DSPIC33EV32GM106-I/MR - 16-Bit 70MIPS 5V DSC, 32KB Flash | Microchip
MPN: DSPIC33EV32GM106-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.64 | $4.64 |
| 10 | $4.29 | $42.90 |
| 100 | $3.99 | $399.00 |
| 500 | $3.72 | $1,860.00 |
| 1,000 | $3.49 | $3,490.00 |
DSPIC33EV32GM106-I/MR Overview
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control flexibility of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC such as this sits at the heart of real-time control loops - digital signal controller to microcontroller to embedded processor - and the dsPIC33EV family extends this lineage with a robust 5V core targeting harsh electrical environments where 3.3V controllers need external level shifting or transceivers.
Key features include the 5V-tolerant 4.5V to 5.5V operating range, an integrated CAN bus module for automotive and industrial networking, SENT (SAE J2716) support for sensor interfaces, on-chip op amps that reduce external BOM cost, and advanced PWM peripherals purpose-built for motor control and power conversion. Seven timers and four DMA channels offload deterministic tasks from the CPU core.
Architecturally, the dsPIC33EV core executes an enhanced 16-bit modified Harvard instruction set with DSP multiply-accumulate instructions, reaching 70 MIPS from an internal PLL. The functional-safety variant documentation supports designs targeting safety-critical appliances, industrial, and automotive platforms.
Typical applications include brushless DC and PMSM motor drives, automotive body and powertrain modules using CAN/SENT, and switched-mode power supplies or digital power stages where the 5V rail directly drives gate drivers.
When designing with this part, budget Flash carefully - 32KB (11K x 24 instruction words) suits fixed-function control but not feature-rich stacks; the same footprint is offered in 64KB, 128KB, and 256KB Flash versions for drop-in memory upgrades.
This page synthesizes verified distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EV32GM106-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV32GM106-I/MR (same form factor and footprint) — differing in Package, RAM, Flash Memory, Operating Temperature, CTMU.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV256GM106-I/MR
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EV64GM106-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EV128GM106-I/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.3 / Unit
View Datasheet →DSPIC33EV32GM106-H/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV256GM106-E/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV32GM104-I/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV32GM106-I/MR Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC33EV 16-bit DSC |
| Core Size | 16-bit |
| Maximum Speed | 70 MIPS |
| Flash Memory | 32KB (11K x 24) |
| RAM | 4KB |
| Operating Voltage | 4.5 V to 5.5 V |
| Package | 64-VQFN (9x9 mm), exposed pad (MR) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Peripherals | CAN, SENT, Op Amps, Advanced PWM, DMA |
| DMA Channels | 4 |
| Timers | 7 |
| Connectivity | CANbus, I2C, SPI, UART/USART |
| Series | dsPIC33EV, Functional Safety (FuSa) |
| Product Status | Active |
| Packaging | Tube |
DSPIC33EV32GM106-I/MR 64-vqfn (9x9 mm), exposed pad (mr) Pin Configuration Guide
Pin configuration for DSPIC33EV32GM106-I/MR (64-vqfn (9x9 mm), exposed pad (mr) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV32GM106-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV32GM106-I/MR is suitable for 6 applications: BLDC/PMSM Motor Drives, Automotive Body and Powertrain Nodes, Digital Power Supplies and Converters, Industrial Appliances and Harsh-Environment Control, Sensor Interfaces and SENT Data Acquisition, Functional Safety (FuSa) Development Platforms.
BLDC/PMSM Motor Drives
The DSPIC33EV32GM106-I/MR is purpose-built for motor control: its 70 MIPS DSP core executes field-oriented control (FOC) loops while advanced PWM peripherals generate complementary outputs with hardware dead-time insertion and fault shutdown. On-chip op amps amplify current-shunt signals before the internal ADC, removing external amplifiers from the BOM. In a typical 5V drive, the DSC sits between gate drivers and the current-sense network; the native 5V I/O drives gate-driver inputs directly with superior noise margin compared to 3.3V controllers. Firmware for this part ports directly from Microchip's motor-control reference designs on the dsPIC33EV256GM106 (MA330036 PIM), since the 106 pinout and peripherals are shared.
Recommended
Automotive Body and Powertrain Nodes
Automotive modules benefit from this device's integrated CAN controller, SENT (SAE J2716) peripheral, and 5V-tolerant I/O that connects directly to 12V-qualified transceivers and sensor conditioning circuits. The Functional Safety (FuSa) documentation package supports development under automotive safety processes, and the 4.5V-5.5V operation tolerates automotive 5V rail droop during crank. Typical nodes include wiper/actuator control, sensor aggregation, and pump control. The on-chip op amps condition resistive or Hall sensor outputs locally, cutting component count on dense PCBs. For crank-immune or under-hood locations, consider the -E (extended -40C to +125C) grade variants within the same 64-VQFN footprint as drop-in thermal upgrades.
Recommended
Digital Power Supplies and Converters
In switched-mode power supplies, PFC stages, and DC-DC converters, this DSC closes digital control loops at the switching frequency using its 70 MIPS core and high-resolution PWM. The 5V native operation is a significant advantage: PWM outputs can drive many gate-driver ICs directly without level translation, improving edge timing and noise immunity. On-chip op amps amplify shunt-based current feedback into the ADC for peak-current-mode control, and the 4 DMA channels stream ADC results without CPU intervention for fast fault response. The 32KB Flash accommodates single-topology control firmware with margins for housekeeping and communication, making it a cost-optimal digital-power controller.
Recommended
Industrial Appliances and Harsh-Environment Control
Microchip explicitly targets appliances and harsh industrial environments with the dsPIC33EV family: the 5V core provides wide noise margins on electrically noisy appliance boards where compressors, heaters, and switching loads generate transients. The 70 MIPS core handles simultaneous user interface scanning and closed-loop control; CAN connectivity links to higher-level controllers, and the 7 timers plus 4 DMA channels manage multiple PWM actuators deterministically. In washing machines, dishwashers, and HVAC blowers, one DSPIC33EV32GM106-I/MR often replaces a discrete MCU plus external op-amp and level-shifting circuitry, reducing board area and component count while improving ESD and EMI robustness.
Recommended
Sensor Interfaces and SENT Data Acquisition
The SENT (SAE J2716) peripheral makes this DSC an efficient host for modern automotive and industrial smart sensors that transmit nibble-encoded data on a single wire. Paired with the on-chip op amps for ratiometric sensor excitation and the 5V rail that directly powers bridge and Hall sensors, the DSPIC33EV32GM106-I/MR forms a complete acquisition front-end with minimal external circuitry. Data received via SENT can be re-transmitted on CAN for gateway applications, all within one chip. The 70 MIPS core applies filtering and linearization in firmware, and the 32KB Flash is typically sufficient for multiple sensor profiles, calibration tables, and diagnostic code in compact acquisition nodes.
Recommended
Functional Safety (FuSa) Development Platforms
This device belongs to Microchip's dsPIC33EV Functional Safety (FuSa) series, which provides safety documentation packages supporting development under industrial functional-safety processes for appliances, drives, and automotive sub-systems. The 70 MIPS 5V core, hardware PWM fault inputs, watchdog, and CAN diagnostics give designers the building blocks for self-test and fail-safe architectures in a single 64-VQFN device. Teams can prototype safety concepts on the higher-memory DSPIC33EV256GM106 family and port to the 32KB part for production cost reduction, since the peripheral map is identical. Using a family with vendor-supplied safety collateral significantly shortens the assessment phase compared to assembling evidence for a generic MCU.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV32GM106-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV256GM106-I/MR | DSPIC33EV64GM106-I/MR | DSPIC33EV32GM106-H/MR | DSPIC33EV256GM106-E/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) MR, exposed pad | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same | 64-VQFN/PQCC-N64 MR - same | 64-VQFN (9x9 mm) MR - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 32KB (11K x 24) | 256KB (85.5K x 24) | 64KB (22K x 24) | 32KB (11K x 24) | 256KB (85.5K x 24) |
| Operating Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Connectivity Peripherals | CAN, SENT, I2C, SPI, UART, Op Amps, PWM | CAN, SENT, I2C, SPI, UART, Op Amps, PWM | CAN, SENT, I2C, SPI, UART, Op Amps, PWM | CAN, SENT, I2C, SPI, UART, Op Amps, PWM | CAN, SENT, I2C, SPI, UART, Op Amps, PWM |
| Lifecycle Status | Active | Active | Active | Active | Active |
Key Differentiators
- Native 5V I/O eliminates level-shifting (vs DSPIC33FJ64MC706A-E/PT)
- Lowest-cost entry to the 106-pinout family (vs DSPIC33EV256GM106-I/MR)
- Functional Safety (FuSa) platform support (vs DSPIC33FJ64MC710A-E/PT)
Design Notes
Provide a clean 5V rail within the 4.5V-5.5V window. Decouple each VDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus one 10uF bulk capacitor near the VQFN. When switching loads (gate drivers, relays) share the 5V rail, add a ferrite bead or LC filter between the noisy rail and the DSC supply. Estimated: a 70 MIPS dsPIC33EV core typically draws tens of mA - verify exact ICC from the manufacturer datasheet Electrical Characteristics section for your thermal budget rather than assuming.
The exposed pad on the 64-VQFN (9x9) is the primary ground and thermal path - solder it to a grounded copper pour with an array of thermal vias; do not leave it floating. Route the CAN bus through its dedicated transceiver with a common-mode choke near the connector, and keep the crystal or internal-oscillator analog supply pin filtered with an RC network per Microchip's layout guidelines in the family datasheet. Keep PWM output traces short and away from analog op-amp inputs to prevent switching coupling into the ADC front-end.
Do not assume pin-function parity across dsPIC33EV variants: the GM104/GM102 members multiplex fewer peripherals onto the 106 pinout, so verify the peripheral-pin-select (PPS) mapping for your exact MPN in the datasheet pinout tables before routing. The 32KB Flash fills quickly once a CAN stack and bootloader are added - prototype on a 256KB sibling and reserve at least 20% Flash headroom. Finally, confirm the correct temperature suffix (-I vs -E vs -H) on incoming reels; they are electrically identical but not interchangeable in thermally stressed enclosures.
Compliance Information
Lead-free inference from standard Microchip -I suffix commercial packaging; RoHS/REACH/AEC-Q100 status for this exact MPN not stated in the provided web data - verify on the Microchip product page or Quality documentation before compliance-critical use.
