DSPIC33EP128MU504-H/PT - 16-bit DSC, 128KB Flash, USB, CAN | Microchip
MPN: DSPIC33EP128MU504-H/PT β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.21 | $62.10 |
| 100 | $5.52 | $552.00 |
| 500 | $4.97 | $2,485.00 |
| 1,000 | $4.48 | $4,480.00 |
DSPIC33EP128MU504-H/PT Overview
A digital signal controller is a hybrid device that merges the computational throughput and math acceleration of a digital signal processor with the peripherals, interrupt structure and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between general-purpose MCUs and application-specific DSPs, providing deterministic real-time control plus signal-processing capability in a single chip.
Key features include USB 2.0 full-speed device and On-The-Go (OTG) support, a CAN 2.0B module, a 12-bit ADC with up to 500 ksps throughput, three integrated operational amplifiers, and multiple Motor Control and Captured Compare PWM (MCCP/SCCP) modules. Quadrature Encoder Interface (QEI) and Programmable Timing Generator (PTG) blocks offload timing-critical tasks from the CPU.
The dsPIC33EP architecture executes most instructions in a single cycle, with a 16-bit modified Harvard bus, DSP multiply-accumulate (MAC) instructions, and hardware division support, making closed-loop control algorithms efficient and deterministic.
Typical applications include digital power supplies and power factor correction, brushless DC and PMSM motor control with sensorless FOC, USB-connected instrumentation and industrial sensors, and CAN-based automotive or industrial networking nodes. The extended -40C to +150C temperature rating suits underhood and high-heat industrial environments.
Design consideration: the maximum core supply is 3.6V; ensure the 3.3V rail is well regulated and decouple VDD/VDDCORE with low-ESR ceramics per the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128MU504-H/PT β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128MU504-H/PT (same form factor and footprint) β differing in Operating Temperature, Package.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DSPIC33EP128MU504-E/PT
β Drop-Inπ Reference alternative (not in catalog)
DSPIC33EP128MU504-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP256MU504-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP64MU504-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP128MU204T-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.32 / Unit
View Datasheet βDSPIC33EP128MC504-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP128MU504-H/PT Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33E 16-bit DSC |
| Core Size | 16-bit |
| Maximum Speed | 70 MIPS |
| Flash Program Memory | 128 KB |
| RAM | 16 KB |
| EEPROM / Data Flash | 1 KB |
| Connectivity | USB OTG, CAN 2.0B, UART, SPI, I2C |
| ADC Resolution | 12-bit |
| Integrated Op-Amps | 3 |
| PWM Modules | MCCP / SCCP (Motor Control PWM) |
| QEI (Quadrature Encoder Interface) | Yes |
| PTG (Programmable Timing Generator) | Yes |
| Supply Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +150C |
| Package | 44-pin TQFP (PT) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
DSPIC33EP128MU504-H/PT 44-pin tqfp (pt) Pin Configuration Guide
Pin configuration for DSPIC33EP128MU504-H/PT (44-pin tqfp (pt) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128MU504-H/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128MU504-H/PT is suitable for 6 applications: Digital Power Supplies and PFC, Brushless DC / PMSM Motor Control, USB-Connected Instrumentation and Data Loggers, CAN Networking Nodes for Industrial and Automotive Systems, Embedded Industrial Sensing and IoT Gateways, High-Temperature (150C) Embedded Control.
Digital Power Supplies and PFC
The DSPIC33EP128MU504-H/PT is well suited to digitally controlled AC-DC and DC-DC converters because its 70 MIPS core closes current loops at 100-500 kHz switching frequencies with single-cycle MAC instructions for PID and compensator math. The 12-bit ADC samples voltages and currents with sub-microsecond latency, while MCCP/SCCP PWM modules generate complementary outputs with dead-time insertion in hardware, offloading the CPU. The three integrated op-amps buffer current-shunt signals without an external analog front end, reducing BOM cost. Its +150C rating allows placement near hot power stages. Trade-off: unlike dedicated digital-power ICs, firmware development effort is higher, but the dsPIC33EP offers full control-loop flexibility and Microchip's Digital Compensator libraries accelerate the work.
Recommended
Brushless DC / PMSM Motor Control
Sensorless FOC for BLDC and PMSM motors is a flagship use of the dsPIC33EP 'MU' family. The 70 MIPS core executes Clarke/Park transforms and PI current loops at 10-20 kHz PWM frequencies, while hardware QEI interfaces encoders for servo-class positioning. The 12-bit ADC is synchronized to the PWM period for low-noise phase-current sampling, and the three on-chip op-amps amplify shunt signals directly. MCCP modules produce three-phase complementary drive with hardware dead time, eliminating CPU jitter. With USB and CAN on-chip, the same controller doubles as a fieldbus node for industrial drives. For pure motor-control designs without USB, DSPIC33EP128MC504-I/PT offers the same capability set minus USB at lower cost.
Recommended
USB-Connected Instrumentation and Data Loggers
The integrated USB 2.0 full-speed device/OTG module makes this DSC a compact front end for bench instruments, sensors and loggers that plug into a PC without a separate USB interface chip. Analog signals route through the three op-amps and the 12-bit ADC at up to 500 ksps; the 70 MIPS core applies DSP filtering (IIR/FIR) before streaming data over USB CDC/HID classes supported by Microchip's Harmony stack. The 1KB data flash stores calibration constants across power cycles. With the -H grade rated to +150C, the same design works in high-temperature enclosures. Trade-off: 12 Mbps full-speed caps streaming bandwidth, so for high-rate acquisition, buffer on-chip in the 16KB RAM and batch-transfer blocks.
Recommended
CAN Networking Nodes for Industrial and Automotive Systems
The on-chip CAN 2.0B controller with hardware message buffers lets the DSPIC33EP128MU504-H/PT serve as a smart node on industrial fieldbus or vehicle networks. Combined with the 70 MIPS core, nodes can run local control loops (using MCCP PWM and the 12-bit ADC) while handling J1939- or CANopen-style communication stacks stored in 128KB flash. The -H temperature rating of -40C to +150C covers underhood and engine-compartment zones that defeat consumer-grade MCUs. QEI supports encoder-based local sensing such as throttle-position or actuator feedback. For designs needing dual CAN buses, the dsPIC33EP128GM304T-I/PT is the recommended same-family upgrade.
Recommended
Embedded Industrial Sensing and IoT Gateways
Systems that aggregate multiple sensors and report over wired networks fit this part well: UART, SPI, I2C, USB and CAN run concurrently, driven by Peripheral Pin Select (PPS) routing for flexible board layout. The PTG (Programmable Timing Generator) sequences ADC sampling and I/O events autonomously, keeping timing deterministic while the CPU handles protocol stacks. The 1KB data flash stores calibration and device-identity data without an external EEPROM. The 3.0V to 3.6V single-supply operation simplifies 3.3V power trees. Against a generic 32-bit MCU, this part wins where hard real-time control and analog integration matter; where heavy RTOS and graphics are needed, a Cortex-M class device is the better fit.
Recommended
High-Temperature (150C) Embedded Control
The -H suffix qualifies operation from -40C to +150C, placing this part among a limited set of commodity-price controllers usable in underhood electronics, down-hole tools, industrial ovens and aerospace ground equipment. At these temperatures, external electrolytic capacitors and discrete op-amps are reliability bottlenecks, so integrating the three op-amps, the 12-bit ADC and the PWM engine on-die meaningfully improves system mean time between failures. Design caution: flash write endurance and data retention derate near +150C, so minimize in-application flash and data-flash writes and consult the manufacturer datasheet derating tables; prefer external serial EEPROM rated for high temperature when frequent parameter logging is required.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128MU504-H/PT β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128MU504-E/PT | DSPIC33EP256MU504-I/PT | DSPIC33EP128MC504-I/PT |
|---|---|---|---|---|
| Package | 44-pin TQFP (PT) | 44-pin TQFP (PT) - same | 44-pin TQFP (PT) - same | 44-pin TQFP (PT) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33E 16-bit, 70 MIPS | dsPIC33E 16-bit, 70 MIPS | dsPIC33E 16-bit, 70 MIPS | dsPIC33E 16-bit, 70 MIPS |
| Flash | 128 KB | 128 KB | 256 KB | 128 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB |
| USB | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | USB 2.0 Full-Speed OTG | No USB |
| CAN 2.0B | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +150C (-H) | -40C to +125C | -40C to +85C | -40C to +85C |
Key Differentiators
- Extended +150C temperature rating (vs DSPIC33EP128MU504-E/PT)
- USB OTG plus CAN on one 44-pin chip (vs DSPIC33EP128MC504-I/PT)
- Migration headroom in the same footprint (vs DSPIC33EP256MU504-I/PT)
Design Notes
The dsPIC33EP128MU504-H/PT runs from a single 3.0V to 3.6V supply with an internal 1.8V core regulator on VDDCORE. Decouple VDD, VDDCORE and AVDD each with 0.1uF ceramic capacitors placed within 2 mm of the pins, plus one 4.7uF-10uF bulk capacitor per supply domain. Estimated: at 70 MIPS the core current is typically in the tens of mA range, so a 3.3V/100mA rail headroom is sufficient, but size the regulator for I/O transient current if driving LEDs or MOSFET drivers from GPIOs.
For USB full-speed compliance, the USB D+/D- pair must be routed as a 90-ohm matched-length differential pair with series resistors per the manufacturer datasheet reference design, and the 48 MHz USB clock derived from a crystal-driven PLL - do not substitute the internal FRC oscillator for USB applications. For CAN, place the transceiver within 2 cm of the CANx pins and keep the TXD/RXD traces short to limit ringing. Separate the analog ground region under AVDD/AVSS from PWM switch-node noise using a solid ground plane.
Three frequent mistakes with this family: (1) forgetting to enable the internal regulator configuration bit, causing brown-out at high MIPS; (2) attempting USB clocking from the internal FRC instead of a crystal with PLL, which fails USB enumeration jitter requirements; (3) ignoring Peripheral Pin Select (PPS) mapping - UART/SPI/I2C pins must be assigned in software at boot or the peripherals stay disconnected. Also note flash/data-flash write endurance derates near the +150C maximum, so minimize in-application writes in high-temperature designs.
The 44-pin TQFP (PT) dissipates little power in typical DSC operation, but at +150C ambient the junction margin is tight. Estimated: with typical core plus I/O dissipation under 250 mW and theta_JA on the order of 50 C/W for TQFP-44 on a standard 4-layer board, junction rise is roughly 12 C, leaving adequate margin at +150C ambient. Avoid routing high-current traces directly under the die and add thermal vias to ground plane if GPIO loads exceed datasheet sink/source recommendations.
Compliance Information
RoHS/REACH status not stated in the provided distributor snippets; verify on the Microchip product page before procurement. -H temperature grade applies to device qualification, not AEC-Q100 automotive certification.
