DP83TD555J-Q1 - 10BASE-T1S SPI MAC-PHY Transceiver | TI
MPN: DP83TD555J-Q1 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.5 | $4.50 |
| 10 | $4.05 | $40.50 |
| 100 | $3.6 | $360.00 |
| 500 | $3.24 | $1,620.00 |
| 1,000 | $2.88 | $2,880.00 |
Drop-in alternatives for DP83TD555J-Q1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DP83TD535-Q1
β Drop-Inπ Reference alternative (not in catalog)
TJA1410
β‘ Same Packageπ Reference alternative (not in catalog)
DP83TD555J-Q1 Maximum Ratings & Electrical Characteristics
| Protocol | IEEE 802.3cg 10BASE-T1S |
| Data Rate | 10 Mbps |
| Interface | OA SPI (3-pin) |
| Topology | Multidrop or point-to-point half-duplex |
| Cable Length | >25 m (depending on channel) |
| Nodes | >16 nodes (depending on channel) |
| Common Mode Voltage Tolerance | Extended |
| Wake/Sleep | TC10 compliant |
| Diagnostics | Cable fault detection, undervoltage, overtemperature |
| AEC-Q100 | Qualified |
| Operating Temperature | -40Β°C to +125Β°C |
| Package | VQFN-32 |
| Mounting Type | Surface Mount |
| RoHS | Compliant |
| Supply Voltage | [DATA_NEEDED: Supply voltage range] |
DP83TD555J-Q1 Pin Configuration
| Pin 1 | VDDIO β I/O supply voltage |
| Pin 2 | SCLK β SPI clock |
| Pin 3 | SDI β SPI data in |
| Pin 4 | SDO β SPI data out |
| Pin 5 | CS β SPI chip select |
| Pin 6 | INT β Interrupt output |
| Pin 7 | RST β Reset input |
| Pin 8 | VDD β Core supply voltage |
| Pin 9 | GND β Ground |
| Pin 10 | TX_P β Transmit positive |
| Pin 11 | TX_N β Transmit negative |
| Pin 12 | RX_P β Receive positive |
| Pin 13 | RX_N β Receive negative |
| Pin 14 | GND β Ground |
| Pin 15 | VDD β Core supply voltage |
| Pin 16 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
DP83TD555J-Q1 is suitable for 6 applications: Automotive Body Control Module, Industrial Sensor Network, Smart Lighting Control, Seat Control Module, Sensor Fusion Hub, Building Automation.
Automotive Body Control Module
The DP83TD555J-Q1 enables 10BASE-T1S Ethernet connectivity in body control modules, providing a high-speed, reliable network backbone for lighting, door locks, and window controls. Its AEC-Q100 qualification and extended common mode voltage tolerance ensure robust operation in harsh automotive environments. The integrated MAC reduces host MCU load, and TC10 wake/sleep minimizes standby current, making it ideal for always-on body electronics.
Recommended
Industrial Sensor Network
In industrial automation, the DP83TD555J-Q1 supports multidrop 10BASE-T1S networks over single twisted pair, reducing cabling cost and weight. Its diagnostic features like cable fault detection enable predictive maintenance. The device's extended common mode voltage tolerance and wide temperature range make it suitable for factory floor environments. The SPI interface simplifies integration with industrial microcontrollers, and the MAC-PHY design offloads protocol handling.
Recommended
Smart Lighting Control
The DP83TD555J-Q1 enables Ethernet-based lighting control in automotive and smart buildings. Its 10BASE-T1S interface supports daisy-chaining multiple light modules, simplifying wiring. TC10 wake/sleep allows individual light modules to enter low-power states when not in use, reducing overall energy consumption. The integrated MAC reduces the need for external Ethernet controllers, lowering BOM cost and PCB area.
Recommended
Seat Control Module
The DP83TD555J-Q1 provides high-speed communication for seat control modules, enabling features like memory presets and heating control. Its multidrop capability allows multiple seat modules to share a single network, reducing wiring complexity. The device's diagnostic features help detect wiring faults in the seat harness. The SPI interface simplifies connection to seat control MCUs, and the MAC-PHY integration reduces software overhead.
Recommended
Sensor Fusion Hub
The DP83TD555J-Q1 acts as a central communication link in sensor fusion systems, aggregating data from multiple sensors over a 10BASE-T1S network. Its high data rate and low latency enable real-time sensor data processing. The integrated MAC reduces host processor load, allowing more complex fusion algorithms. The device's AEC-Q100 qualification ensures reliability in automotive ADAS applications.
Recommended
Building Automation
In building automation, the DP83TD555J-Q1 enables Ethernet-based control of HVAC, lighting, and security systems over single twisted pair. Its multidrop topology reduces cabling cost and installation time. The device's low power consumption and TC10 wake/sleep support energy-efficient operation. The SPI interface simplifies integration with building automation controllers, and the MAC-PHY design reduces component count.
Recommended
Recommended Products Summary
Engineering reference data for DP83TD555J-Q1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DP83TD535-Q1 | TJA1410 |
|---|---|---|---|
| Package | VQFN-32 | VQFN-32 | VQFN-32 |
| Brand | Texas Instruments | Texas Instruments | NXP Semiconductors |
| Integrated MAC | Yes | No | No |
| Interface | OA SPI | MII/RMII | 3-pin interface |
| Data Rate | 10 Mbps | 10 Mbps | 10 Mbps |
| AEC-Q100 | Qualified | Qualified | Qualified |
| TC10 Wake/Sleep | Yes | Yes | Yes |
| Diagnostics | Cable fault, UV, OT | Cable fault, UV, OT | Advanced diagnostics |
Key Differentiators
- Integrated MAC reduces host MCU load (vs DP83TD535-Q1)
- OA SPI interface simplifies design (vs TJA1410)
- Comprehensive diagnostics (vs TJA1410)
Design Notes
Route the differential pair (TX_P/TX_N and RX_P/RX_N) with controlled impedance of 100 ohms differential. Keep the traces as short as possible and avoid vias to minimize signal integrity issues. Provide a solid ground plane beneath the transceiver and the differential pair to reduce noise and EMI.
Decouple the VDD and VDDIO pins with 0.1uF and 10uF capacitors placed as close to the pins as possible. Use a ferrite bead on the main supply to filter high-frequency noise. Ensure the supply voltage is within the recommended operating range as specified in the datasheet to avoid undervoltage or overvoltage conditions.
The DP83TD555J-Q1 in VQFN-32 package has a thermal pad that should be soldered to a large copper area on the PCB to enhance heat dissipation. For high-temperature automotive applications, ensure adequate thermal vias are placed under the thermal pad to conduct heat to the inner layers. Monitor the junction temperature to stay within the maximum rating.
Compliance Information
AEC-Q100 qualified per TI product page. RoHS compliant. Other compliance details not explicitly stated in the provided data.
