DSPIC33EV128GM104-I/ML - 16-Bit 70 MIPS 5V DSC | Microchip
MPN: DSPIC33EV128GM104-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.08 | $4.08 |
| 10 | $3.88 | $38.80 |
| 100 | $3.5 | $350.00 |
| 500 | $3.2 | $1,600.00 |
| 1,000 | $2.95 | $2,950.00 |
DSPIC33EV128GM104-I/ML Overview
A digital signal controller combines the computational strengths of a microcontroller with the mathematical acceleration of a digital signal processor. In the power-management hierarchy, the dsPIC33EV sits between general-purpose MCUs and dedicated DSPs: it executes real-time control loops (PID, field-oriented control, digital power conversion) while also running application logic on a single chip. The dsPIC33EV family is specifically engineered as a 5V-robust DSC with CAN, safety and motor-control peripherals for harsh electrical environments.
Key features include the 16-bit 70 MIPS DSP engine with DSP instruction support, single-cycle MAC and barrel shifter, error-correcting code (ECC) Flash for functional-safety designs, an on-chip CAN 2.0B module for automotive and industrial networking, and operation directly from a 5V supply that eliminates level-shifting circuitry common with 3.3V controllers. Per the Microchip product page, the family is ideal for appliances, industrial and automotive applications exposed to noise and vibration.
Architecturally, the device uses a modified Harvard architecture with multiple internal buses, a 40 MHz internal core clock yielding 70 MIPS at 5V operation, and hardware DSP support including divide, multiply-accumulate, and barrel-shift instructions. The ECC Flash protects program memory integrity, supporting functional safety (FuSa) design goals noted by distributors.
Typical applications include Brushed/BLDC and PMSM motor control, automotive body and sensor modules, CAN-networked industrial control nodes, digital power supplies, and appliance control boards.
Design consideration: connect every VDD/VSS pair and the exposed thermal pad to ground for best noise performance and thermal dissipation; multiple PGECx/PGEDx pairs exist for ICSP programming and must be used as matched pairs.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EV128GM104-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV128GM104-I/ML (same form factor and footprint) — differing in Package, Operating Temperature, Packaging, Core, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV256GM104-I/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV64GM104-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.11 / Unit
View Datasheet →DSPIC33EV128GM104-E/ML
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EV128GM104-H/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV128GM104-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV128GM104-I/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| CPU Speed | 70 MIPS |
| Program Memory Size | 128 KB (43K x 24) Flash |
| Program Memory Type | Flash with ECC |
| RAM Size | 8 KB |
| Supply Voltage | 5 V |
| CAN | Yes (CAN 2.0B) |
| Package | 44-QFN (8x8 mm), Exposed Pad |
| Operating Temperature | -40C to +85C (I grade) |
| Mounting Type | Surface Mount |
| Functional Safety | FuSa supported (per DigiKey listing) |
| Data Bus Width | 16 bit |
| Core Clock Frequency | 40 MHz |
| Series | dsPIC33EV128GMx |
| Packaging | Tray |
DSPIC33EV128GM104-I/ML 44-qfn (8x8 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EV128GM104-I/ML (44-qfn (8x8 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV128GM104-I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV128GM104-I/ML is suitable for 6 applications: BLDC / PMSM Motor Control, Automotive Body and Sensor Modules, Industrial CAN Network Nodes, Digital Power Supplies, Appliance Control Boards, Test, Measurement and Data Acquisition.
BLDC / PMSM Motor Control
The DSPIC33EV128GM104-I/ML fits motor control because its 70 MIPS DSP engine with single-cycle multiply-accumulate executes field-oriented control loops at tens of kHz PWM frequencies with plenty of cycle margin. The 5V supply provides superior noise immunity against inverter switching transients compared to 3.3V controllers, which is why Microchip positions the dsPIC33EV family explicitly for motor control in harsh environments. In a typical BLDC drive, the DSC runs the current/speed loops, generates complementary PWM outputs with dead time, and reports status over the on-chip CAN 2.0B module to a higher-level controller. The hardware divide and barrel shifter accelerate Park/Clarke transforms. ECC Flash protects the control firmware against bit corruption from motor-generated EMI, preserving functional-safety arguments in industrial drives and e-mobility auxiliary motors.
Recommended
Automotive Body and Sensor Modules
The dsPIC33EV family was designed for automotive environments with noise and vibration, making the GM104 a natural fit for body-control nodes, sensor conditioning units, and actuator controllers. According to Microchip, the 5V 70 MIPS core with enhanced on-chip features is ideal for operating in harsh environments such as automotive applications. The integrated CAN 2.0B module connects the node directly to the vehicle network without an external CAN controller, reducing BOM cost and board area. ECC Flash maintains firmware integrity under automotive electrical stress, and the 44-QFN 8x8 mm package conserves space in compact module housings. Multiple PGECx/PGEDx pairs simplify in-circuit programming during production end-of-line flashing. Designers should select the appropriate temperature-grade suffix for under-hood versus cabin locations and verify AEC qualification level for the specific date code.
Recommended
Industrial CAN Network Nodes
For industrial automation nodes - sensor hubs, valve controllers, remote I/O - the GM104 combines a 70 MIPS real-time core with the CAN 2.0B peripheral in a single 5V-tolerant device, eliminating level-shifting and external transceiver-side logic commonly needed with 3.3V MCUs on 24V industrial panels. The 128 KB ECC Flash accommodates protocol stacks (e.g., CANopen-style application layers) plus application logic, while 8 KB RAM holds communication buffers. The DSP capability also permits local signal processing, such as vibration signature or load-current analytics, before values are published on the bus, reducing network traffic. The -40C to +85C industrial rating covers cabinet and light outdoor environments. Robust 5V I/O tolerates the noisy grounding typical of factory floors, and the exposed-pad QFN improves thermal margin in sealed enclosures with limited airflow.
Recommended
Digital Power Supplies
Digital SMPS and PFC stages benefit directly from the GM104's 70 MIPS core, which closes voltage and current loops at switching frequencies of 100 kHz and above with deterministic interrupt latency. The DSP multiply-accumulate unit implements digital compensators (Type II/III, PID) efficiently, and the 5V I/O interface matches the gate-driver domain of offline power converters, avoiding additional translation stages. The 12-bit ADC channels sample output voltage and inductor current for fast cycle-by-cycle protection implemented in software or on-chip analog comparators. ECC Flash protects the power-control firmware in equipment where a corrupted instruction could cause output overvoltage. The 44-QFN package with exposed pad dissipates the modest controller power easily, and the industrial temperature grade suits telecom rectifiers and server power shelves operating at elevated ambient temperatures.
Recommended
Appliance Control Boards
Microchip explicitly targets appliances for the dsPIC33EV family: washing machines, dishwashers, refrigeration compressors, and induction cooking all combine motor loads, user interfaces, and noisy AC-line environments that stress low-voltage electronics. The GM104's 5V-robust I/O withstands the harsh electrical noise inside appliances, while 70 MIPS supports sensorless motor algorithms (back-EMF estimation, sliding-mode observers) that run continuously without external rotor-position sensors, cutting motor cost. The 128 KB ECC Flash stores control firmware plus UI logic and fault logs; 8 KB RAM buffers touch-sensing and display tasks. The CAN module is useful in modular appliances where a main board communicates with distributed drive or sensor boards. The 44-QFN 8x8 mm footprint fits single-PCB appliance controllers, and the extended-temperature family options cover compartments near heat sources.
Recommended
Test, Measurement and Data Acquisition
The GM104 serves as a compact real-time acquisition engine: the 70 MIPS core processes ADC streams with DSP filters (FIR/IIR) on-chip, applying decimation or envelope detection before results are sent over UART/SPI/CAN to a host. The 5V core supports direct interfacing with industrial 0-5V signal ranges, simplifying front-end design for transducer inputs, and the DSP multiply-accumulate unit executes 16-bit filtering at high sample rates. ECC Flash protects calibration tables and firmware in instruments expected to hold accuracy for years. The 8 KB RAM buffers multi-channel acquisitions; the 44-QFN package fits handheld and portable instrument housings where board area is constrained. Designers should reserve a PGEC/PGED pair on a test header for field firmware updates and keep analog reference routing away from the CAN and oscillator lines for best noise performance.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV128GM104-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV256GM104-I/ML | DSPIC33EV64GM104-I/ML | DSPIC33EV128GM104-E/ML | DSPIC33EV128GM104-I/MR |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), Exposed Pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same (ML/MR both 44-pin QFN die options) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB (43K x 24) ECC | 256 KB (86K x 24) ECC | 64 KB (22K x 24) ECC | 128 KB (43K x 24) ECC | 128 KB (43K x 24) ECC |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (extended) | -40C to +85C |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
Key Differentiators
- Double the program memory in the same footprint (vs DSPIC33EV256GM104-I/ML)
- 5V-tolerant core eliminates level shifting (vs 3.3V 16-bit MCUs (e.g., DSPIC33EP64MC504-E/MV family))
- Extended temperature option on identical die (vs DSPIC33EV128GM104-E/ML)
Design Notes
Connect all VDD/VSS pin pairs with dedicated 0.1 uF ceramic decoupling capacitors placed within 2 mm of each pin pair, and solder the exposed thermal pad of the 44-QFN to a grounded copper pour with an array of thermal vias. The exposed pad is the primary ground return and thermal path for the package; omitting its solder connection will degrade noise performance and thermal dissipation, which matters most in motor-control and digital power layouts where ground bounce is high.
The dsPIC33EV128GM104 provides more than one PGECx/PGEDx programming pair. Per Microchip's ICSP connection guidance, you may use any single pair, but the pair must be used together: if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2. Route your programming header to one matched pair and do not load those pins with strong pull-ups or LEDs, which can break in-circuit debugging. Also verify that 5V logic levels are respected on all external interfaces - this is a 5V device, not 3.3V tolerant from the other direction.
Estimated: at a typical 70 MIPS workload the dsPIC33EV draws in the range of tens of mA, so junction dissipation is on the order of 0.2-0.4 W (use the datasheet ICC curves for your exact configuration). With the exposed pad soldered to a 2x2 via array into a ground plane, the effective theta_JA drops well below the no-pad case, keeping junction temperature rise modest at 85C ambient. For extended-temperature designs above 105C ambient, choose the DSPIC33EV128GM104-E/ML variant and re-verify with the datasheet thermal derating data.
Compliance Information
Current production Microchip dsPIC33EV parts are supplied lead-free/RoHS; verify certificate for the specific date code. Automotive qualification status for this exact suffix should be confirmed with Microchip.
