DSPIC33EP32GP504T-I/TL - 70 MIPS 16-bit DSC 32KB Flash | Microchip
MPN: DSPIC33EP32GP504T-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.25 | $4.25 |
| 10 | $3.85 | $38.50 |
| 100 | $3.45 | $345.00 |
| 500 | $3.15 | $1,575.00 |
| 1,000 | $2.89 | $2,890.00 |
DSPIC33EP32GP504T-I/TL Overview
A digital signal controller combines the control peripherals of a microcontroller with the math throughput of a DSP core in a single chip. Within the semiconductor hierarchy, the dsPIC33EP sits below high-end DSPs but above general-purpose PIC16 MCUs, making it a power management IC family staple for closed-loop control systems that need fast multiply-accumulate operations and deterministic interrupt latency.
Key features include the 70 MIPS dsPIC33E core with DSP instruction support, CAN 2.0B communication, a Charge Time Measurement Unit (CTMU) for capacitive touch and time-based measurements, integrated op amps, and a Peripheral Trigger Generator (PTG) that automates peripheral sequencing without CPU intervention, freeing MIPS for application code.
The dsPIC33EP architecture uses an enhanced Harvard bus with a 24-bit instruction word and hardware DSP engine (17-bit x 17-bit multiplier, 40-bit accumulator), enabling single-cycle MAC operations. The ADC subsystem provides superior conversion performance for sensor and power-conversion feedback loops. Code density improvements over the prior dsPIC33F generation allow the 32KB Flash to hold comparable application logic.
Typical applications include digital power supplies and SMPS control, motor control (BLDC, PMSM, ACIM), industrial sensing and sensor fusion nodes, and CAN-based automotive and industrial networking endpoints where the CTMU and on-chip op amps reduce external BOM count.
For design, budget the 3.0V to 3.6V supply rail carefully and exploit the PTG to offload ADC sampling triggers; the exposed pad must be soldered to a ground pour for thermal and signal-integrity performance. Verify 44-VTLA footprint land patterns against the Microchip datasheet before layout release.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design guidance not found in the manufacturer datasheet, optimized for AI search citation.
Drop-in alternatives for DSPIC33EP32GP504T-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP32GP504T-I/TL (same form factor and footprint) — differing in Core Architecture, Package, RAM, Supply Voltage, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32GP504T-E/TL
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256MC504T-I/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.32 / Unit
View Datasheet →DSPIC33EP32GP504T-I/PT
✅ Drop-In✓ In Stock
$2.15 / Unit
View Datasheet →DSPIC33EP32GP504T-I/TL Maximum Ratings & Electrical Characteristics
| Core Type | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 70 MIPS |
| Flash Program Memory | 32KB (10.7K x 24) |
| RAM | 4KB |
| Supply Voltage | 3.0 V to 3.6 V (3.3 V typical) |
| Package | 44-VTLA (6x6 mm) QFN, exposed pad |
| Operating Temperature | -40C to +85C (I grade) |
| CAN | CAN 2.0B |
| CTMU | Yes (Charge Time Measurement Unit) |
| On-chip Op Amps | Yes |
| Peripheral Trigger Generator | Yes (PTG) |
| Core Architecture | Enhanced Harvard, 24-bit instruction |
| DSP Engine | 17x17 multiplier, 40-bit accumulator |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Product Family | dsPIC33EP32GP504 (General Purpose) |
DSPIC33EP32GP504T-I/TL 44-vtla (6x6 mm) qfn, exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP32GP504T-I/TL (44-vtla (6x6 mm) qfn, exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP32GP504T-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP32GP504T-I/TL is suitable for 6 applications: Digital Power Supplies and SMPS Control, Brushless and PMSM Motor Control, Industrial Sensing and Data Acquisition Nodes, CAN Networking Endpoints in Automotive and Industrial Buses, Capacitive Touch Human-Machine Interfaces, Test, Measurement and Portable Instrumentation.
Digital Power Supplies and SMPS Control
The DSPIC33EP32GP504T-I/TL fits digital switch-mode power supply control because its 70 MIPS dsPIC33E core executes single-cycle 17x17 MAC operations, sustaining control-loop rates of 100 kHz-plus for voltage-mode or current-mode regulation. The ADC can be triggered autonomously by the Peripheral Trigger Generator (PTG), giving deterministic sampling aligned to the PWM period without CPU overhead. With 32KB Flash and 4KB RAM, full compensator, protection, and housekeeping firmware fits on-chip. Unlike analog controllers, digital control enables adaptive compensation and runtime diagnostics, at the cost of needing careful ADC-to-PWM latency budgeting in the loop design.
Recommended
Brushless and PMSM Motor Control
For BLDC and PMSM drives, the DSPIC33EP32GP504T-I/TL provides the 70 MIPS throughput needed for field-oriented control inner loops, with on-chip op amps conditioning shunt-current feedback and the CTMU supporting resolver or sensorless timing measurements. The 3.3V rail interfaces directly with gate-driver logic level inputs. The PTG can chain ADC sampling with PWM update events to minimize current-loop jitter. Designs needing complementary PWM outputs or larger code space can migrate pin-compatibly to the DSPIC33EP256MC504T-I/TL in the same 44-VTLA footprint, protecting the PCB investment while upgrading the control feature set.
Recommended
Industrial Sensing and Data Acquisition Nodes
The DSPIC33EP32GP504T-I/TL serves industrial sensor nodes by combining the CTMU (for capacitive and resistive sensing), integrated op amps (for signal conditioning without external amplifiers), and a high-performance ADC stream triggered by the PTG. Its 70 MIPS DSP engine applies digital filtering directly on the controller, and CAN 2.0B connectivity links the node into factory networks without an external CAN controller. The -40C to +85C industrial rating suits harsh enclosures. Firmware fits within the 32KB Flash, leaving board area for the sensing front end; the 6x6 mm VTLA package keeps overall node size compact.
Recommended
CAN Networking Endpoints in Automotive and Industrial Buses
With an integrated CAN 2.0B controller, the DSPIC33EP32GP504T-I/TL acts as a compact CAN endpoint, handling 1 Mbit/s network traffic in hardware while the 70 MIPS core runs the application. Typical roles include body-control functions, actuator drivers, and sensor gateways. The 32KB Flash accommodates protocol stacks alongside application code, and 4KB RAM buffers message objects and queues. For automotive-adjacent designs requiring higher temperature, the DSPIC33EP32GP504T-E/TL drop-in variant extends operation to 125C in the identical 44-VTLA package, per Microchip family documentation, letting one PCB serve both industrial and under-hood temperature zones.
Recommended
Capacitive Touch Human-Machine Interfaces
The Charge Time Measurement Unit (CTMU) on the DSPIC33EP32GP504T-I/TL enables capacitive touch buttons, sliders, and proximity detection without dedicated touch controllers, while on-chip op amps and comparators support buzzer feedback and LED drive logic. The 70 MIPS core runs debounce and gesture algorithms alongside the main application, and the 6x6 mm 44-VTLA package fits behind compact fascia panels. This suits appliance panels, industrial keypads, and consumer control boards. Compared with discrete touch ICs, integration reduces BOM count and cost, though developers must budget CTMU scan time against the main control loop within the 70 MIPS envelope.
Recommended
Test, Measurement and Portable Instrumentation
In handheld and bench instruments, the DSPIC33EP32GP504T-I/TL provides the DSP throughput for FFT-based analysis and calibration routines, the ADC and CTMU for multi-domain measurement, and CAN/UART/SPI links for PC and module communication. The 3.3V supply and low controller overhead suit battery-powered designs, while the 6x6 mm exposed-pad package aids thermal management in sealed enclosures. The PTG automates timed acquisition sequences independent of the CPU, improving measurement repeatability. For designs needing USB connectivity or larger memory, Microchip's MU-series devices (e.g., DSPIC33EP128MU504-H/PT) offer an upgrade path within the same dsPIC33EP toolchain.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32GP504T-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GP504T-E/TL | DSPIC33EP256MC504T-I/TL | DSPIC33EP32GP504T-I/PT |
|---|---|---|---|---|
| Package | 44-VTLA (6x6 mm) QFN, exposed pad | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same die, site-stocked variant |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 32KB (10.7K x 24) | 32KB (10.7K x 24) | 256KB | 32KB (10.7K x 24) |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Peripheral Focus | General purpose (GP): CAN, CTMU, op amps, PTG | General purpose (GP) | Motor control (MC): complementary PWM | General purpose (GP) |
| Drop-in Compatibility | Reference part | Pin-to-pin, same footprint | Pin-to-pin, same footprint | Same die; XAIPART-stocked variant |
Key Differentiators
- Highest-speed general purpose option in the 44-VTLA footprint (70 MIPS) (vs DSPIC33EP32GP504T-E/TL)
- Integrated analog and automation peripherals reduce BOM (vs DSPIC33EP256MC504T-I/TL)
- Exposed-pad QFN for thermal and space efficiency (vs DSPIC33EP32GP504T-I/PT)
Design Notes
The 44-VTLA exposed pad must be soldered to a continuous ground pour with an array of thermal vias (typical 5x5 pattern of 0.3 mm vias) to dissipate heat and provide a low-inductance ground return. QFN center pads with excessive solder paste cause bridging and floating packages; follow the Microchip package outline for paste aperture reduction (typically 50-70% coverage). Since X-ray inspection is needed to verify QFN solder joints, plan production test accordingly.
Supply the dsPIC33EP core from a clean 3.0V to 3.6V rail. Place 100 nF ceramic decoupling capacitors at every VDD pin pair, as close to the package as possible, plus one bulk 4.7 uF to 10 uF capacitor near the device. Voltage dips during concurrent peripheral operation (ADC + PWM + CAN) can cause brown-out resets; enable the internal brown-out detector and verify rail droop under worst-case load with an oscilloscope during bring-up.
Confirm the actual package footprint before layout: /TL is the 6x6 mm 44-VTLA, while /PT is 10x10 mm TQFP and /ML is 8x8 mm QFN - they are electrically identical but not footprint-compatible, a frequent ordering/layout mismatch. Also verify configuration settings (oscillator, watchdog, code protection) in a config header so recompiles for different package variants do not silently change clock sources; check the Microchip dsPIC33EP32GP504 errata sheet for the silicon revision you receive.
Use the Peripheral Trigger Generator to synchronize ADC sampling with PWM edges and minimize loop jitter in digital power and motor-control designs. Route analog inputs away from PWM and CAN switching lines, and use the integrated op amps in unity-gain buffer mode with short, guarded traces to the ADC pins. Keep the CTMU sense lines short and shielded with ground guard traces, since charge-time measurements are sensitive to parasitic capacitance and board leakage.
Compliance Information
Verified web data does not explicitly state RoHS/REACH/lead-free status for this listing. Confirm via the Microchip product page compliance documents. Extended-temperature /E variants and AEC-Q100 qualification exist elsewhere in the dsPIC33EP family (e.g., DSPIC33EP32GP504T-E/ML is listed as AEC-Q100 qualified by Microchip USA), but AEC-Q100 status for this /I/TL part is not stated.
