DSPIC33CK64MP208-E/PT - 16-bit 100MHz DSC, 64KB Flash | Microchip
MPN: DSPIC33CK64MP208-E/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.2 | $7.20 |
| 10 | $6.55 | $65.50 |
| 100 | $5.9 | $590.00 |
| 500 | $5.45 | $2,725.00 |
| 1,000 | $4.98 | $4,980.00 |
DSPIC33CK64MP208-E/PT Overview
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic control of a microcontroller. Within the power-management hierarchy, the dsPIC33CK sits above simple MCUs and below multi-core application processors, making it the standard choice for closed-loop control of switching power converters and motors where cycle-accurate PWM timing matters more than raw application throughput.
Key features of this device include the dsPIC33CK DSC core executing up to 100 MIPS (DC to 100 MIPS per the datasheet), a modified Harvard architecture, and an extended-temperature operating envelope of -40C to +150C at 3.0V to 3.6V, which is what the -E/ ordering suffix denotes. The MP208 variant adds three on-chip operational amplifiers and three analog comparators, offloading signal conditioning from external components in current-sense loops.
Architecturally, the dsPIC33CK family integrates a high-resolution PWM peripheral (HRPWM) with sub-nanosecond effective resolution, CAN Flexible Data-rate (CAN FD) for in-vehicle and industrial networking, dual-partition Flash with ECC and Live Update for fail-safe field firmware upgrades, and on-chip DSP multiply-accumulate (MAC) instructions for filter and transform math. Per Mouser, the device provides 3 op-amps, 3 comparators, and Peripheral Trigger Generator (PTG) resources.
Typical applications include digital power supplies (LLC, totem-pole PFC, buck/boost), brushless DC and PMSM motor control with field-oriented control (FOC), power-factor-correction stages, and high-temperature industrial sensing nodes that must survive near-engine environments.
Design consideration: keep VDD within the 3.0V to 3.6V datasheet window and derate maximum clock and analog performance when operating above +125C, since the -150C rating applies to the extended (E) grade only.
This page synthesizes distributor data, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK64MP208-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK64MP208-E/PT (same form factor and footprint) — differing in Operating Temperature, Special Peripherals, Core, Package, Architecture.
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DSPIC33CK64MP208-I/PT
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View Datasheet →DSPIC33CK32MP208-E/PT
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DSPIC33CH64MP208-I/PT
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DSPIC33CK64MP208-E/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz (up to 100 MIPS) |
| Program Flash | 64 KB with ECC, dual-partition Live Update |
| Data SRAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +150C (Extended, E grade) |
| Package | TQFP-80 (PT) |
| Architecture | Modified Harvard |
| On-chip Op-Amps | 3 |
| Comparators | 3 |
| Communication Interfaces | CAN FD, UART, SPI, I2C |
| PWM | High-Resolution PWM (HRPWM) |
| Special Peripherals | Peripheral Trigger Generator (PTG) |
| Flash Feature | ECC and Live Update (dual-partition Flash) |
| Mounting Type | Surface Mount |
| Product Family | dsPIC33CK MP series (digital power and motor control) |
DSPIC33CK64MP208-E/PT tqfp-80 (pt) Pin Configuration Guide
Pin configuration for DSPIC33CK64MP208-E/PT (tqfp-80 (pt) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK64MP208-E/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK64MP208-E/PT is suitable for 6 applications: Digital Power Supplies (LLC, Totem-Pole PFC, DC-DC), Brushless Motor Control (FOC for BLDC/PMSM), High-Temperature Industrial Sensing and Control Nodes, Automotive-Adjacent Networked Actuators and Body Control, Wireless-Connected Industrial IoT Edge Controllers, Power Factor Correction and Solar Micro-Inverter Control.
Digital Power Supplies (LLC, Totem-Pole PFC, DC-DC)
The DSPIC33CK64MP208-E/PT fits digitally controlled power converters because its High-Resolution PWM achieves fine pulse-width resolution critical for phase-shifted full-bridge, LLC, and totem-pole PFC topologies, where coarse PWM steps would otherwise limit regulation accuracy at high switching frequency. The 100 MIPS core closes voltage- and current-mode control loops in software with headroom for nonlinear compensators. The three on-chip op-amps amplify shunt or Hall current-sense signals without external amplifiers, while the three comparators implement hardware cycle-by-cycle overcurrent protection with microsecond-scale response, faster than any software interrupt path. The extended -40C to +150C rating allows placement near hot switching stages in enclosed converters. Place the DSC adjacent to the gate drivers with short, ground-referenced PWM traces and use the PTG to trigger ADC sampling synchronized to PWM events, minimizing switching-noise aliasing in the control loop.
Recommended
Brushless Motor Control (FOC for BLDC/PMSM)
Field-oriented control of brushless DC and permanent-magnet synchronous motors is a primary target for the DSPIC33CK64MP208-E/PT. The 100 MHz dsPIC33CK core executes the Clarke/Park transforms, PI current loops, and speed loop within one PWM period at typical 10-100 kHz PWM frequencies, while the DSP multiply-accumulate instructions accelerate the trigonometric math. The three integrated op-amps condition the phase-current shunt signals directly, and the three comparators provide hardware overcurrent trip to the PWM fault inputs for protection that never depends on software latency. The High-Resolution PWM delivers the fine duty resolution needed for smooth low-speed torque and reduced current ripple. The CAN FD peripheral integrates the drive into industrial or vehicle networks. Combined, these resources let a single 80-pin TQFP replace a controller plus external analog front end, reducing BOM count in servo drives, e-bikes, pumps, and HVAC blowers.
Recommended
High-Temperature Industrial Sensing and Control Nodes
The -40C to +150C extended rating of the DSPIC33CK64MP208-E/PT makes it suitable for sensing and local-control nodes installed close to heat sources: engine bays, industrial ovens, injection-molding machines, and solar inverters where ambient plus self-heating exceeds the +125C ceiling of industrial-grade parts. The 64 KB ECC-protected Flash maintains data integrity at temperature, and dual-partition Live Update allows firmware field upgrades without bricking a deployed node. The on-chip op-amps and comparators condition sensor signals (thermocouple amplifiers, bridge circuits) locally, and the CAN FD interface streams data over robust differential wiring typical in factory networks. Designers should still derate clock speed and verify ADC specifications at the top of the temperature range per the datasheet electrical tables, and provide copper pour under the TQFP-80 to conduct junction heat into the PCB plane.
Recommended
Automotive-Adjacent Networked Actuators and Body Control
With CAN FD connectivity, a 100 MIPS core, and a +150C temperature rating, the DSPIC33CK64MP208-E/PT serves non-safety automotive-adjacent and heavy-equipment nodes such as pump controllers, fan modules, valve actuators, and lighting controllers mounted near the engine or power electronics. CAN FD raises payload capacity to 64 bytes per frame versus 8 bytes in classical CAN, useful for streaming diagnostics and configuration. The high-resolution PWM directly drives actuators with proportional control, and the op-amps close current loops for inductive loads. Dual-partition Flash with ECC supports fail-safe OTA-style firmware updates over the vehicle network - important for fleets. Note this commercial-grade part is not itself AEC-Q100 qualified; for full automotive qualification requirements, verify the applicable qualification status with Microchip before design-in, and implement the CAN FD with a suitable extended-temperature external transceiver.
Recommended
Wireless-Connected Industrial IoT Edge Controllers
The DSPIC33CK64MP208-E/PT works as the deterministic real-time controller in IoT edge nodes where sensors and actuators need tight timing that cloud-connected modules cannot guarantee. The 100 MIPS core handles local control loops, filtering, and the PTG generates complex trigger sequences autonomously, offloading the main software. Its ECC Flash and MBIST-style memory protection features improve uptime in unattended deployments, and Live Update enables remote firmware refresh. A wireless module (Wi-Fi, BLE, or LoRa) connected via UART or SPI handles uplink, while CAN FD or RS-485-style UART links cover fieldbus integration. The three op-amps reduce external analog components in custom sensor front ends. Designers should budget the 8 KB SRAM carefully - it is generous for control loops but modest for TLS stacks, so terminate secure connections on the wireless module rather than the DSC to keep memory headroom for the real-time application.
Recommended
Power Factor Correction and Solar Micro-Inverter Control
Power-factor-correction stages and solar micro-inverters demand fast, precise, and phase-accurate PWM - exactly the profile of the DSPIC33CK64MP208-E/PT. The High-Resolution PWM supports the interleaved and phase-shifted drive schemes used in boost PFC and DC-link stages, while the 100 MIPS core executes average-current-mode or predictive control algorithms at switching frequency rates. The three comparators give instantaneous hardware overcurrent shutdown for MOSFET survival during transients, and the op-amps condition input-current shunt signals. The +150C ambient rating tolerates the thermal environment inside sealed inverter enclosures, and dual-partition ECC Flash supports utility-grade firmware integrity. For grid-tied designs, dedicate ADC sampling triggered by the PWM to sample inductor current away from switching edges, and implement the grid-synchronization (PLL) routine using the DSP math instructions to maintain low distortion across line-frequency and load variations.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK64MP208-E/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK64MP208-I/PT | DSPIC33CK32MP208-E/PT | DSPIC33CH64MP208-I/PT |
|---|---|---|---|---|
| Package | TQFP-80 (PT) | TQFP-80 (PT) - same | TQFP-80 (PT) - same | TQFP-80 (PT) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz master core (dual-core) |
| Program Flash | 64 KB (ECC, dual-partition) | 64 KB (ECC, dual-partition) | 32 KB (ECC, dual-partition) | 64 KB total (split master/slave) |
| Operating Temperature | -40C to +150C (E grade) | -40C to +125C (I grade) | -40C to +150C (E grade) | -40C to +125C (I grade) |
| CAN FD | Yes | Yes | Yes | Yes |
| Architecture | Single-core dsPIC33CK | Single-core dsPIC33CK | Single-core dsPIC33CK | Dual-core dsPIC33CH (master + slave) |
Key Differentiators
- Extended -40C to +150C operation in a standard package (vs DSPIC33CK64MP208-I/PT)
- Maximum on-chip analog integration in the dsPIC33CK family tier (vs DSPIC33CK32MP208-E/PT)
- Simple single-core determinism versus dual-core overhead (vs DSPIC33CH64MP208-I/PT)
Design Notes
Supply the DSPIC33CK64MP208-E/PT from a clean 3.3V rail within the 3.0V to 3.6V datasheet window. Place a 0.1uF ceramic decoupling capacitor at each VDD/VDDCORE pin pair plus one bulk 10uF capacitor, per Microchip's general dsPIC33CK hardware design guidelines in the family datasheet and reference manuals. In digital power applications, isolate the controller ground from power-stage ground with a single-point star connection and consider an RC filter or ferrite on the AVDD pin so PWM switching noise does not corrupt op-amp and ADC accuracy.
Estimated: at 3.3V and typical full-speed active current on the order of tens of mA (datasheet electrical tables give exact figures), self-heating is roughly 0.1-0.2W, which through the TQFP-80 theta_JA (datasheet value) yields only a modest junction rise - but in a +125C or +150C ambient your margin to the +150C absolute ceiling is thin. Compute T_J = T_A + P x theta_JA with the datasheet theta_JA for your board copper area, and derate clock speed or add copper pour if the margin is under 10C. Never rely on the -I grade where worst case exceeds +125C.
Three recurring pitfalls with the MP208: (1) op-amp and comparator analog input pins are fixed-function - confirm pin assignment in the datasheet pin diagrams before routing the PCB, because Peripheral Pin Select only remaps digital functions; (2) dual-partition Live Update changes the linker memory map - configure the MPLAB X project correctly or your application may only occupy one partition; (3) CAN FD requires an external transceiver and proper termination (120 ohm at both ends of the bus); the on-chip peripheral is only the protocol controller.
Keep the High-Resolution PWM output traces short and routed away from analog sense lines to prevent capacitive coupling into the op-amp inputs. Use a solid ground plane under the TQFP-80 and stitch thermal vias near the package to spread heat in extended-temperature designs. Place crystal/oscillator traces as short as possible and guard them with ground. For field upgrades, expose ICSPCLK/ICSPGD programming pads on production boards even if unused, since rework access to 0.5 mm pitch TQFP pins after assembly is difficult.
Compliance Information
RoHS/lead-free per Microchip standard product policy for TQFP packages; specific REACH, halogen-free, and conflict-minerals declarations for this ordering code were not present in retrieved data - download the Microchip material declaration from the product page for contractual use.
