DSPIC33EP32GP502T-I/MM - 16-bit 70 MIPS DSC 32KB Flash | Microchip
MPN: DSPIC33EP32GP502T-I/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.31 | $2.31 |
| 10 | $2.3 | $23.00 |
| 500 | $2.29 | $1,145.00 |
| 1,000 | $2.26 | $2,260.00 |
| 2,500 | $2.19 | $5,475.00 |
DSPIC33EP32GP502T-I/MM Overview
A digital signal controller combines the control peripherals of a microcontroller with the computational throughput of a DSP core. Within the power-management hierarchy, a DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33EP family well suited to closed-loop control tasks that need fast multiply-accumulate operations plus rich analog and communication peripherals on a single chip.
Key features include the highest-speed 70 MIPS dsPIC33E core, superior ADC performance with 10-bit/12-bit conversion options, CAN 2.0B communication, a Charge Time Measurement Unit (CTMU), multiple high-speed PWM modules, DMA, and the Peripheral Trigger Generator (PTG) for autonomous, high-end general-purpose operation. The T suffix denotes tape-and-reel packaging for automated assembly.
Technically, the device uses a modified Harvard, 16-bit pipelined architecture with DSP engine instructions, supporting deterministic interrupt latency and single-cycle MAC operations. On-chip POR, brown-out detect/reset, and a watchdog timer increase system robustness, while low-power modes reduce standby consumption.
Typical applications include digital power supplies and PFC stages, motor control (BLDC/PMSM/ACIM), sensor signal conditioning, industrial automation, and general-purpose embedded control requiring CAN connectivity.
Design consideration: budget Flash carefully - 32KB is generous for control loops but fills quickly with RTOS stacks and rich communication stacks.
This page synthesizes distributor pricing, drop-in alternatives, pinout data, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP32GP502T-I/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP32GP502T-I/MM (same form factor and footprint) — differing in Operating Temperature, Package, Mounting Type, Packaging, ADC Resolution.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32GP502T-E/MM
✅ Drop-In✓ In Stock
$2.98 / Unit
View Datasheet →DSPIC33EP32GP502T-H/MM
✅ Drop-In📋 Reference alternative (not in catalog)
dsPIC33EP64GP502-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
dsPIC33EP16GP502-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
dsPIC33EP32MC502-I/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GP502T-I/MM Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E, 16-bit |
| Core Speed | 70 MIPS |
| Program Memory Size | 32 KB (10.7K x 24) Flash |
| RAM Size | 4 KB |
| Supply Voltage | 3.3 V |
| Package | 28-QFN-S (6x6 mm) Exposed Pad |
| Operating Temperature | -40C to +85C (I grade) |
| ADC Resolution | 10-bit / 12-bit |
| Peripherals | CAN, CTMU, PWM, DMA, PTG |
| Communication Interfaces | CAN 2.0B, UART, SPI, I2C |
| Timers | 5 timers |
| DMA Channels | 4 |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Reset Sources | POR, BOR, WDT, MCLR |
DSPIC33EP32GP502T-I/MM Pin Configuration
| Pin 1 | MCLR — Master clear reset / ICSP programming input |
| Pin 2 | AN0/VREF+/RA0 — Analog input 0 / ADC positive reference / port A bit 0 |
| Pin 3 | AN1/VREF-/RA1 — Analog input 1 / ADC negative reference / port A bit 1 |
| Pin 4 | AN2/PGD/RP0/RB0 — Analog input 2 / ICSP data / remappable pin RP0 / port B bit 0 |
| Pin 5 | AN3/PGC/RP1/RB1 — Analog input 3 / ICSP clock / remappable pin RP1 / port B bit 1 |
| Pin 6 | AN4/RP2/RB2 — Analog input 4 / remappable pin RP2 / port B bit 2 |
| Pin 7 | AN5/RP3/RB3 — Analog input 5 / remappable pin RP3 / port B bit 3 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | OSC1/CLKI/RA2 — Oscillator crystal input / external clock input |
| Pin 10 | OSC2/CLKO/RC15 — Oscillator crystal output / clock output |
| Pin 11 | VDD — Positive supply, 3.3V |
| Pin 12 | RP15/SDO1/RF8 — Remappable pin RP15 / SPI1 data out / port F bit 8 |
| Pin 13 | RP14/SOSCI/RF4 — Remappable pin RP14 / secondary oscillator input / port F bit 4 |
| Pin 14 | RP13/SOSCO/T1CK/RF5 — Remappable pin RP13 / secondary oscillator output / Timer1 clock / port F bit 5 |
| Pin 15 | VCAP/VDDCORE — Core voltage regulator capacitor connection (external capacitor required) |
| Pin 16 | RP12/RF3 — Remappable pin RP12 / port F bit 3 |
| Pin 17 | RP11/RF2 — Remappable pin RP11 / port F bit 2 |
| Pin 18 | RP10/RF1 — Remappable pin RP10 / port F bit 1 |
| Pin 19 | RP9/RF0 — Remappable pin RP9 / port F bit 0 |
| Pin 20 | RP29/RB15 — Remappable pin RP29 / port B bit 15 |
| Pin 21 | RP28/RB14 — Remappable pin RP28 / port B bit 14 |
| Pin 22 | RP27/RB13 — Remappable pin RP27 / port B bit 13 |
| Pin 23 | RP26/RB12 — Remappable pin RP26 / port B bit 12 |
| Pin 24 | RP25/RB11 — Remappable pin RP25 / port B bit 11 |
| Pin 25 | RP24/RB10 — Remappable pin RP24 / port B bit 10 |
| Pin 26 | RP23/RB9 — Remappable pin RP23 / port B bit 9 |
| Pin 27 | VDD — Positive supply, 3.3V (QFN additional power pin) |
| Pin 28 | VSS — Ground (QFN additional ground pin) |
Typical Applications
DSPIC33EP32GP502T-I/MM is suitable for 6 applications: Digital Power Supplies, Brushless Motor Control, Industrial Automation Nodes, Sensor Signal Conditioning, Embedded Lighting Control, Portable Instrumentation.
Digital Power Supplies
The DSPIC33EP32GP502T-I/MM fits digital power conversion because its 70 MIPS DSP core executes voltage- and current-loop compensation fast enough for switching frequencies in the hundreds of kHz, and the high-speed PWM modules provide fine duty-cycle resolution with dead-time control. The 10/12-bit ADC with DMA captures feedback samples without CPU overhead, keeping loop jitter low. A typical topology places the DSC as the supervisory and modulating controller between the feedback dividers and the gate drivers. Unlike fixed-function controllers, firmware enables soft-start, burst mode, and fault management in one chip. Trade-off: at large control bandwidths, budget CPU cycles carefully since 32KB Flash and 4KB RAM limit complex compensators.
Recommended
Brushless Motor Control
For BLDC and PMSM drives, the DSPIC33EP32GP502T-I/MM provides single-cycle MAC instructions for field-oriented control, multiple high-speed PWM outputs with complementary modes for three-phase bridges, and fast ADC conversions synchronized to the PWM period. The 70 MIPS core completes current-loop computations within one PWM cycle, which is essential for stable torque control at high electrical speeds. The CAN 2.0B interface allows the drive to connect into industrial networks. Microchip supplies motor-control libraries and reference designs targeting this exact family. Design consideration: 28 pins limit available commutation feedback channels, so plan pin multiplexing between encoder inputs, ADC sampling, and communication interfaces early in the layout.
Recommended
Industrial Automation Nodes
In factory automation, the DSPIC33EP32GP502T-I/MM serves as a sensor and actuator node combining CAN 2.0B fieldbus connectivity, five timers for scheduling, and the CTMU for capacitive or time-domain sensor measurement. The industrial -40C to +85C rating suits control-cabinet environments, and the PTG (Peripheral Trigger Generator) automates ADC sampling and trigger sequences without CPU intervention, freeing cycles for protocol handling. Typical roles include valve controllers, sensor transmitters, and sub-controllers under a PLC. Because the 32KB Flash accommodates CAN stacks plus application logic, firmware remains in a single-chip solution without external memory. Brown-out reset and watchdog peripherals improve uptime in electrically noisy industrial settings.
Recommended
Sensor Signal Conditioning
The 12-bit ADC, on-chip comparators, and CTMU make the DSPIC33EP32GP502T-I/MM effective for conditioning resistive, capacitive, and voltage-output sensors. The CTMU measures charge time for capacitive and diode-based sensing (temperature, humidity, touch), while the ADC with DMA streams multi-channel samples for digital filtering on the DSP core. The 70 MIPS core applies FIR/IIR compensation and linearization in firmware, replacing external analog trim. The QFN 6x6 package fits compact probe and transmitter PCBs. One design consideration: the -I grade covers -40C to +85C, so for sensing circuits where self-heating affects accuracy, verify junction rise with the exposed pad properly soldered to a ground plane for heat spreading.
Recommended
Embedded Lighting Control
For LED drivers and lighting ballasts, the DSPIC33EP32GP502T-I/MM offers high-frequency PWM with fine resolution for dimming and color control, plus ADC feedback for current regulation and fault detection. The 70 MIPS core implements constant-current loops and DALI-style communication stacks over UART, while CAN connects fixtures into building management networks. The 28-QFN 6x6 package supports compact driver boards integrated into luminaires. Firmware-only dimming curves, thermal foldback, and emergency-mode logic replace external analog circuitry, reducing BOM count. Designers should synchronize ADC sampling to PWM edges to avoid sampling during switching noise, using the PTG for autonomous triggering. The exposed-pad package must be well grounded to suppress EMI from the switching stage.
Recommended
Portable Instrumentation
Handheld and battery-powered instruments benefit from the DSPIC33EP32GP502T-I/MM's combination of 3.3V single-supply operation, low-power idle and sleep modes, and integrated analog. The 70 MIPS core crunches measurement math quickly, allowing the CPU to spend more time in sleep, extending battery life. UART and SPI interfaces connect to displays, memory cards, and PC links, while the CTMU supports touch controls without external capacitive-sensing ICs. The 6x6 mm QFN and -40C to +85C rating suit rugged field instruments. Watch the 32KB Flash budget when adding communication stacks plus UI code. The T tape-and-reel packaging suits medium-volume production of instrument boards via automated assembly.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32GP502T-I/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GP502T-E/MM | DSPIC33EP32GP502T-H/MM | dsPIC33EP64GP502-I/MM | dsPIC33EP16GP502-I/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6) | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 32 KB (10.7K x 24) | 32 KB | 32 KB | 64 KB | 16 KB |
| Temperature Range | -40C to +85C | -40C to +125C | -40C to +125C (automotive) | -40C to +85C | -40C to +85C |
| AEC-Q100 Qualified | No | No | Yes | No | No |
Key Differentiators
- Extended temperature availability within the same footprint (vs DSPIC33EP32GP502T-E/MM)
- Automotive AEC-Q100 qualified option (vs DSPIC33EP32GP502T-H/MM)
- Balanced Flash/cost point in the family (vs dsPIC33EP64GP502-I/MM)
Design Notes
Connect VCAP (pin 15) to a low-ESR ceramic capacitor (per the dsPIC33EP family datasheet, typically 10 uF) to ground; this stabilizes the on-chip 1.8V core regulator. Do not load this pin externally. Place both VDD pins (11, 27) and the exposed pad on a solid 3.3V plane with 100 nF decoupling capacitors at each VDD/VSS pair, placed within 2 mm of the pins. Estimated: a 100 nF capacitor with 5 nH trace inductance resonates near 225 MHz, adequate for core switching noise.
The exposed pad on the 28-QFN 6x6 package must be soldered to a grounded copper pour with an array of thermal vias. It serves both as the main ground return and as the primary heat-spreading path. Un-soldered exposed pads cause intermittent ground faults and elevated junction temperatures, the two most common field failures on this package. Use a solder-mask-defined aperture per Microchip QFN layout guidelines and verify with X-ray or cross-section on first articles.
Pins 1 (MCLR), 4 (PGD/RB0), and 5 (PGC/RB1) are the ICSP programming pins. If these are used for application I/O, insert series isolation resistors (470 ohm - 1 kohm) so programmers can drive the lines during flashing. Also keep MCLR pulled up via a 10 kohm resistor to VDD for clean power-on reset. Ignoring this makes production reprogramming impossible without rework.
When driving PWM into long cables or gate drivers, keep the fast PWM edges away from AN0-AN5 analog traces. Route the analog ground under the ADC inputs as a quiet island tied to the exposed pad at a single point. Estimated: with 12-bit ADC and a 3.3V reference, 1 LSB equals about 0.8 mV, so switching noise exceeding ~0.4 mV at the sample instant degrades effective resolution.
Compliance Information
The -H/MM variant is documented as automotive AEC-Q100; the standard -I/MM is the industrial-grade commercial part. RoHS/REACH status not stated in provided data - confirm on Microchip product page.
