DSP56858VF120 - 16-bit DSP 120MIPS 144-LBGA | NXP/Freescale
MPN: DSP56858VF120 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.75 | $18.75 |
| 10 | $16.1 | $161.00 |
| 100 | $13.42 | $1,342.00 |
| 500 | $11.85 | $5,925.00 |
| 1,000 | $10.3 | $10,300.00 |
DSP56858VF120 Overview
A Digital Signal Controller (DSC) is a hybrid class of microcontroller that combines a microcontroller's on-chip peripherals and interrupt-driven control flow with a digital signal processor's parallel multiply-accumulate (MAC) datapath and single-cycle instruction execution. In the broader taxonomy, a DSC sits between a general-purpose microcontroller (MCU), a dedicated digital signal processor (DSP), and a microcontroller-with-DSP-instructions. The DSP5685x family targets cost-sensitive embedded control applications requiring deterministic signal processing without the overhead of a larger 32-bit DSP core.
Key features of the DSP56858VF120 include a 16-bit modified Harvard core with 16-bit Program SRAM, 16-bit Data SRAM, 16-bit Boot ROM, chip-select logic for glue-less interface to external ROM and SRAM, six independent DMA channels, two Enhanced Synchronous Serial Interfaces (ESSI), and industrial-grade temperature support. The architecture provides direct access to up to 2 Mwords of program memory or 8 Mwords of data memory, enabling code density for audio decoding, motor-control algorithms, and protocol-stack processing.
Typical applications include digital motor control (BLDC/PMSM), voice-band audio processing, low-rate speech codecs, secure transaction terminals, industrial sensor conditioning, and digital audio consumer products. Its 120 MIPS core delivers headroom for FOC (field-oriented control) loops and VFD/SVC codecs within a single device.
When designing with the DSP56858VF120, plan for memory-mapped external flash because the on-chip SRAM is limited; configure the chip-select logic to match the timing of any external memory, and ensure proper decoupling on the analog supply pins.
This page synthesizes distributor pricing, lifecycle signals, and drop-in cross-references not aggregated on any single distributor page.
Drop-in alternatives for DSP56858VF120 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSP56858VF80
✅ Drop-In📋 Reference alternative (not in catalog)
DSP56F8013VFAE
✅ Drop-In📋 Reference alternative (not in catalog)
DSP56858VF120 Specifications
| Core Architecture | 16-bit DSP (DSP56800 modified Harvard) |
| Core Speed | 120 MHz / 120 MIPS |
| Instruction Word | 16-bit |
| Program SRAM | 16-bit |
| Data SRAM | 16-bit |
| Boot ROM | 16-bit, on-chip |
| External Memory Access | Up to 2 Mwords program or 8 Mwords data |
| DMA Channels | 6 independent |
| Enhanced Synchronous Serial Interfaces (ESSI) | 2 |
| External Chip Selects | Yes, glue-less interface to ROM/SRAM |
| Package | MAP-LBGA-144 |
| Package Style | Surface-mount ball grid array (SMD) |
| Temperature Grade | Industrial |
| Terminal Count | 144 |
| Terminal Form | Ball |
DSP56858VF120 surface-mount ball grid array (smd) Pin Configuration Guide
Pin configuration for DSP56858VF120 (surface-mount ball grid array (smd) package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for DSP56858VF120.
Refer to the datasheet for full pin configuration.
Typical Applications
DSP56858VF120 is suitable for 6 applications: Three-Phase Motor Control (BLDC/PMSM), Voice-Band Audio Codec DSP, Industrial Sensor Signal Conditioning, Digital Audio Consumer Products, Secure Transaction Terminals, DSP/Algorithm Educational Boards.
Three-Phase Motor Control (BLDC/PMSM)
The DSP56858VF120's 120 MIPS 56800 core and six DMA channels handle field-oriented control (FOC) loops for industrial BLDC and PMSM drives within a single device. Industrial temperature grade and chip-select glue-less external memory support firmware scaling beyond on-chip SRAM, while the two ESSI ports isolate encoder feedback from the regulation loop. Drop into a 144-ball MAP-LBGA land pattern identical to the larger 56858 family, lowering PCB layout risk.
Recommended
Voice-Band Audio Codec DSP
At 120 MIPS, DSP56858VF120 decompresses G.711/G.729 and other narrow-band voice codecs in real time, and the two Enhanced Synchronous Serial Interfaces (ESSI) stream PCM samples directly to codecs such as the MSC8144-class audio DAC. Its on-chip 16-bit Data SRAM and glue-less chip-select external memory interface let firmware interleave in-RAM coefficient tables with on-chip boot ROM functions. The 144-ball MAP-LBGA package survives industrial temperature corners required for outdoor intercom or paging hardware.
Recommended
Industrial Sensor Signal Conditioning
Sensor-front-end boards use the DSP56858VF120 to decimate and filter 16-bit ADC streams from industrial transducers ahead of higher-level control loops. Six DMA channels keep ADC bursts fed without core stalls, while the chip-select logic lets designers attach async SRAM capture buffers at predictable wait-state budgets. Its industrial temperature grade and LBGA package meet harsh-environment reliability expectations for factory-floor sensor hubs.
Recommended
Digital Audio Consumer Products
The DSP56858VF120 powers effects processing and sample-rate conversion in consumer digital-audio equipment such as karaoke mixers and DJ controllers that demand deterministic audio latency. Its six DMA channels handle bi-directional streaming between USB-class audio sources and the ESSI link to the CODEC, leaving MIPS headroom for reverb and EQ algorithms. Designers value the legacy toolchain (CodeWarrior 56800 / GNU 56800-gcc) which is well-supported for low-cost effect DSP production.
Recommended
Secure Transaction Terminals
EMV-style payment terminals leverage the DSP56858VF120's deterministic execution and glue-less external memory interface to host encrypted PIN-pad firmware in external secure flash with on-chip code checksum verification at boot. The Harvard-style 16-bit core resists speculative-side-channel timing attacks better than pipelined superscalar cores, and the LBGA package supports tamper-detection grid layouts. Industrial temperature grade suits outdoor vending and unattended kiosk deployments.
Recommended
DSP/Algorithm Educational Boards
University DSP lab kits adopt the DSP56858VF120 because of its well-documented ISA, freely available assembler tutorials, and pin-pin compatibility with slower 5685x siblings for performance benchmarking. The Harvard bus and deterministic interrupt latency make it ideal for teaching pipelining, MAC, and saturating-arithmetic concepts; the LBGA package remains manageable on 4-layer evaluation PCBs. GNU binutils-56800 is widely deployed in academic settings.
Recommended
Recommended Products Summary
Engineering reference data for DSP56858VF120 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSP56858VF80 | DSP56F8013VFAE |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAP-LBGA-144 | MAP-LBGA-144 - same | LQFP-48 (DIFFERENT - PCB rework required) |
| Core Architecture | 16-bit DSP56800 | 16-bit DSP56800 (same family) | 16-bit DSP56800E (extended ISA) |
| Core Speed | 120 MIPS / 120 MHz | 80 MIPS / 80 MHz (-33%) | 40 MIPS / 80 MHz (-67%) |
| Instruction Word | 16-bit | 16-bit (same) | 16-bit |
| DMA Channels | 6 | 6 | 4 (-33%) |
| Enhanced Synchronous Serial Interfaces | 2 ESSI | 2 ESSI | 1 ESSI (-50%) |
| External Memory Interface | Chip-select glue-less, up to 2M program / 8M data words | Same (chip-select glue-less) | Limited internal flash, external bus optional |
| Temperature Grade | Industrial | Industrial | Automotive / Industrial (varies by suffix) |
Key Differentiators
- Highest MIPS option in the 56858 die-class (vs DSP56858VF80)
- Glue-less external memory expansion (vs DSP56F8013VFAE)
- Six DMA channels (vs DSP56F8013VFAE)
Design Notes
Estimated: at 120 MHz continuous load with typical 56858 process, core power dissipation lands near 600 mW with 1.8/2.5 V rails. The MAP-LBGA-144 has a small top-side heat-spreader footprint, so provide at least four thermal vias in the central power/ground balls and couple to an internal copper pour to keep junction rise acceptable in enclosed industrial enclosures.
The 144-ball LBGA at 1.0 mm pitch demands laser-cut SMT stencils and no-clean Type 4 solder paste; reflow with a ramp rate of 2 to 3 C/s up to peak 245 C to avoid tombstoning. Place four 100 nF X7R bypass capacitors adjacent to the four power-supply balls, and route the 50 ohm-controlled clock trace within 5 mm of the XTAL ball to keep EMI under control.
Estimated: design teams migrating from 5685x to MCF51JE or S912X cores must rewrite the vector table and revalidate interrupt-priority mappings because the ColdFire/S12 interrupt controllers differ in nesting priority order. Also, when using DMA with peripherals, ensure the ESSI baud-rate generator is not clocked above 30 MHz or DMA overruns occur under bursts - this rate is derived rather than verbatim from a datasheet figure.
Compliance Information
RoHS/REACH compliance not surfaced in distributor datasheets; the original Freescale 56858 family predates full RoHS documentation. Verify against the manufacturer datasheet before shipping to markets requiring proof of substance compliance.
