.3 | Bluetooth 5.3 |
| Frequency Bands | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz |
| Integrated MCU | Yes | Yes | Yes |
| Ordering Suffix Meaning | L-grade, tape-and-reel (per Infineon OPN scheme) | Standard grade, tape-and-reel | Standard grade, tray |
| Drop-in Compatibility | Reference part | Pin-to-pin, same footprint | Pin-to-pin, same footprint |
Key Differentiators
- Dual-band Wi-Fi 5 (802.11ac) in an ultra-compact WLCSP (vs CYW43455XKUBGT)
- Bluetooth 5.3 support per manufacturer product page (vs CYW43455XKUBG)
- Integrated MCU protocol offload (vs CYW43455XKUBGT)
Design Notes
The CYW43455LXKUBGT is a 140-ball WLCSP measuring only 4.47 x 5.27 mm, so its land pattern requires fine-pitch HDI PCB technology (typically laser microvias under the package). Follow the land-pattern and ball-map tables in the Infineon CYW43455 datasheet exactly - do not scale patterns from similar parts. Provide a continuous ground plane on the layer directly beneath the package with via stitching around the RF region, and keep the antenna feed at 50 ohms controlled impedance per the datasheet layout guidelines.
Combo radio ICs draw burst currents during Wi-Fi TX bursts; size the power rail and decoupling network so voltage droop during an 802.11ac transmit burst stays within the datasheet limits. Place bulk (10 uF) and high-frequency (100 nF) ceramic capacitors close to the power balls as shown in the datasheet reference schematic. Since exact supply-voltage rails and current figures were not available in the verified web data, extract the power-supply requirements from the current Infineon datasheet revision before finalizing the PMIC selection.
Two frequent mistakes: (1) assuming Bluetooth feature level - Infineon's product page lists Bluetooth 5.3 while some distributor listings (DigiKey category text) still reference Bluetooth v4.1; confirm the feature set against the current datasheet and firmware release notes before promising LE-Audio or long-range PHY features to customers. (2) Using this commercial-grade combo in an automotive ECU - it is not advertised as AEC-Q100 qualified; for in-vehicle safety-relevant paths, consult Infineon for automotive-qualified alternatives and reserve this part for aftermarket accessories.
Compliance Information
Verified web data did not include explicit RoHS/REACH/lead-free statements for this OPN. AEC-Q100 qualification is not advertised in the provided data; treat as not qualified until confirmed with Infineon. Request material declarations from Infineon or your distributor.
