DSPIC33EP256MC504T-E/TL - 16-Bit 60MIPs DSC 256KB Flash | Microchip
MPN: DSPIC33EP256MC504T-E/TL ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP256MC504T-E/TL Overview
A digital signal controller combines the compute architecture of a microcontroller with the math acceleration of a DSP. In the power-management hierarchy, a DSC such as the dsPIC33EP sits between general-purpose MCUs and dedicated DSPs: it executes C code and real-time operating logic while simultaneously running control loops such as field-oriented motor control, digital power conversion, and digital filtering. The dsPIC33E family is Microchip's flagship 16-bit DSC platform for embedded control.
Key features include the 16-bit dsPIC core running at 60 MIPS (with family members reaching 70 MIPS per the product page), 256KB self-programmable FLASH with ECC-style error correction organization, 16KB on-chip SRAM, and integrated DSP engine instructions for multiply-accumulate operations. The automotive-grade E temperature designation supports -40C to +125C operation, and the part carries AEC-Q100 qualification per distributor listings, making it suitable for vehicular environments.
Technically, the dsPIC33EP architecture provides a modified Harvard bus with 24-bit instruction width, hardware divide, and DSP multiply-accumulate in a single cycle, enabling precision control loops at high sampling rates. On-chip peripherals for motor control (per Microchip product positioning: high-performance precision motor control systems) reduce external component count and loop latency.
Typical applications include brushless DC and PMSM motor drives, digital power supplies (PFC, LLC), automotive body and powertrain auxiliaries, and industrial sensing and control nodes that need DSP-class math in an MCU workflow.
Design consideration: the exposed pad of the 44-VTLA package is the primary thermal and ground path; connect it to a solid ground pour with multiple vias to meet thermal and signal-integrity targets.
This page synthesizes distributor inventory data, family cross-references, and engineering design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP256MC504T-E/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256MC504T-E/TL (same form factor and footprint) — differing in Package, Packaging, Series.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256MC504T-I/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.32 / Unit
View Datasheet →DSPIC33EP256MC504-E/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MC504-I/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MC504T-H/TL
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MC504T-E/TL Maximum Ratings & Electrical Characteristics
| Core | dsPIC 16-bit DSC core |
| Series | dsPIC 33EP |
| CPU Speed | 60 MIPS |
| Program Memory Size | 256KB (85.5K x 24) FLASH |
| RAM Size | 16KB |
| Supply Voltage | 3.3 V |
| Oscillator Frequency | 70 MHz |
| Number of Pins | 44 |
| Package | 44-VTLA (6x6 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| Temperature Grade | E (extended, -40C to +125C) |
| Qualification | Automotive, AEC-Q100 |
| Packaging | Tape & Reel (T) |
| Data Bus Width | 16 bit |
DSPIC33EP256MC504T-E/TL 44-vtla (6x6 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP256MC504T-E/TL (44-vtla (6x6 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256MC504T-E/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256MC504T-E/TL is suitable for 6 applications: Brushless DC / PMSM Motor Control, Digital Power Conversion (PFC / LLC), Automotive Body and Auxiliary Control, Industrial Sensing and Control Nodes, Power Factor and Solar Micro-Inverter Control, Embedded Audio and Signal Processing Front Ends.
Brushless DC / PMSM Motor Control
The DSPIC33EP256MC504T-E/TL fits precision motor control because its 60 MIPS 16-bit DSP core executes field-oriented control (FOC) loops at the 10-20 kHz rates required for smooth torque in BLDC and PMSM drives, while 256KB of FLASH (85.5K x 24) holds FOC algorithms, commutation tables, and communication stacks simultaneously. On-chip motor-control PWM peripherals generate complementary outputs with dead-time insertion directly in hardware, removing CPU jitter from the switching edges. A typical topology uses the DSC to read phase currents and bus voltage through its ADC, run Clarke/Park transforms with single-cycle multiply-accumulate instructions, and update PWM duty cycles every control period. The AEC-Q100 E grade extends this use into automotive pumps, fans, and actuators.
Recommended
Digital Power Conversion (PFC / LLC)
In switch-mode power conversion, the DSPIC33EP256MC504T-E/TL provides the control core for PFC stages, LLC resonant converters, and DC-DC bricks. Its 60 MIPS throughput sustains control loop updates well above the 50-100 kHz switching frequencies typical of these topologies, and the 16KB RAM buffers telemetry, fault logs, and compensation state without external memory. The 3.3V 16-bit architecture with hardware DSP instructions lets engineers implement proportional-integral compensators and nonlinear limiters cycle-by-cycle, while hardware PWM features (phase-shift, complementary pairs with dead time) map directly onto half-bridge and full-bridge power stages. The AEC-Q100 qualification additionally allows digital power designs destined for automotive onboard chargers and auxiliary converters.
Recommended
Automotive Body and Auxiliary Control
The AEC-Q100 qualification and E temperature grade (-40C to +125C) of the DSPIC33EP256MC504T-E/TL make it appropriate for automotive body electronics: window-lift and wiper motor drivers, HVAC blower control, solenoid actuators, and lighting modules. The 256KB FLASH accommodates OEM diagnostics (UDS-style service routines), parameter calibration tables, and multiple actuator state machines in one device, while the 44-pin 6x6 package conserves PCB area in compact modules mounted near the actuator. Peripherals for fault monitoring let the firmware detect stalled motors, overcurrent, and thermal overload and respond within one control cycle. Combined with a CAN transceiver, the part bridges actuator-level control to vehicle networks while running its own real-time control loops locally.
Recommended
Industrial Sensing and Control Nodes
Industrial nodes that combine sensing with actuation benefit from the DSPIC33EP256MC504T-E/TL's blend of DSP math and MCU peripherals. The DSP engine executes digital filtering (IIR/FIR) on ADC-sampled sensor channels - vibration, pressure, current - at 60 MIPS without floating-point coprocessors, while the remaining FLASH and RAM host protocol stacks and local decision logic. The extended E temperature grade tolerates cabinet environments reaching 125C, beyond standard industrial ratings, allowing placement near drives, heaters, or engines. Control outputs and communication ports are remappable through Peripheral Pin Select, so one firmware base serves multiple node variants across a product family, reducing qualification effort for industrial OEMs and panel builders.
Recommended
Power Factor and Solar Micro-Inverter Control
Renewable-energy converters such as solar micro-inverters and MPPT battery chargers use the DSPIC33EP256MC504T-E/TL for maximum-power-point tracking and grid-synchronized current shaping. The 60 MIPS core runs MPPT sampling and perturb-and-observe or incremental-conductance algorithms concurrently with the inverter current loop, and 256KB FLASH holds grid-code tables, anti-islanding logic, and communication firmware. Hardware PWM synchronization with the ADC ensures the control loop samples at consistent points in each switching cycle, reducing ripple-induced measurement error. The extended temperature grade supports rooftop and outdoor enclosure conditions, and the AEC-Q100 lineage provides the durability documentation that inverter OEMs require for long field lifetimes.
Recommended
Embedded Audio and Signal Processing Front Ends
The dsPIC DSP engine - single-cycle 40-bit multiply-accumulate with dual operand fetch - lets the DSPIC33EP256MC504T-E/TL implement audio filters, tone generation, and sensor signal conditioning in cost-sensitive products. With 60 MIPS available, FIR filters of practical length for active noise cancellation, hum removal, or powerline interference rejection run in real time on 16-bit fixed-point samples, while the 16KB RAM buffers sample blocks for FFT-based diagnostics. 256KB of FLASH stores coefficient sets for multiple product configurations. The 44-VTLA 6x6 package fits headsets, appliance panels, and handheld instruments, and the extended E grade allows operation in automotive cabin and outdoor acoustic applications where -40C to +125C exposure occurs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256MC504T-E/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256MC504T-I/TL | DSPIC33EP256MC504-E/TL | DSPIC33EP256MC504T-E/ML |
|---|---|---|---|---|
| Package | 44-VTLA (6x6) Exposed Pad | 44-VTLA (6x6) - same | 44-VTLA (6x6) - same | 44-QFN (8x8) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Program Memory | 256KB (85.5K x 24) FLASH | 256KB (85.5K x 24) FLASH | 256KB (85.5K x 24) FLASH | 256KB (85.5K x 24) FLASH |
| RAM | 16KB | 16KB | 16KB | 16KB |
| Temperature Range | -40C to +125C (E, automotive) | -40C to +85C (I, industrial) | -40C to +125C (E, automotive) | -40C to +125C (E, automotive) |
| AEC-Q100 Qualification | Qualified | Not qualified (industrial grade) | Qualified | Qualified |
| Drop-in on 6x6 VTLA Footprint | N/A (reference) | Yes - pin-to-pin | Yes - pin-to-pin | No - requires PCB relayout |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Automotive AEC-Q100 qualification in the compact 6x6 package (vs DSPIC33EP256MC504T-I/TL)
- Smaller 6x6 mm footprint saves PCB area (vs DSPIC33EP256MC504T-E/ML)
- Tape-and-reel format for automated assembly (vs DSPIC33EP256MC504-E/TL)
Design Notes
The exposed pad on the 44-VTLA (6x6) package is the main thermal and ground return path. Create a ground keep-out matching the pad dimensions with a 3x3 (or denser) via array on ~1.0-1.2 mm pitch stitching to the internal ground plane. Use a solder-paste stencil with ~50-70% pad coverage in segmented apertures to prevent voiding and solder beading under the QFN body. Poor exposed-pad soldering is the leading field failure cause for QFN DSCs, degrading both junction temperature and ADC ground reference integrity.
Decouple the 3.3V supply with one 10uF bulk ceramic plus one 0.1uF X7R within 2 mm of each VDD/VSS pair, per standard dsPIC33EP reference designs. Estimated: at 60 MIPS the core draws tens of milliamps; switching transients on the internal rail are fast, so trace inductance between capacitor and pin directly modulates the ADC reference. Place the VCAP core-regulator capacitor exactly as specified in the family datasheet pin diagrams - this internal regulator stabilizer must not be omitted or enlarged arbitrarily.
Because Peripheral Pin Select remaps digital functions, route motor-control PWM and high-current sensor traces first, then assign PPS mappings in firmware to match the optimal layout rather than forcing the layout to fit a hard-wired pinout. Keep ADC input traces short and away from PWM switching nodes; consider an RC anti-aliasing filter (e.g., 1k + 1nF, cutoff ~160 kHz) on current-sense inputs to preserve the accuracy of the FOC current loop.
Do not substitute the /ML (8x8 QFN) variant onto a /TL (6x6) footprint - the packages share pinout logic but not the land pattern. Verify temperature grade at BOM level: the /I industrial variant is not qualified for the +85C to +125C range where the /E automotive variant operates. For production, order the full suffixed MPN; ordering the bare base number DSPIC33EP256MC504 may return an unsuitable grade or package.
Compliance Information
Distributor listings (DigiKey, Microchip USA, Hotenda) identify the part as Automotive, AEC-Q100 qualified. RoHS/REACH/lead-free status was not stated in the provided verified data and must be confirmed from the Microchip product page.
