DSPIC33EP16GS202T-E/M6 - 16-bit 70 MIPS DSC 16KB Flash | Microchip
MPN: DSPIC33EP16GS202T-E/M6 ✓ Active| Qty | Unit Price | Extended |
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DSPIC33EP16GS202T-E/M6 Overview
A digital signal controller combines the computational architecture of a microcontroller (MCU) with the signal-processing capability of a DSP. In the power-management hierarchy, the dsPIC33EP16GS202 belongs to Microchip's dsPIC33EP GS family, which integrates interconnected high-speed PWM peripherals, a high-speed ADC with programmable gain amplifier (PGA), and analog comparators - peripherals purpose-built for closed-loop control of switching power converters.
Key features include the interconnected high-speed PWM module with individual PWM channels, deadlock and trigger control, 16KB self-programmable Flash with ECC-class safety support (the device is listed as Functional Safety / FuSa capable on DigiKey), connectivity peripherals (I2C, SPI, UART, IrDA, LINbus), 21 general-purpose I/O lines, and an on-chip DSP engine with barrel shifter and dual internal bus architecture for efficient MAC operations.
The GS-family architecture was designed specifically for digital power applications: the PWM, ADC, PGA, and comparators are interconnected so that ADC conversion can be triggered by PWM events with minimal latency, enabling high-bandwidth current-mode control loops in switched-mode power supplies. Microchip's 350W interleaved power factor correction (PFC) reference design demonstrates this capability across universal AC input ranges.
Typical applications include AC-DC power supplies, interleaved PFC stages, DC-DC converters, digital lighting ballasts, battery chargers, and solar micro-inverters - anywhere deterministic, high-frequency closed-loop control is required.
Design consideration: the 3V to 3.6V supply window requires a regulated 3.3V rail; the UQFN 4x4 package exposes a ground pad beneath the die that must be soldered to a solid ground pour for thermal and electrical performance.
This page synthesizes distributor listings, drop-in same-family alternatives, and digital-power design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP16GS202T-E/M6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP16GS202T-E/M6 (same form factor and footprint) — differing in Package, Operating Temperature, Core Architecture, Specialized Peripherals, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP16GS202-I/M6
✅ Drop-In✓ In Stock
$2.1 / Unit
View Datasheet →DSPIC33EP16GS202-E/M6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33EP32GS202-I/M6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.18 / Unit
View Datasheet →DSPIC33EP64GS202-E/M6
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GS202T-E/M6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.84 / Unit
View Datasheet →DSPIC33EP16GS202T-E/M6 Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EP DSC core |
| Max CPU Speed | 70 MIPS (60 MIPS listed on some distributor pages) |
| Program Memory (Flash) | 16 KB (16K x 8) |
| RAM | 2 KB (2K x 8) |
| Supply Voltage Range | 3 V to 3.6 V |
| Package | 28-UQFN (4x4 mm), code M6 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E grade) |
| General Purpose I/O | 21 I/O |
| Connectivity Peripherals | I2C, SPI, UART, IrDA, LINbus |
| Specialized Peripherals | Interconnected high-speed PWM, ADC with PGA, comparators |
| Functional Safety | FuSa-capable per DigiKey listing |
| Packaging | Tape & Reel (T suffix) |
| Product Family | dsPIC33EP16GS202 (GS202 family, digital power) |
DSPIC33EP16GS202T-E/M6 28-uqfn (4x4 mm), code m6 Pin Configuration Guide
Pin configuration for DSPIC33EP16GS202T-E/M6 (28-uqfn (4x4 mm), code m6 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP16GS202T-E/M6.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP16GS202T-E/M6 is suitable for 6 applications: Interleaved Power Factor Correction (PFC), AC-DC Switch-Mode Power Supplies, DC-DC Converters and Point-of-Load Regulation, Digital Lighting and Electronic Ballasts, Battery Chargers and BMS Front Ends, Solar Micro-Inverters and Renewable Energy Converters.
Interleaved Power Factor Correction (PFC)
The DSPIC33EP16GS202T-E/M6 is the control core of Microchip's 350W interleaved PFC reference design, which operates from universal AC input and produces a single high-voltage DC output. Its interconnected high-speed PWM generates phase-shifted drive signals for two interleaved boost legs, while the fast ADC with PGA samples inductor current on PWM-triggered events with deterministic latency. The 70 MIPS DSP engine with MAC instructions executes the current-loop compensation at switching frequency, and hardware comparators provide cycle-by-cycle overcurrent protection independent of software. This makes it ideal for offline power supplies needing high power factor and low THD.
Recommended
AC-DC Switch-Mode Power Supplies
In off-line and DC-input AC-DC converter designs, the DSPIC33EP16GS202T-E/M6 replaces analog control ICs with a digitally controlled solution. The high-speed PWM module supports complementary outputs with adjustable dead time for half-bridge and full-bridge topologies, and ADC conversions can be synchronized to PWM so that voltage and current feedback are sampled at the optimal point in the switching cycle, free of switching noise. The extended -40C to +125C temperature grade of the E/M6 version suits sealed industrial power supplies. Digital control also enables adaptive compensation, soft-start sequencing, and telemetry over the UART or I2C port to a host system.
Recommended
DC-DC Converters and Point-of-Load Regulation
For high-frequency DC-DC conversion - buck, boost, buck-boost, and LLC stages - the DSPIC33EP16GS202T-E/M6 offers the deterministic control loop timing that digital power demands. The interconnected PWM/ADC architecture keeps the loop from sample to drive update within one switching period, and the on-chip comparators implement hardware current limiting for fault response faster than any software loop. The 3V-3.6V supply and 16KB Flash accommodate compact control firmware including soft-start, hiccup-mode fault handling, and output voltage scheduling. Its 28-UQFN 4x4 mm footprint fits densely on power daughterboards and brick-style converter modules.
Recommended
Digital Lighting and Electronic Ballasts
Fluorescent electronic ballasts and high-brightness LED drivers require resonant or multi-channel PWM control with lamp/LED current regulation - a natural fit for the DSPIC33EP16GS202T-E/M6. The high-speed PWM can drive half-bridge resonant stages with frequency control for dimming, while the PGA-amplified ADC channel reads current-sense shunt signals directly. Communication peripherals (UART, I2C) support DALI or DMX-style digital dimming interfaces. The extended temperature rating covers enclosed luminaires, and hardware fault trips protect the power stage during lamp open/short events, meeting the safety behavior expected in lighting ballast designs.
Recommended
Battery Chargers and BMS Front Ends
Multi-chemistry battery chargers benefit from the DSPIC33EP16GS202T-E/M6's combination of precision analog sensing and switch-mode control. The ADC with PGA measures charge current and pack voltage through shunt or divider networks, the PWM drives the charging power stage, and comparators enforce hardware safety thresholds for overcurrent and overvoltage. Charge algorithm state machines (CC-CV, trickle, termination) fit comfortably in 16KB Flash, and the UART/LINbus connectivity enables communication with vehicle or host battery-management systems. The -40C to +125C grade supports chargers mounted near power components in industrial and motive applications.
Recommended
Solar Micro-Inverters and Renewable Energy Converters
Micro-inverters and module-level power electronics combine MPPT (maximum power point tracking), DC-DC conversion, and grid-synchronized inversion. The DSPIC33EP16GS202T-E/M6 runs MPPT algorithms in its DSP-enhanced core while its interconnected PWM and ADC execute the fast power-stage control loops; 70 MIPS provides headroom for perturb-and-observe or incremental-conductance MPPT executed at kHz rates alongside the control loop. The 3V-3.6V rail simplifies interface to low-voltage sensing circuits. For designs needing more code space for grid standards and communications, the same-footprint 32GS202/64GS202 variants provide a direct memory upgrade path.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP16GS202T-E/M6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP16GS202-I/M6 | DSPIC33EP16GS202-E/M6 | DSPIC33EP32GS202-I/M6 | DSPIC33EP64GS202-E/M6 |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm, M6) | 28-UQFN (4x4 mm, M6) - same | 28-UQFN (4x4 mm, M6) - same | 28-UQFN (4x4 mm, M6) - same | 28-UQFN (4x4 mm, M6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 16 KB | 16 KB | 16 KB | 32 KB | 64 KB |
| Max Performance | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Packaging Format | Tape & Reel (T) | Tube/Tray | Tube/Tray | Tube/Tray | Tube/Tray |
Key Differentiators
- Extended temperature headroom (vs DSPIC33EP16GS202-I/M6)
- Fits compact control firmware economically (vs DSPIC33EP32GS202-I/M6)
- Tape-and-reel ready for volume SMT assembly (vs DSPIC33EP16GS202-E/M6)
Design Notes
The 28-UQFN 4x4 mm package has an exposed die-attach pad underneath the device that is internally bonded to ground. The PCB land pattern must include a center thermal pad soldered to a solid ground pour with an array of thermal vias (typically 4-9 vias of 0.3 mm). Skipping the exposed-pad connection is the single most common UQFN assembly defect - it causes floating ground returns, erratic ADC readings, and intermittent resets under load. Follow the Microchip UQFN soldering guidelines for stencil aperture design (approximately 50-70% pad coverage to avoid bridging).
The device operates from a 3V-3.6V rail, so in a digital power supply the controller rail should come from a small dedicated LDO or buck fed from the converter's auxiliary winding. Add a 0.1uF ceramic at each VDD pin plus one 4.7uF-10uF bulk capacitor near the package. In SMPS environments the controller shares ground with high-di/dt power loops - route the controller's analog ground star point away from PWM output return paths to keep ADC ground-referred noise below 1-2 LSB. Estimated: with 70 MIPS at 3.3V, controller consumption is typically tens of milliamps, so an LDO rated at 100 mA is sufficient.
When migrating firmware between the 16GS202 and its 32/64KB siblings, remember that configuration bits and the PLL setup must match the actual crystal/FRC frequency; the GS202 datasheet (DS70005208E) provides the Fmax-versus-voltage table - running 70 MIPS below the minimum voltage for that speed can cause marginal operation. Also, because the DigiKey listing shows 60 MIPs while Mouser shows 70 MIPS, verify your target clock configuration in simulation before committing the design. Finally, the peripheral pin select (PPS) mapping must be explicitly programmed at startup or I/O will appear dead.
Compliance Information
Compliance status was not explicitly stated in the provided verified web data. Microchip's current production dsPIC33EP devices are generally RoHS-compliant, but official certificates must be obtained from Microchip or the distributor for regulatory documentation.