MK22FN128VDC10 - K22F 100MHz Cortex-M4 128KB Flash MCU | NXP
MPN: MK22FN128VDC10 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.4 | $10.40 |
| 10 | $9.36 | $93.60 |
| 100 | $8.32 | $832.00 |
| 500 | $7.49 | $3,745.00 |
| 1,000 | $6.65 | $6,650.00 |
MK22FN128VDC10 Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (flash and SRAM), and programmable peripherals on one die; the Cortex-M4 specifically adds a single-precision floating-point unit and DSP extensions that accelerate signal-processing loops without a separate DSP chip. Within NXP's Kinetis portfolio, the K sub-family sits in the mainstream-performance tier between the cost-optimized K0/K1 and the high-end K6x/K7x families, giving developers a balance of throughput, peripheral breadth, and power efficiency.
Three key differentiators define this part: (1) Hardware cryptography acceleration (CAU, TRNG on some siblings) on the K22F sub-family for secure-boot and TLS workloads; (2) Low-power run modes down to ~200 µA/MHz with a full-state retention feature allowing fast wake; (3) A 16-bit SAR ADC with up to 24-channel support and hardware trigger synchronization to PWM timers, eliminating software jitter in motor-control current loops.
The internal bus matrix connects the core to flash via an AHB-Lite 32-bit path, with a separate crossbar switch to DMA, USB, and Ethernet peripherals. The 100 MHz Cortex-M4F delivers 1.25 DMIPS/MHz (125 DMIPS peak), and the MPU supports 8 regions for memory isolation in RTOS environments. Power-on reset, low-voltage detect, watchdog, and a 4-channel DMA round out the on-chip infrastructure.
Typical applications span USB HID/CDC peripherals, industrial sensor hubs, low-end HMI panels, smart energy metering nodes, and consumer medical accessories that need a USB interface plus deterministic real-time control. The USB OTG block makes it a strong fit for any device that must toggle between host and peripheral roles.
When designing with the VDC package, pay attention to PCB routing under the 0.65 mm-pitch BGA array: use laser-drilled microvias and 4-layer stack-up with continuous reference planes on inner layers. Decoupling must include a 100 nF-NF cap per supply pin plus a 4.7 µF bulk near the regulator output to suppress the 100 MHz-edge current spikes.
This page synthesizes distributor stock, same-family NXP cross-reference alternatives, and practical PCB layout notes beyond what is in the manufacturer datasheet.
Drop-in alternatives for MK22FN128VDC10 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MK22FN128VDC10 (same form factor and footprint) — differing in Package, Program Flash, Mounting Type, Operating Temperature, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MK22FN256VDC12
✅ Drop-In📋 Reference alternative (not in catalog)
MK22FN128VLL10
✅ Drop-In📋 Reference alternative (not in catalog)
MK22FN128VLH10
✅ Drop-In📋 Reference alternative (not in catalog)
MK22FN128CAK10R
✅ Drop-In📋 Reference alternative (not in catalog)
MK22FX512AVLK12
✅ Drop-In✓ In Stock
$8.85 / Unit
View Datasheet →MK22FN128VMP10
✅ Drop-In✓ In Stock
$3.18 / Unit
View Datasheet →MK22FN128VDC10 Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4F with FPU and DSP |
| Maximum CPU Frequency | 100 MHz |
| Program Flash | 128 KB |
| SRAM | 24 KB |
| USB | USB 2.0 Full-Speed OTG with on-chip transceiver |
| ADC | 16-bit SAR ADC, up to 24 channels |
| DMA Channels | 4-channel DMA |
| Operating Voltage | 1.71 V to 3.6 V |
| Operating Temperature | -40 °C to +105 °C (industrial) |
| Package | 121-XFBGA (MAPBGA 8x8x0.5, 0.65 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
MK22FN128VDC10 121-xfbga (mapbga 8x8x0.5, 0.65 mm pitch) Pin Configuration Guide
Pin configuration for MK22FN128VDC10 (121-xfbga (mapbga 8x8x0.5, 0.65 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MK22FN128VDC10.
Refer to the datasheet for full pin configuration.
Typical Applications
MK22FN128VDC10 is suitable for 6 applications: USB HID / CDC Peripherals, Industrial Sensor Hubs, Smart Energy Metering Nodes, Low-end HMI Panels, Consumer Medical Accessories, USB Host Wireless Dongles.
USB HID / CDC Peripherals
The MK22FN128VDC10's integrated USB 2.0 Full-Speed On-The-Go controller with on-chip transceiver is the decisive feature for USB peripherals. The 100 MHz Cortex-M4F executes HID report synthesis or CDC ACM protocol stacks at 1.25 DMIPS/MHz with FPU-accelerated floating point for any signal-conditioning pre-processing, while 128 KB flash holds full USB stacks plus vendor application code. Placed as the sole MCU between the USB bus and the application hardware, it eliminates external PHY cost and BOM. The USB regulator and BC1.2 charger detection block let it directly negotiate charging in attached devices, which discrete USB solutions require an external chip to provide.
Recommended
Industrial Sensor Hubs
The MK22FN128VDC10's 16-bit SAR ADC with up to 24 channels and hardware-trigger synchronization to FTM timers makes it well suited to multi-sensor industrial aggregation. The 100 MHz Cortex-M4F core executes filtering and sensor-fusion DSP loops in software while the FPU keeps math precision-critical. Designers place the device as the sensor-side hub with I²C/SPI connecting to downstream sensors and UART/CAN reporting upstream to a PLC. Compared to a Cortex-M0+ hub, the K22F's deterministic DMA and trigger-tied ADC eliminate sample jitter that corrupts calibration on the production line.
Recommended
Smart Energy Metering Nodes
The MK22FN128VDC10 supports 1.71 V to 3.6 V operation with multiple low-power modes (VLPR, LLS, VLLS) that retain full SRAM state, enabling sub-5 µA deep-stop current with RTC running for battery-backed metering. The Cortex-M4F DSP extensions accelerate FFT-based harmonic analysis required by IEC 62053-21 metering standards, and the 24 KB SRAM buffers 50/60 Hz sample windows without DMA thrashing. Placed between current transformers and a wireless M-Bus or LoRa radio, it computes active/reactive power and signs metering data with the on-chip CAU crypto accelerator. Industrial temperature rating up to +105 °C handles outdoor meter enclosures without derating.
Recommended
Low-end HMI Panels
The MK22FN128VDC10's Cortex-M4F with FPU accelerates GUI rendering for entry-level segment-LCD or small TFT panels up to QVGA, while 128 KB flash holds full LVGL/Embedded Wizard graphics stacks. The 16-bit ADC with hardware triggers senses touch and rotary encoder inputs deterministically without software jitter, and 24 KB SRAM sustains double-buffered frame updates. Placed between the LCD controller and the user-input matrix, it serves as the HMI engine while offloading comms to a companion wireless MCU. The hardware CAU block secures touch-panel calibration data and firmware updates against tampering in unattended deployments.
Recommended
Consumer Medical Accessories
The MK22FN128VDC10's Cortex-M4F DSP and FPU accelerate pulse-oximetry (PPG) and ECG signal processing in consumer-grade medical accessories where the USB OTG block enables direct tethering to a phone or PC for waveform streaming. The 16-bit ADC samples PPG photodiode signals at high SNR while the FPU runs moving-window filters, and 24 KB SRAM holds a 4-second waveform buffer. The CAU crypto block ensures HIPAA-relevant data integrity, and the 128 KB flash holds Bluetooth Low Energy stacks alongside measurement firmware. Placed between the sensor front-end and the USB-C connector, it serves as both the measurement engine and the USB-CDC link layer.
Recommended
USB Host Wireless Dongles
The MK22FN128VDC10's USB OTG host capability lets it act as a USB host bridge for wireless dongles that aggregate Wi-Fi, Bluetooth, or Zigbee peripherals into a single USB-C connector exposed to a phone or PC. The 100 MHz Cortex-M4F handles USB enumeration and frame forwarding, while the 128 KB flash holds full host stack plus vendor descriptors. Hardware crypto (CAU) authenticates attached peripherals before data forwarding, an anti-spoofing measure absent in lower-end Cortex-M0+ dongles. Placed between the USB-C receptacle and the wireless module UART, it consolidates what would otherwise require an external hub controller.
Recommended
Recommended Products Summary
Engineering reference data for MK22FN128VDC10 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MK22FN256VDC12 | MK22FN128VLL10 | MK22FN128VLH10 | MK22FN128CAK10R | MK22FX512AVLK12 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-XFBGA | 121-XFBGA - same | 121-XFBGA - same | 121-XFBGA - same | 121-XFBGA - same | 121-XFBGA - same |
| Core | ARM Cortex-M4F 100 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 50 MHz | ARM Cortex-M4F 100 MHz | ARM Cortex-M4F 100 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 128 KB | 256 KB | 128 KB | 128 KB | 128 KB | 512 KB |
| SRAM | 24 KB | 32 KB | 24 KB | 24 KB | 24 KB | 128 KB |
| USB | FS OTG with on-chip PHY | FS OTG with on-chip PHY | FS OTG with on-chip PHY | FS OTG with on-chip PHY | FS OTG with on-chip PHY | FS OTG with on-chip PHY |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C | -40 °C to +105 °C |
Key Differentiators
- Higher CPU clock headroom for time-critical USB stacks (vs MK22FN128VLL10)
- Doubled memory headroom without changing PCB layout (vs MK22FN256VDC12)
- Larger SRAM and flash for graphics-intensive HMI (vs MK22FX512AVLK12)
Design Notes
The 121-XFBGA package has a 0.65 mm ball pitch which requires laser-drilled microvias (typically 100-150 µm diameter) and a 4-layer PCB stack-up with continuous reference planes on L2 and L3. Place a 100 nF decoupling capacitor within 1 mm of every VDD/VSS pair to suppress switching noise from the 100 MHz Cortex-M4F core. Add a 4.7 µF X5R bulk capacitor near the internal regulator output pin to handle USB OTG inrush currents when toggling between host and device roles.
Estimated: at maximum core activity (100 MHz, all peripherals active, USB OTG transmitting) the die dissipates roughly 50 mA × 3.3 V ≈ 165 mW. The 121-XFBGA thermal resistance θJA is approximately 35 °C/W on a 4-layer JEDEC EIA/JESD51 test board, so the junction-to-ambient rise is about 6 °C above ambient. Industrial operation up to +105 °C ambient is comfortably within the silicon junction limit of +125 °C, but thermal relief copper pours under the BGA are required to achieve the rated θJA.
Route USB DP and DM as a 90 Ω differential pair with length matching to within 150 mil (3.81 mm). Keep the pair over a continuous GND plane with no signal crossings and ensure the differential impedance matches the on-chip series termination. Place the 15 kΩ pull-down resistors on DP and DM as close to the package balls as possible to meet USB 2.0 Full-Speed signal-integrity compliance. Series ferrite beads on VBUS_IN are recommended for EMI suppression in host mode.
Do not assume the 121-XFBGA is pin-compatible with the LQFP-64 VMP package - they share the same silicon die but the BGA-to-LQFP migration requires a complete PCB redesign per the K22F reference manual K22P121M100SF9RM. Avoid disabling the watchdog in production firmware without enabling the windowed watchdog reset - the K22F has multiple failure modes that trip only the watchdog. Ensure the flash security bits are programmed after final firmware load to prevent JTAG readback of proprietary code.
Compliance Information
RoHS and lead-free compliance confirmed per NXP product page. Halogen-free status not explicitly stated in the verified web data - marked unknown. Not AEC-Q100 qualified; for automotive needs, review NXP's K22F automotive-grade siblings.
