5CSXFC6D6F31C8N - Cyclone V SX SoC FPGA, 110K LE, Dual ARM Cortex-A9 | Intel
MPN: 5CSXFC6D6F31C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $325 | $162,500.00 |
| 1,000 | $295 | $295,000.00 |
Drop-in alternatives for 5CSXFC6D6F31C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →5CSEBA6U23C8N
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✅ Drop-In📋 Reference alternative (not in catalog)
5CSXFC6D6F31C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 110,000 |
| HPS (Hard Processor System) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| Process Technology | TSMC 28 nm low-power |
| Core Voltage | 1.1 V |
| Embedded Memory | 6.144 Mb |
| DSP Blocks | 224 (18x19 multipliers, variable precision) |
| Hard Memory Controller | DDR3 / LPDDR2 |
| PCI Express | Gen2 x4 (rootport / endpoint) |
| Package | 896-ball FBGA, 31x31 mm (F31) |
| Pin/Package Code | F31 |
| Operating Temperature | 0C to +85C (commercial) |
| Speed Grade | C8 |
| Configuration Modes | AS, PS, FPP, JTAG |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
5CSXFC6D6F31C8N f31 Pin Configuration Guide
Complete pinout information for 5CSXFC6D6F31C8N (f31 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6D6F31C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC6D6F31C8N is suitable for 7 applications: Industrial Machine Vision, Video Surveillance and Broadcast, Factory Automation Controllers, Portable Medical Imaging, Smart Grid Substation Controller, Automotive ADAS Pre-Processing, Software Defined Radio Baseband.
Industrial Machine Vision
The 5CSXFC6D6F31C8N fits industrial machine vision because the dual ARM Cortex-A9 HPS at 600 MHz can run Linux-based vision stacks (OpenCV, GStreamer) while the 110K LE FPGA fabric accelerates Bayer demosaicing, lens distortion correction, and edge detection in hardware. Per the Cyclone V datasheet, the 224 variable-precision DSP blocks enable real-time Sobel/Canny pipelines at 1080p60 with deterministic latency that a CPU alone cannot deliver. The PCI Express Gen2 x4 hard IP streams raw frames directly from a Camera Link or CoaXPress frame grabber into DDR3 memory with bandwidth headroom for multi-camera setups.
Recommended
Video Surveillance and Broadcast
The 5CSXFC6D6F31C8N is well matched to multi-channel video surveillance because the FPGA fabric implements H.264/H.265 motion estimation and deinterlacing in hardware while the HPS runs ONVIF, RTSP, and analytics middleware. The 6.144 Mb embedded SRAM acts as line buffers for 4K processing pipelines, and the hard memory controller sustains DDR3 bandwidth for compressed stream buffering. Industrial temperature variant (I7) survives outdoor NVR enclosures while the commercial C8 grade suits indoor broadcast switcher applications.
Recommended
Factory Automation Controllers
The 5CSXFC6D6F31C8N excels as a factory automation controller because the FPGA fabric implements deterministic EtherCAT, PROFINET, or EtherNet/IP slave stacks with sub-microsecond jitter, while the ARM Cortex-A9 HPS runs Codesys or LinuxPLC for high-level motion control. The 110K LE capacity accommodates 8-axis servo control loops running at 32 kHz, and the PCI Express Gen2 x4 hard IP connects to industrial PCs or vision subsystems. The F31 896-FBGA package provides enough I/O for multiple RS-485, CAN, and GPIO channels needed on the factory floor.
Recommended
Portable Medical Imaging
The 5CSXFC6D6F31C8N serves portable medical imaging devices such as handheld ultrasound or point-of-care endoscopy where the FPGA fabric runs beamforming and FIR filtering while the dual ARM Cortex-A9 HPS displays the B-mode image and manages the touchscreen UI. The 28 nm low-power process reduces battery drain compared to higher-density FPGA families, and the hard DDR3 controller handles high-bandwidth transducer data streams. The C8 commercial speed grade suffices for indoor clinical use, while the A7 automotive/AEC-Q100 variant supports mobile clinics.
Recommended
Smart Grid Substation Controller
The 5CSXFC6D6F31C8N is suited to smart-grid substation controllers because the FPGA fabric implements IEC 61850-9-2 sampled value processing and GOOSE message handling with hardware-level timestamping accuracy, while the ARM Cortex-A9 HPS runs the SCADA protocol stack and HMI. The 110K LE logic capacity fits multiple protection relay algorithms running concurrently, and the hard DDR3 controller handles wide-area measurement data buffers. Industrial temperature variants handle outdoor substation environments from -40C to +100C.
Recommended
Automotive ADAS Pre-Processing
The 5CSXFC6D6F31C8N handles automotive ADAS pre-processing where the FPGA fabric performs real-time sensor fusion on radar/lidar/ camera streams while the HPS runs the AUTOSAR-classified application software and CAN-FD vehicle networking. The A7 speed grade variant is AEC-Q100 qualified for -40C to +125C operation, making the F31 896-FBGA package a fit for ECU enclosures. The hard PCI Express Gen2 x4 IP connects to companion ADAS SoCs for higher-level perception algorithms.
Recommended
Software Defined Radio Baseband
The 5CSXFC6D6F31C8N supports software defined radio baseband designs where the FPGA fabric implements DDC/DUC, channelization filters, and digital predistortion while the dual ARM Cortex-A9 HPS runs the MAC layer and network protocol stack. Per the Cyclone V datasheet, the 224 DSP blocks deliver up to 67 GMACs of processing throughput at 18x19 precision, sufficient for LTE small-cell and private 5G baseband at TDD sub-6 GHz. The hard memory controller sustains DDR3 streams between HPS and FPGA fabric via the FPGA-to-HPS bridge.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6D6F31C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6D6F31C7N | 5CSXFC6D6F31C6N | 5CSXFC6D6F31A7N | 5CSXFC5D6F31C8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (F31, 31x31 mm) | 896-FBGA (F31, 31x31 mm) - same | 896-FBGA (F31, 31x31 mm) - same | 896-FBGA (F31, 31x31 mm) - same | 896-FBGA (F31, 31x31 mm) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | ~85,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | C8 (commercial) | C7 (commercial) | C6 (commercial) | A7 (automotive) | C8 (commercial) |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +125C (AEC-Q100) | 0C to +85C |
| Embedded Memory | 6.144 Mb | 6.144 Mb | 6.144 Mb | 6.144 Mb | [DATA_NEEDED] |
| DSP Blocks | 224 | 224 | 224 | 224 | [DATA_NEEDED] |
Key Differentiators
- Dual ARM Cortex-A9 HPS at 600 MHz integrated with 110K LE FPGA fabric (vs 5CGXFC7D7F31C8N (Cyclone V GX))
- C8 commercial speed grade offers fastest timing closure for high-throughput designs (vs 5CSXFC6D6F31C7N (C7 speed grade))
- A7 automotive speed grade variant available on identical F31 footprint (vs 5CSXFC6D6F31C8N (C8 commercial))
Design Notes
Estimated: at 110K LE utilization ~70%, 224 DSP blocks active, and dual ARM Cortex-A9 at 600 MHz, total device power typically falls between 5 W and 8 W. Plan a 1.1 V core regulator capable of 6 A continuous (e.g. LTC3612 or ISL65426), with 2.5 V/3.3 V I/O rails sequenced after core ramp. Use the Quartus Prime PowerPlay early power estimator before PCB layout to size the thermal solution.
The 896-FBGA F31 package uses 1.0 mm ball pitch and demands microvia HDI PCB technology (any-layer via or stacked via). Maintain a continuous GND reference plane directly under the BGA with at least four stitched GND vias around each signal via. Use the Cyclone V device pin connection guidelines PDF to identify all VCC/VCCPD/VCCPGM rails - missing decoupling on VCCPD causes configuration failures.
Estimated: configuration bitstream size for 110K LE with HPS enabled is roughly 30-50 Mbit, so choose an EPCQ configuration flash of at least 64 Mbit (EPCQ64 or larger). Do not omit the POR delay capacitor on nSTATUS or use a too-fast external clock on CLKUSR during AS configuration. Confirm the HPS boot source (NAND/NOR/SD/eMMC) matches the board boot switches before first power-up, as misconfiguration can lock the device without JTAG recovery.
Estimated: the F31 31x31 mm FBGA package has a theta_JA of approximately 8-10 C/W with the recommended thermal via array and bottom-side copper spreader. At 7 W typical power this yields a 56-70 C junction rise above ambient, so add a heatsink or thermal interface material for industrial designs. Use Quartus thermal advisor output to verify per-region utilization and avoid hot-spot concentration near the HPS-to-FPGA bridge.
Compliance Information
C8 grade is commercial temperature and not AEC-Q100 qualified. For AEC-Q100, choose the 5CSXFC6D6F31A7N speed grade variant. RoHS and lead-free per Intel product page; MSL Level 3 per JEDEC J-STD-020.
